JPS58142534A - Film carrier bonding device - Google Patents
Film carrier bonding deviceInfo
- Publication number
- JPS58142534A JPS58142534A JP57025646A JP2564682A JPS58142534A JP S58142534 A JPS58142534 A JP S58142534A JP 57025646 A JP57025646 A JP 57025646A JP 2564682 A JP2564682 A JP 2564682A JP S58142534 A JPS58142534 A JP S58142534A
- Authority
- JP
- Japan
- Prior art keywords
- film carrier
- movement
- axis
- bonding
- directions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/79—Apparatus for Tape Automated Bonding [TAB]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
Abstract
Description
【発明の詳細な説明】
本発明は、フィルムキャリアボンダーにおけるペレット
などの位置合せ装置に関するもので、構造の簡易化をは
かシ、工程の全自動化が容易に実施できるように制御系
を合理化しようとするものであゐ。[Detailed Description of the Invention] The present invention relates to a device for aligning pellets, etc. in a film carrier bonder, and aims to simplify the structure and streamline the control system so that full automation of the process can be easily implemented. That's what I mean.
従来の位置合せは、第１図に示すように、ボンディング
ツール１とフィルムキャリア２及びペレット３を載置し
たボンディングステージ４などの関係位置を、正規の位
置に合わせる際に、（５）ボンディングステージ４に対
しては、回転（角度０）・・・・・・■、Ｘ軸方向の移
動・・・・・・■、Ｙ軸方向の移動・・・・・・■、２
軸方向Ｏ移動・・・■１
但）フィルムキャリア２に対しては、Ｘ軸方向の移動・
・・・・・■、Ｙ軸方向の移動・・・・・・■、０ ボ
ンディングツールｌに対しては、Ｙ軸又はＹ軸のいづれ
か１方向の移動・・・・・・■、２軸方向の移動・・・
・・・■、
などが必要であシ、全部で駆動軸は８軸である。As shown in FIG. 1, conventional alignment involves (5) bonding stage alignment when aligning the bonding tool 1, the bonding stage 4 on which the film carrier 2, and the pellet 3 are placed, etc., to their regular positions. For 4, rotation (angle 0)...■, movement in the X-axis direction...■, movement in the Y-axis direction...■, 2
Axial direction O movement...■1 However, for film carrier 2, X-axis direction movement/
......■, Movement in the Y-axis direction......■, 0 For bonding tool l, movement in either the Y-axis or one direction of the Y-axis......■, 2 axes Movement in direction...
...■, etc. are required, and there are 8 drive axes in total.
そして位置出し作業は、カメラ（図示せず）で観察しな
がら、ボンディングツール１を基準にして、フィルムキ
ャリア２とペレット３を動かしく移動機構は図示せず）
正規の位置を決めている。この場合、それぞれの駆動軸
の構成は前記０通りであプ、フィルムキャリア２ｔ一平
面方向に移動していた為に、構造が大きくなルかつ複雑
である。またボンディングステージ４を上下方向に移動
するので、構造が大きくなると共に複雑になる。とくに
ボンディングツール１を基準にとっているから、工程の
全自動化が困難である。During the positioning process, the moving mechanism for moving the film carrier 2 and pellet 3 with respect to the bonding tool 1 is observed using a camera (not shown) (not shown).
Determining the correct position. In this case, the configuration of each drive shaft is the same as described above, and since the film carrier 2t moves in one plane direction, the structure is large and complicated. Furthermore, since the bonding stage 4 is moved in the vertical direction, the structure becomes larger and more complicated. In particular, since the bonding tool 1 is used as a standard, it is difficult to fully automate the process.
本発明は従来のこれらの欠点を除電、できるだけ駆動機
構を簡略化し、構造の小簾化を計ると共に、工程の全自
動化を容易に達成できるように、なさんとするものであ
る・
本発明の特徴は、ボンディングツールをＸ軸とＹ軸方向
および２軸方向に移動せしめる手段と、フィルムキャリ
アを２軸方向に移動せしめる手段と、ボンディングステ
ージをＸ軸とＹ軸方向に移動せしめる手段および回転せ
しめる手段を＾備し、前記フィルムキャリアを１轡とし
て、位置出しを行うように構成されたフィルムキャリア
ボンディング装置にある。The present invention eliminates static electricity, simplifies the drive mechanism as much as possible, makes the structure smaller, and makes it possible to easily achieve full automation of the process. The features include a means for moving the bonding tool in the X- and Y-axis directions and two-axis directions, a means for moving the film carrier in two-axis directions, and a means for moving and rotating the bonding stage in the X- and Y-axis directions. There is provided a film carrier bonding apparatus, comprising means for positioning the film carrier as a bag.
以下、本発明の一実施例を図面と共に説明する・８２図
は本発明実施例のフィ装置キャリアポンディング鋏置の
位置合せを説明するための部分図である。すなわち、本
実施例における位置合せは第２図に示す通シの組合せで
行い、従来と大きく異なる点は、フィルム中ヤリア２ｔ
−基準とし、フィルムキャリア２を上下方向にだけ動か
すようにしたことである。したがって、従来の駆動系と
較べてみると、ボンディングステージ４においては、上
下方向の移動が無くなシ、フィルムキャリア２において
はＸＹ軸方向の移動に代りて上下方向に動き、またボン
ディングツール１においてハ、Ｘ軸又はＹ軸の動きが追
加され、全体の駆動軸はＹ軸となｐ％従来の８軸から１
軸少〈なりている・駆動系の１軸減少、とくにフィルム
キャリア２の水平方向移動を無くしたこと社、駆動系の
簡略化に寄与し、構造が小ｍされるので極めて効果的で
あり、全体的に見ると位置の検出が容易となシ、更には
ボンディングツール１を基準として位置出しを行ってい
た場合と異なシ、全工程の自動化が容易となるなど好都
合であるＯHereinafter, one embodiment of the present invention will be described with reference to the drawings. Figure 82 is a partial view for explaining the alignment of the carrier bonding scissors of the embodiment of the present invention. That is, the alignment in this example is performed using the combination of threads shown in FIG. 2, and the major difference from the conventional method is that
- The film carrier 2 is moved only in the vertical direction based on the standard. Therefore, when compared with conventional drive systems, the bonding stage 4 does not move vertically, the film carrier 2 moves vertically instead of moving in the XY axis directions, and the bonding tool 1 moves vertically. C, X-axis or Y-axis movement has been added, and the entire drive axis is the Y-axis, p% from the conventional 8 axes to 1
Fewer axes - The reduction of one axis in the drive system, especially eliminating the horizontal movement of the film carrier 2, contributes to the simplification of the drive system and reduces the structure, which is extremely effective. Overall, it is convenient because it is easier to detect the position, and it is also easier to automate the entire process, which is different from when positioning was performed using bonding tool 1 as a reference.
纂１ａｇＩは従来のボンディング装置の位置出しの構成
、第２図は本発明実施例におけるボンディング装置の位
置出しの構成である。
なお図において、ｌ・・・・・・ボンディングツール、
２・・・・・・フィルムキャリア、３・・・・・・ペレ
ット、４・・・・・・ボンディングステージ、である。
￥：／２閏Summary 1agI shows a positioning configuration of a conventional bonding apparatus, and FIG. 2 shows a positioning configuration of a bonding apparatus according to an embodiment of the present invention. In the figure, l...bonding tool,
2...film carrier, 3...pellet, 4...bonding stage. ¥: /2 leaps
Claims (1)
移動せしめる手段と、フィルム中ヤリア會２軸方向に移
動せしめる手段と、ボンディングステージをＹ軸とＹ軸
方向に移動せしめる手段および回転せしめる手段を具備
し、前記フィルムキャリアを基準として、位置出しを行
うように構成されたことを特徴とするフィルムキャリア
ボンディング装置。Means for moving the bonding tool in the Y-axis, Y-axis direction and Z-axis direction, means for moving the bonding tool in the two-axis direction of the film, and means for moving the bonding stage in the Y-axis, Y-axis direction and rotating means. A film carrier bonding apparatus comprising: a film carrier bonding apparatus, wherein the film carrier bonding apparatus is configured to perform positioning using the film carrier as a reference.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57025646A JPS58142534A (en) | 1982-02-19 | 1982-02-19 | Film carrier bonding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57025646A JPS58142534A (en) | 1982-02-19 | 1982-02-19 | Film carrier bonding device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58142534A true JPS58142534A (en) | 1983-08-24 |
| JPH0123942B2 JPH0123942B2 (en) | 1989-05-09 |
Family
ID=12171587
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57025646A Granted JPS58142534A (en) | 1982-02-19 | 1982-02-19 | Film carrier bonding device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58142534A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63178324U (en) * | 1987-05-11 | 1988-11-18 | ||
| JPH04233245A (en) * | 1990-07-06 | 1992-08-21 | Internatl Business Mach Corp <Ibm> | System and method for inspection and alignment at semiconductor chip and conductor lead frame |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS521067U (en) * | 1976-06-18 | 1977-01-06 | ||
| JPS56162846A (en) * | 1980-05-20 | 1981-12-15 | Citizen Watch Co Ltd | Ic gang bonding device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS521067B2 (en) * | 1971-09-29 | 1977-01-12 |
-
1982
- 1982-02-19 JP JP57025646A patent/JPS58142534A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS521067U (en) * | 1976-06-18 | 1977-01-06 | ||
| JPS56162846A (en) * | 1980-05-20 | 1981-12-15 | Citizen Watch Co Ltd | Ic gang bonding device |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63178324U (en) * | 1987-05-11 | 1988-11-18 | ||
| JPH0510364Y2 (en) * | 1987-05-11 | 1993-03-15 | ||
| JPH04233245A (en) * | 1990-07-06 | 1992-08-21 | Internatl Business Mach Corp <Ibm> | System and method for inspection and alignment at semiconductor chip and conductor lead frame |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0123942B2 (en) | 1989-05-09 |
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