JPS58153454U - 半導体の放熱板装置 - Google Patents

半導体の放熱板装置

Info

Publication number
JPS58153454U
JPS58153454U JP4887482U JP4887482U JPS58153454U JP S58153454 U JPS58153454 U JP S58153454U JP 4887482 U JP4887482 U JP 4887482U JP 4887482 U JP4887482 U JP 4887482U JP S58153454 U JPS58153454 U JP S58153454U
Authority
JP
Japan
Prior art keywords
heat sink
sink device
semiconductor
semiconductor heat
cut
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4887482U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6228767Y2 (enExample
Inventor
雅和 熊野
Original Assignee
株式会社ユ−シン
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社ユ−シン filed Critical 株式会社ユ−シン
Priority to JP4887482U priority Critical patent/JPS58153454U/ja
Publication of JPS58153454U publication Critical patent/JPS58153454U/ja
Application granted granted Critical
Publication of JPS6228767Y2 publication Critical patent/JPS6228767Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP4887482U 1982-04-06 1982-04-06 半導体の放熱板装置 Granted JPS58153454U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4887482U JPS58153454U (ja) 1982-04-06 1982-04-06 半導体の放熱板装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4887482U JPS58153454U (ja) 1982-04-06 1982-04-06 半導体の放熱板装置

Publications (2)

Publication Number Publication Date
JPS58153454U true JPS58153454U (ja) 1983-10-14
JPS6228767Y2 JPS6228767Y2 (enExample) 1987-07-23

Family

ID=30059773

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4887482U Granted JPS58153454U (ja) 1982-04-06 1982-04-06 半導体の放熱板装置

Country Status (1)

Country Link
JP (1) JPS58153454U (enExample)

Also Published As

Publication number Publication date
JPS6228767Y2 (enExample) 1987-07-23

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