JPS58142534A - フイルムキヤリアボンデイング装置 - Google Patents

フイルムキヤリアボンデイング装置

Info

Publication number
JPS58142534A
JPS58142534A JP57025646A JP2564682A JPS58142534A JP S58142534 A JPS58142534 A JP S58142534A JP 57025646 A JP57025646 A JP 57025646A JP 2564682 A JP2564682 A JP 2564682A JP S58142534 A JPS58142534 A JP S58142534A
Authority
JP
Japan
Prior art keywords
film carrier
movement
axis
bonding
directions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57025646A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0123942B2 (enExample
Inventor
Hiroshi Aoyama
弘 青山
Minoru Okamura
実 岡村
Kazunori Hara
原　和徳
Yasuro Furutoku
古徳　康郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Kaijo Denki Co Ltd
Marine Instr Co Ltd
Original Assignee
NEC Corp
Kaijo Denki Co Ltd
Nippon Electric Co Ltd
Marine Instr Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Kaijo Denki Co Ltd, Nippon Electric Co Ltd, Marine Instr Co Ltd filed Critical NEC Corp
Priority to JP57025646A priority Critical patent/JPS58142534A/ja
Publication of JPS58142534A publication Critical patent/JPS58142534A/ja
Publication of JPH0123942B2 publication Critical patent/JPH0123942B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/79—Apparatus for Tape Automated Bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP57025646A 1982-02-19 1982-02-19 フイルムキヤリアボンデイング装置 Granted JPS58142534A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57025646A JPS58142534A (ja) 1982-02-19 1982-02-19 フイルムキヤリアボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57025646A JPS58142534A (ja) 1982-02-19 1982-02-19 フイルムキヤリアボンデイング装置

Publications (2)

Publication Number Publication Date
JPS58142534A true JPS58142534A (ja) 1983-08-24
JPH0123942B2 JPH0123942B2 (enExample) 1989-05-09

Family

ID=12171587

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57025646A Granted JPS58142534A (ja) 1982-02-19 1982-02-19 フイルムキヤリアボンデイング装置

Country Status (1)

Country Link
JP (1) JPS58142534A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63178324U (enExample) * 1987-05-11 1988-11-18
JPH04233245A (ja) * 1990-07-06 1992-08-21 Internatl Business Mach Corp <Ibm> 半導体チップと導体リード・フレームの検査及び位置合せのためのシステム及び方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS521067U (enExample) * 1976-06-18 1977-01-06
JPS56162846A (en) * 1980-05-20 1981-12-15 Citizen Watch Co Ltd Ic gang bonding device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS521067U (enExample) * 1976-06-18 1977-01-06
JPS56162846A (en) * 1980-05-20 1981-12-15 Citizen Watch Co Ltd Ic gang bonding device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63178324U (enExample) * 1987-05-11 1988-11-18
JPH04233245A (ja) * 1990-07-06 1992-08-21 Internatl Business Mach Corp <Ibm> 半導体チップと導体リード・フレームの検査及び位置合せのためのシステム及び方法

Also Published As

Publication number Publication date
JPH0123942B2 (enExample) 1989-05-09

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