JPS58153767A - 化学銅めつき浴用安定化混合物 - Google Patents

化学銅めつき浴用安定化混合物

Info

Publication number
JPS58153767A
JPS58153767A JP58025442A JP2544283A JPS58153767A JP S58153767 A JPS58153767 A JP S58153767A JP 58025442 A JP58025442 A JP 58025442A JP 2544283 A JP2544283 A JP 2544283A JP S58153767 A JPS58153767 A JP S58153767A
Authority
JP
Japan
Prior art keywords
range
bath
item
bath liquid
ppm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58025442A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0237430B2 (enExample
Inventor
フランセスコ・ト−マウロ
マウロ・ボツチ−ノ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alfachimici SpA
Original Assignee
Alfachimici SpA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alfachimici SpA filed Critical Alfachimici SpA
Publication of JPS58153767A publication Critical patent/JPS58153767A/ja
Publication of JPH0237430B2 publication Critical patent/JPH0237430B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
JP58025442A 1982-03-09 1983-02-16 化学銅めつき浴用安定化混合物 Granted JPS58153767A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IT67272-A/82 1982-03-09
IT67272/82A IT1157006B (it) 1982-03-09 1982-03-09 Miscela stabilizzante per un bagno di rame chimico

Publications (2)

Publication Number Publication Date
JPS58153767A true JPS58153767A (ja) 1983-09-12
JPH0237430B2 JPH0237430B2 (enExample) 1990-08-24

Family

ID=11301028

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58025442A Granted JPS58153767A (ja) 1982-03-09 1983-02-16 化学銅めつき浴用安定化混合物

Country Status (6)

Country Link
US (1) US4443257A (enExample)
EP (1) EP0088465B1 (enExample)
JP (1) JPS58153767A (enExample)
CA (1) CA1188056A (enExample)
DE (1) DE3364305D1 (enExample)
IT (1) IT1157006B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0726518A (ja) * 1993-01-22 1995-01-27 Nippon Kikai Kogyo Kk 防雪柵

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6070183A (ja) * 1983-09-28 1985-04-20 C Uyemura & Co Ltd 化学銅めっき方法
DE3622090C1 (enExample) * 1986-07-02 1990-02-15 Blasberg-Oberflaechentechnik Gmbh, 5650 Solingen, De
CN1679154A (zh) * 2002-05-16 2005-10-05 新加坡国立大学 晶片级无电镀铜法和凸块制备方法,以及用于半导体晶片和微芯片的渡液
US6897152B2 (en) * 2003-02-05 2005-05-24 Enthone Inc. Copper bath composition for electroless and/or electrolytic filling of vias and trenches for integrated circuit fabrication
US7750056B1 (en) 2006-10-03 2010-07-06 Sami Daoud Low-density, high r-value translucent nanocrystallites
US10660217B2 (en) * 2017-05-30 2020-05-19 Jun Yang Methods of fast fabrication of single and multilayer circuit with highly conductive interconnections without drilling

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3361580A (en) * 1963-06-18 1968-01-02 Day Company Electroless copper plating
CH490509A (de) * 1966-02-01 1970-05-15 Photocircuits Corporations Bad zum stromlosen Abscheiden von Metallschichten
US3485643A (en) * 1966-05-06 1969-12-23 Photocircuits Corp Electroless copper plating
FR1522048A (fr) * 1966-05-06 1968-04-19 Photocircuits Corp Dépôt non galvanique de métaux
BE757573A (fr) * 1969-10-16 1971-04-15 Philips Nv Depot sans courant de cuivre flexible
US4138267A (en) * 1976-12-28 1979-02-06 Okuno Chemical Industry Company, Limited Compositions for chemical copper plating

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0726518A (ja) * 1993-01-22 1995-01-27 Nippon Kikai Kogyo Kk 防雪柵

Also Published As

Publication number Publication date
US4443257A (en) 1984-04-17
CA1188056A (en) 1985-06-04
IT1157006B (it) 1987-02-11
EP0088465A1 (fr) 1983-09-14
IT8267272A0 (it) 1982-03-09
EP0088465B1 (fr) 1986-07-02
DE3364305D1 (en) 1986-08-07
JPH0237430B2 (enExample) 1990-08-24

Similar Documents

Publication Publication Date Title
US4265943A (en) Method and composition for continuous electroless copper deposition using a hypophosphite reducing agent in the presence of cobalt or nickel ions
US4374876A (en) Process for the immersion deposition of gold
KR101635661B1 (ko) 베타-아미노산 함유 전해질 및 금속 층 침착 방법
US3917885A (en) Electroless gold plating process
US4684550A (en) Electroless copper plating and bath therefor
JPH0247551B2 (enExample)
CN104040026A (zh) 不含甲醛的化学镀镀铜溶液
US3853590A (en) Electroless plating solution and process
US4830668A (en) Acidic bath for electroless deposition of gold films
JPS58153767A (ja) 化学銅めつき浴用安定化混合物
US3178311A (en) Electroless plating process
EP0133800A1 (en) Electroless copper plating solution
JPS5922738B2 (ja) 接着性のよい金属化を行なうために樹脂製表面および改良した増感を行なった樹脂製表面を中和および増感する組成物
US3326700A (en) Electroless copper plating
GB2121444A (en) Electroless gold plating
JP2004137589A (ja) 無電解金めっき液
US3728137A (en) Electroless copper plating
KR850001554B1 (ko) 구리의 무전해 도금액
US3754940A (en) Electroless plating solutions containing sulfamic acid and salts thereof
JPH02305971A (ja) ホルムアルデヒドを含まない無電解銅めっき液
CN1428456A (zh) 镀敷方法
CA1254353A (en) Aqueous alkaline bath for the chemical deposition of copper
US3748166A (en) Electroless plating process employing solutions stabilized with sulfamic acid and salts thereof
JPH0214430B2 (enExample)
JP2000309875A (ja) 置換型無電解銀めっき液