JPS58151039A - 混成集積回路基板 - Google Patents

混成集積回路基板

Info

Publication number
JPS58151039A
JPS58151039A JP57034301A JP3430182A JPS58151039A JP S58151039 A JPS58151039 A JP S58151039A JP 57034301 A JP57034301 A JP 57034301A JP 3430182 A JP3430182 A JP 3430182A JP S58151039 A JPS58151039 A JP S58151039A
Authority
JP
Japan
Prior art keywords
aluminum
copper
integrated circuit
hybrid integrated
copper foil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57034301A
Other languages
English (en)
Japanese (ja)
Other versions
JPH024143B2 (enExample
Inventor
Tatsuo Nakano
辰夫 中野
Kazuo Kato
和男 加藤
Shinichiro Asai
新一郎 浅井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denka Co Ltd
Original Assignee
Denki Kagaku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denki Kagaku Kogyo KK filed Critical Denki Kagaku Kogyo KK
Priority to JP57034301A priority Critical patent/JPS58151039A/ja
Publication of JPS58151039A publication Critical patent/JPS58151039A/ja
Publication of JPH024143B2 publication Critical patent/JPH024143B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by welding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
JP57034301A 1982-03-04 1982-03-04 混成集積回路基板 Granted JPS58151039A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57034301A JPS58151039A (ja) 1982-03-04 1982-03-04 混成集積回路基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57034301A JPS58151039A (ja) 1982-03-04 1982-03-04 混成集積回路基板

Publications (2)

Publication Number Publication Date
JPS58151039A true JPS58151039A (ja) 1983-09-08
JPH024143B2 JPH024143B2 (enExample) 1990-01-26

Family

ID=12410326

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57034301A Granted JPS58151039A (ja) 1982-03-04 1982-03-04 混成集積回路基板

Country Status (1)

Country Link
JP (1) JPS58151039A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63302530A (ja) * 1987-06-02 1988-12-09 Denki Kagaku Kogyo Kk 回路基板及びその混成集積回路
JPS6429885U (enExample) * 1987-08-13 1989-02-22
US7786558B2 (en) * 2005-10-20 2010-08-31 Infineon Technologies Ag Semiconductor component and methods to produce a semiconductor component

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5396667A (en) * 1977-02-04 1978-08-24 Hitachi Ltd Wire bonding method
JPS5852836A (ja) * 1981-09-24 1983-03-29 Fuji Electric Co Ltd 複合集積回路

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5396667A (en) * 1977-02-04 1978-08-24 Hitachi Ltd Wire bonding method
JPS5852836A (ja) * 1981-09-24 1983-03-29 Fuji Electric Co Ltd 複合集積回路

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63302530A (ja) * 1987-06-02 1988-12-09 Denki Kagaku Kogyo Kk 回路基板及びその混成集積回路
JPS6429885U (enExample) * 1987-08-13 1989-02-22
US7786558B2 (en) * 2005-10-20 2010-08-31 Infineon Technologies Ag Semiconductor component and methods to produce a semiconductor component

Also Published As

Publication number Publication date
JPH024143B2 (enExample) 1990-01-26

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