CN114888641B

CN114888641B - Workpiece processing method and equipment thereof

Info

Publication number: CN114888641B
Application number: CN202210599916.8A
Authority: CN
Inventors: 牛玉文; 张临平; 宗海宇; 张小宝; 刘志冠; 岳建乐
Original assignee: China National Machinery Institute Group Beijing Electromechanical Research Institute Co ltd
Current assignee: China National Machinery Institute Group Beijing Electromechanical Research Institute Co ltd
Priority date: 2022-05-26
Filing date: 2022-05-26
Publication date: 2023-08-01
Anticipated expiration: 2042-05-26
Also published as: CN114888641A

Abstract

A workpiece processing method and apparatus thereof, the workpiece having a first curved surface which is a sloped cylindrical curved surface, includes: acquiring first parameter information of a first curved surface, wherein the first parameter information comprises radius information and first axis information of the first curved surface; adjusting the machining radius of a boring cutter of the machining center according to the radius information; and adjusting the center motion track of the boring cutter according to the first axis information. Thus, the inclined cylindrical curved surface can be processed by boring. Because the boring processing speed is higher than that of milling, and the surface after boring processing is smoother than that of milling, the inclined cylindrical surface does not need polishing after boring processing. Therefore, the working efficiency of processing the inclined cylindrical surface can be improved, and the processing precision and the surface quality can be improved.

Description

Workpiece processing method and equipment thereof

Technical Field

The invention relates to the technical field of machining, in particular to a workpiece machining method and equipment thereof.

Background

In machining a workpiece, the need to machine a cylinder-inclined surface is often encountered. The common practice is to process the inclined cylindrical surface by a milling method after clamping and fixing the workpiece. Because the workpiece has high requirements on the machining precision of the inclined cylindrical surface, when the workpiece is clamped and fixed, the clamping progress requirement on the workpiece is high, generally, the clamping progress requirement cannot exceed one third of the marking tolerance, the clamping operation difficulty is high, the time and the labor are wasted, the precision requirement is not easily met, and the working efficiency is reduced. In addition, the milling method is used for processing the inclined cylindrical surface, the processing time is long, the inclined cylindrical surface is difficult to meet the requirement, the inclined cylindrical surface is required to be processed again in a manual polishing mode, the workload is increased, the working efficiency is reduced, and the processed surface has the defects of low quality and instability.

Disclosure of Invention

In view of the above problems in the prior art, the present application provides a workpiece processing method and apparatus thereof, so as to improve the working efficiency of processing a inclined cylindrical surface, and improve the processing precision and the surface quality.

A first aspect of the present application provides a workpiece processing method, where the workpiece has a first curved surface, and the first curved surface is a sloped cylindrical curved surface, including: acquiring first parameter information of the first curved surface, wherein the first parameter information comprises radius information and first axis information of the first curved surface; adjusting the machining radius of a boring cutter of a machining center according to the radius information; and adjusting the center motion track of the boring cutter according to the first axis information.

Therefore, the machining radius of the boring cutter can be adjusted according to the radius information, so that the curved surface machined by the boring cutter can reach a preset size. The center running track of the boring hanger is finely adjusted according to the first axis, so that a preset inclined cylindrical surface is formed. Thus, the inclined cylindrical curved surface can be processed by boring. Because the boring processing speed is higher than that of milling, and the surface after boring processing is smoother than that of milling, the inclined cylindrical surface does not need polishing after boring processing. Therefore, the working efficiency of processing the inclined cylindrical surface can be improved, and the processing precision and the surface quality can be improved.

As a possible implementation manner of the first aspect, the adjusting the center motion trajectory of the boring tool according to the first axis information specifically controls the center motion trajectory of the boring tool by an interpolation manner according to the first axis information.

Therefore, the center running track of the boring cutter can be controlled in an interpolation mode, so that the boring cutter is controlled to process the inclined cylindrical surface.

As a possible implementation manner of the first aspect, the first curved surface is two symmetrically arranged; the method further comprises the steps of: acquiring symmetry information of the first curved surface; and determining second axis information according to the symmetry information and the first axis information, and adjusting the center movement track of the boring cutter according to the second axis information.

From the above, the second axis information can be determined according to the symmetry information, so that the center motion track of the boring tool can be controlled according to the second axis information, and the symmetrical first curved surface can be processed. Therefore, when the symmetrical first curved surface is machined, the workpiece does not need to be clamped again, so that the clamping times are reduced, the machining time is shortened, and meanwhile, the machining precision can be improved.

As one possible implementation manner of the first aspect, the workpiece has a second curved surface, and the second curved surface is a U-shaped curved surface; the method further comprises the steps of: acquiring second parameter information of a second curved surface; and controlling a milling cutter of the machining center to machine the workpiece according to the second parameter information.

By the method, the milling cutter can be controlled to process the second curved surface according to the second parameter information, and the workpiece does not need to be clamped again, so that the clamping times are reduced, the processing time is shortened, and the processing precision can be improved.

A second aspect of the present application provides a computing device comprising a processor and a memory storing program instructions that when executed by the processor cause the processor to perform the method of any of the first aspects of the present application.

A third aspect of the present application provides a storage medium having stored thereon program instructions which, when executed by a computer, cause the computer to perform the method of any of the first aspects of the present application.

A fourth aspect of the present application provides a computer program product comprising program instructions which, when executed by a computer, cause the computer to perform the method of any of the first aspects of the present application.

These and other aspects of the invention will be apparent from and elucidated with reference to the embodiment(s) described hereinafter.

Drawings

The various features of the invention and the connections between the various features are further described below with reference to the figures. The figures are exemplary, some features are not shown in actual scale, and some features that are conventional in the art to which this application pertains and are not essential to the application may be omitted from some figures, or features that are not essential to the application may be additionally shown, and combinations of the various features shown in the figures are not meant to limit the application. In addition, throughout the specification, the same reference numerals refer to the same. The specific drawings are as follows:

FIG. 1 is a schematic view of a structure of a workpiece according to an embodiment of the present application;

FIG. 2 is a schematic view of a prior art process for machining a first curved surface;

FIG. 3 is one of the flowcharts of the workpiece processing method in the embodiment of the present application;

FIG. 4 is a schematic structural diagram of a first curved surface processed in an embodiment of the present application;

FIG. 5 is a second flowchart of a method for processing a workpiece according to an embodiment of the disclosure;

FIG. 6 is a third flowchart of a method for processing a workpiece according to an embodiment of the disclosure;

FIG. 7 is a schematic structural diagram of a second curved surface processed in an embodiment of the present application;

FIG. 8 is a flow chart of a method of machining a workpiece in an embodiment of the application;

fig. 9 is a schematic structural diagram of a computing device provided in an embodiment of the present application.

Description of the reference numerals

10 workpieces; 11 a first curved surface; 12 a second curved surface; 21 boring tool; 22 milling tools; 30 computing devices; a 31 processor; a 32 memory; 33 communication interface.

Detailed Description

The terms first, second, third, etc. or module a, module B, module C, etc. in the description and in the claims, etc. are used solely for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order, as may be appreciated, if permitted, to interchange particular orders or precedence orders to enable embodiments of the present application described herein to be implemented in orders other than those illustrated or described herein.

In the following description, reference numerals indicating steps such as S110, S120, … …, etc. do not necessarily indicate that the steps are performed in this order, and the order of the steps may be interchanged or performed simultaneously as allowed.

The term "comprising" as used in the description and claims should not be interpreted as being limited to what is listed thereafter; it does not exclude other elements or steps. Thus, it should be interpreted as specifying the presence of the stated features, integers, steps or components as referred to, but does not preclude the presence or addition of one or more other features, integers, steps or components, or groups thereof. Thus, the expression "a device comprising means a and B" should not be limited to a device consisting of only components a and B.

Reference in the specification to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the invention. Thus, appearances of the phrases "in one embodiment" or "in an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment, but may. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments as would be apparent to one of ordinary skill in the art from this disclosure.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. If there is a discrepancy, the meaning described in the present specification or the meaning obtained from the content described in the present specification is used. In addition, the terminology used herein is for the purpose of describing embodiments of the present application only and is not intended to be limiting of the present application.

For the purpose of accurately describing the technical content in the present application, and for the purpose of accurately understanding the present invention, the following explanation or definition is given for terms used in the present specification before the explanation of the specific embodiments.

Boring, wherein the cutter body rotates along the axis, and the workpiece is stationary.

Milling, directly rotating the milling cutter and processing the workpiece in a stationary mode.

First, one possible structural form of the work piece 10 in the embodiment of the present application will be exemplarily described with reference to the accompanying drawings.

Fig. 1 is a schematic structural view of a workpiece 10 according to an embodiment of the present application, and shows a specific structure of the workpiece 10 according to an embodiment of the present application. As shown in fig. 1, in the embodiment of the present application, the workpiece 10 is an armature workpiece 10, and the workpiece 10 may specifically include a first curved surface 11 and a second curved surface 12, where the second curved surface 12 is a U-shaped curved surface, and two side portions of the second curved surface 12 are symmetrically arranged about a first reference plane a as a symmetry plane. The first curved surfaces 11 are two arranged at two sides of the second curved surface 12, and the two first curved surfaces 11 are symmetrically arranged by taking the first reference surface A as a symmetrical plane. The first curved surface 11 may be specifically a cylinder-inclined surface, that is, the two ends of the axis of the first curved surface 11 are different from the first reference surface a in distance.

Fig. 2 is a schematic diagram of a prior art process for machining the first curved surface 11. As shown in fig. 2, in the prior art, when machining the first curved surface 11, it is necessary to clamp the workpiece 10 first so that the axis of the first curved surface 11 is kept horizontal, and then mill one side of the first curved surface 11 with the milling tool 22 of the machining center. After the first curved surface 11 on one side is machined, the workpiece 10 is clamped again, and then the milling cutter 22 of the machining center is used for milling the first curved surface 11 on the other side. Finally, the workpiece 10 is clamped again, and the milling tool 22 of the machining center is used for machining the second curved surface 12. Because the workpiece 10 needs to be clamped and fixed for many times in the processing process, the processing precision and the processing speed of the workpiece 10 are seriously affected, and the processing efficiency and the quality of the workpiece 10 are reduced.

Hereinafter, specific steps of the workpiece processing method 100 in the embodiment of the present application will be described in detail with reference to the accompanying drawings.

Fig. 3 is one of the flowcharts of the workpiece processing method 100 in the embodiment of the present application. As shown in fig. 3, the specific steps of the workpiece processing method 100 in the embodiment of the application include:

step S101, first parameter information is acquired.

In step S101, first parameter information of the first curved surface 11 is acquired, where the first parameter information includes radius information and first axis information of the first curved surface 11.

Step S102, adjusting the machining radius.

In step S102, the machining radius of the boring tool 21 of the machining center is adjusted according to the radius information so that the radius of the first curved surface 11 after the machining of the boring tool 21 reaches a predetermined size.

Step S103, adjusting the center motion trajectory of the boring tool 21.

In step S103, the center movement locus of the boring tool 21 is adjusted based on the first axis information, thereby forming a predetermined inclined cylindrical surface.

Fig. 4 is a schematic structural diagram of the first curved surface 11 processed in the embodiment of the present application, and as shown in fig. 4, the center motion track of the boring tool 21 is set according to the first axis information, so that the boring tool 21 moves along the first axis L.

Thus, the inclined cylindrical curved surface can be processed by boring. Because the boring processing speed is higher than that of milling, and the surface after boring processing is smoother than that of milling, the inclined cylindrical surface does not need polishing after boring processing. Therefore, the working efficiency of processing the inclined cylindrical surface can be improved, and the processing precision and the surface quality can be improved.

Further, in step S103, specifically, the center motion track of the boring tool 21 is controlled by interpolation according to the first axis information, that is, the center motion track of the boring tool 21 is controlled to approach the first axis L by adopting a fold line manner, so as to control the boring tool 21 to process the inclined cylindrical surface.

Fig. 5 is a second flowchart of a workpiece processing method 100 according to an embodiment of the present application. As shown in fig. 5, the specific steps of the workpiece processing method 100 in the embodiment of the application may further include:

step S104, symmetry information is acquired.

In step S104, symmetry information of the first curved surface 11 is acquired, and the symmetry information may include, for example, position coordinate information of the first reference surface a, distance and angle information between the first axis L and the first reference surface a, and the like.

Step S105, determining second axis information.

In step S105, second axis information is determined from the symmetry information and the first axis information. Specifically, the position coordinate information of the two end points of the second axis P is determined according to the position coordinate information of the first reference plane a and the position coordinate information of the two end points of the first axis L.

Step S106, the center motion track of the boring cutter 21 is adjusted.

In step S106, the center movement locus of the boring tool 21 is adjusted according to the second axis information, and the boring tool 21 is controlled to move along the second axis P.

Thereby, the center movement locus of the boring tool 21 can be controlled based on the second axis information, so that the symmetrical first curved surface 11 can be machined. Therefore, when the symmetrical first curved surface 11 is machined, the workpiece 10 does not need to be clamped again, so that the clamping times are reduced, the machining time is shortened, and meanwhile, the machining precision can be improved.

FIG. 6 is a third flowchart of a method 100 for processing a workpiece according to an embodiment of the disclosure; fig. 7 is a schematic structural diagram of the second curved surface 12 processed in the embodiment of the present application. As shown in fig. 6 and 7, specific steps of the workpiece processing method 100 in the embodiment of the application may further include:

step S107, second parameter information is acquired.

In step S107, second parameter information of the second curved surface 12 is acquired, and the second parameter information is processing information of the second curved surface 12.

Step S108, milling the workpiece 10.

In step S109, the milling tool 22 of the machining center is controlled to machine the workpiece 10 according to the second parameter information.

By the above, the milling cutter 22 can be controlled to process the second curved surface 12 according to the second parameter information, and the workpiece 10 does not need to be clamped again, so that the clamping times are reduced, the processing time is shortened, and the processing precision can be improved.

Hereinafter, specific steps of the workpiece processing method 100 in the embodiment of the present application will be described in detail with reference to specific embodiments.

In the present embodiment, the workpiece 10 is processed using a processing center, which may be, for example, a triaxial processing center. The movable end of the machining center is provided with a boring device, the movable end is the end of a triaxial (x-axis, y-axis and z-axis) movable wall, and the machining center boring device comprises a vertically rotating tool carrier and a boring tool 21 with the end extending horizontally.

Fig. 8 is a flow chart of a method 200 for machining a workpiece in an embodiment of the application. As shown in fig. 8, a specific flow of the processing method 200 in the embodiment of the present application includes:

step S201, adjusting the boring tool 21.

In step S201, the boring tool 21 is assembled according to the radius of the first curved surface 11 such that the end of the boring tool 21 is spaced from the center of the body of the boring tool 21, i.e., the radius of rotation, the same as the radius of the first curved surface 11.

Step S202, determining a center motion track.

In step S202, a center movement locus of the boring tool 21 when machining the first curved surface 11 on the side is determined based on the first axis information. The second axis information is determined based on the symmetry information, and the center movement locus of the boring tool 21 when machining the first curved surface 11 on the other side is determined based on the second axis information.

Step S203, clamping and fixing the workpiece 10.

In step S203, the workpiece 10 is clamped and fixed so that the workpiece 10 is positioned at a position to be machined in the machining center and the boring tool 21 is positioned at a predetermined position.

Step S204, processing the first curved surface 11.

In step S204, the boring device is started, the main body of the boring tool 21 rotates, and the machining center controls the linear interpolation (i.e., the obliquely downward movement) of the Z axis and the X axis, so that the boring tool 21 machines the first curved surface 11 of the workpiece 10 along the center movement locus.

Step S205, machining the second curved surface 12.

In step S205, the machining center is controlled to switch the milling tool 22 to mill the second curved surface 12.

Fig. 9 is a schematic structural diagram of a computing device 30 provided in an embodiment of the present application. The computing device 30 includes: a processor 31, a memory 32, a communication interface 33.

It should be appreciated that the communication interface 33 in the computing device 30 shown in fig. 9 may be used to communicate with other devices.

Wherein the processor 31 may be connected to a memory 32. The memory 32 may be used to store the program code and data. Accordingly, the memory 32 may be a storage unit inside the processor 31, an external storage unit independent of the processor 31, or a component including a storage unit inside the processor 31 and an external storage unit independent of the processor 31.

It should be appreciated that in the present embodiment, the processor 31 may employ a central processing unit (central processing unit, CPU). The processor may also be other general purpose processors, digital signal processors (digital signal processor, DSP), application specific integrated circuits (application specific integrated circuit, ASIC), field programmable gate arrays (field programmable gate Array, FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, or the like. A general purpose processor may be a microprocessor or the processor may be any conventional processor or the like. Or the processor 31 may employ one or more integrated circuits for executing associated programs to carry out the techniques provided in embodiments of the present application.

The memory 32 may include read only memory and random access memory and provides instructions and data to the processor 31. A portion of the processor 31 may also include non-volatile random access memory. For example, the processor 31 may also store information of the device type.

When the computing device 30 is running, the processor 31 executes computer-executable instructions in the memory 32 to perform the operational steps of the method described above.

It should be understood that the computing device 30 according to the embodiments of the present application may correspond to a respective subject performing the methods according to the embodiments of the present application, and that the above and other operations and/or functions of the respective modules in the computing device 30 are respectively for implementing the respective flows of the methods of the embodiments, and are not described herein for brevity.

Those of ordinary skill in the art will appreciate that the various illustrative elements and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware, or combinations of computer software and electronic hardware. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the solution. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present application.

It will be clear to those skilled in the art that, for convenience and brevity of description, specific working procedures of the above-described systems, apparatuses and units may refer to corresponding procedures in the foregoing method embodiments, and are not repeated herein.

In the several embodiments provided in this application, it should be understood that the disclosed systems, devices, and methods may be implemented in other manners. For example, the apparatus embodiments described above are merely illustrative, e.g., the division of the units is merely a logical function division, and there may be additional divisions when actually implemented, e.g., multiple units or components may be combined or integrated into another system, or some features may be omitted or not performed. Alternatively, the coupling or direct coupling or communication connection shown or discussed with each other may be an indirect coupling or communication connection via some interfaces, devices or units, which may be in electrical, mechanical or other form.

The units described as separate units may or may not be physically separate, and units shown as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

In addition, each functional unit in each embodiment of the present application may be integrated in one processing unit, or each unit may exist alone physically, or two or more units may be integrated in one unit.

The functions, if implemented in the form of software functional units and sold or used as a stand-alone product, may be stored in a computer-readable storage medium. Based on such understanding, the technical solution of the present application may be embodied essentially or in a part contributing to the prior art or in a part of the technical solution, in the form of a software product stored in a storage medium, including several instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the methods described in the embodiments of the present application. And the aforementioned storage medium includes: a U-disk, a removable hard disk, a Read-Only Memory (ROM), a random access Memory (Random Access Memory, RAM), a magnetic disk, or an optical disk, or other various media capable of storing program codes.

The embodiments of the present application also provide a computer-readable storage medium having stored thereon a computer program for executing a diversified problem generating method when executed by a processor, the method comprising at least one of the aspects described in the respective embodiments above.

Any combination of one or more computer readable media may be employed as the computer storage media of the embodiments herein. The computer readable medium may be a computer readable signal medium or a computer readable storage medium. The computer readable storage medium can be, for example, but not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or a combination of any of the foregoing. More specific examples (a non-exhaustive list) of the computer-readable storage medium would include the following: an electrical connection having one or more wires, a portable computer diskette, a hard disk, a Random Access Memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disc read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing. In this document, a computer readable storage medium may be any tangible medium that can contain, or store a program for use by or in connection with an instruction execution system, apparatus, or device.

The computer readable signal medium may include a propagated data signal with computer readable program code embodied therein, either in baseband or as part of a carrier wave. Such a propagated data signal may take any of a variety of forms, including, but not limited to, electro-magnetic, optical, or any suitable combination of the foregoing. A computer readable signal medium may also be any computer readable medium that is not a computer readable storage medium and that can communicate, propagate, or transport a program for use by or in connection with an instruction execution system, apparatus, or device.

Program code embodied on a computer readable medium may be transmitted using any appropriate medium, including but not limited to wireless, wireline, optical fiber cable, RF, etc., or any suitable combination of the foregoing.

Computer program code for carrying out operations of the present application may be written in one or more programming languages, including an object oriented programming language such as Java, smalltalk, C ++ and conventional procedural programming languages, such as the "C" programming language or similar programming languages. The program code may execute entirely on the user's computer, partly on the user's computer, as a stand-alone software package, partly on the user's computer and partly on a remote computer or entirely on the remote computer or server. In the case of a remote computer, the remote computer may be connected to the user's computer through any kind of network, including a Local Area Network (LAN) or a Wide Area Network (WAN), or may be connected to an external computer (for example, through the Internet using an Internet service provider).

Note that the above is only the preferred embodiments of the present application and the technical principles applied. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, while the present application has been described in connection with the above embodiments, the present invention is not limited to the above embodiments, but may include many other equivalent embodiments without departing from the spirit of the present invention, and the present invention is also within the scope of protection.

Claims

1. The workpiece processing method comprises a first curved surface and a second curved surface, wherein the first curved surface is a sloped cylindrical curved surface, the first curved surfaces are two symmetrically arranged, and the second curved surface is a U-shaped curved surface, and the workpiece processing method is characterized by comprising the following steps:

acquiring first parameter information of the first curved surface, wherein the first parameter information comprises radius information and first axis information of the first curved surface;

adjusting the machining radius of a boring cutter of a machining center according to the radius information;

adjusting the center motion track of the boring cutter according to the first axis information to enable the boring cutter to move along a first axis L; specifically, the center motion track of the boring cutter is controlled in an interpolation mode according to the first axis information;

acquiring symmetry information of the first curved surface;

determining second axis information according to the symmetry information and the first axis information, and adjusting the center movement track of the boring cutter according to the second axis information so that the boring cutter moves along a second axis P;

acquiring second parameter information of a second curved surface;

and controlling a milling cutter of the machining center to machine the workpiece according to the second parameter information.

2. A computing device, comprising a processor and a memory,

the memory stores program instructions that, when executed by the processor, cause the processor to perform the method of claim 1.

3. A storage medium having stored thereon program instructions which, when executed by a computer, cause the computer to perform the method of claim 1.

4. A computer program product comprising program instructions which, when executed by a computer, cause the computer to perform the method of claim 1.