JPS58153454U - 半導体の放熱板装置 - Google Patents

半導体の放熱板装置

Info

Publication number
JPS58153454U
JPS58153454U JP4887482U JP4887482U JPS58153454U JP S58153454 U JPS58153454 U JP S58153454U JP 4887482 U JP4887482 U JP 4887482U JP 4887482 U JP4887482 U JP 4887482U JP S58153454 U JPS58153454 U JP S58153454U
Authority
JP
Japan
Prior art keywords
heat sink
sink device
semiconductor
semiconductor heat
cut
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4887482U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6228767Y2 (enrdf_load_stackoverflow
Inventor
雅和 熊野
Original Assignee
株式会社ユ−シン
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社ユ−シン filed Critical 株式会社ユ−シン
Priority to JP4887482U priority Critical patent/JPS58153454U/ja
Publication of JPS58153454U publication Critical patent/JPS58153454U/ja
Application granted granted Critical
Publication of JPS6228767Y2 publication Critical patent/JPS6228767Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP4887482U 1982-04-06 1982-04-06 半導体の放熱板装置 Granted JPS58153454U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4887482U JPS58153454U (ja) 1982-04-06 1982-04-06 半導体の放熱板装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4887482U JPS58153454U (ja) 1982-04-06 1982-04-06 半導体の放熱板装置

Publications (2)

Publication Number Publication Date
JPS58153454U true JPS58153454U (ja) 1983-10-14
JPS6228767Y2 JPS6228767Y2 (enrdf_load_stackoverflow) 1987-07-23

Family

ID=30059773

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4887482U Granted JPS58153454U (ja) 1982-04-06 1982-04-06 半導体の放熱板装置

Country Status (1)

Country Link
JP (1) JPS58153454U (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPS6228767Y2 (enrdf_load_stackoverflow) 1987-07-23

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