JPS58141A - 自動インナ−リ−ドボンデイング方法 - Google Patents

自動インナ−リ−ドボンデイング方法

Info

Publication number
JPS58141A
JPS58141A JP56098710A JP9871081A JPS58141A JP S58141 A JPS58141 A JP S58141A JP 56098710 A JP56098710 A JP 56098710A JP 9871081 A JP9871081 A JP 9871081A JP S58141 A JPS58141 A JP S58141A
Authority
JP
Japan
Prior art keywords
inner lead
bonding
die
carrier tape
deviation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56098710A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6255298B2 (enExample
Inventor
Akihiro Nishimura
明浩 西村
Seiichi Chiba
誠一 千葉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP56098710A priority Critical patent/JPS58141A/ja
Publication of JPS58141A publication Critical patent/JPS58141A/ja
Publication of JPS6255298B2 publication Critical patent/JPS6255298B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/79—Apparatus for Tape Automated Bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP56098710A 1981-06-25 1981-06-25 自動インナ−リ−ドボンデイング方法 Granted JPS58141A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56098710A JPS58141A (ja) 1981-06-25 1981-06-25 自動インナ−リ−ドボンデイング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56098710A JPS58141A (ja) 1981-06-25 1981-06-25 自動インナ−リ−ドボンデイング方法

Publications (2)

Publication Number Publication Date
JPS58141A true JPS58141A (ja) 1983-01-05
JPS6255298B2 JPS6255298B2 (enExample) 1987-11-19

Family

ID=14227063

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56098710A Granted JPS58141A (ja) 1981-06-25 1981-06-25 自動インナ−リ−ドボンデイング方法

Country Status (1)

Country Link
JP (1) JPS58141A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60121733A (ja) * 1984-07-31 1985-06-29 Shinkawa Ltd インナ−リ−ドボンダ−
JPH01206637A (ja) * 1988-02-13 1989-08-18 Shinkawa Ltd Ｘｙ駆動機構

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60121733A (ja) * 1984-07-31 1985-06-29 Shinkawa Ltd インナ−リ−ドボンダ−
JPH01206637A (ja) * 1988-02-13 1989-08-18 Shinkawa Ltd Ｘｙ駆動機構

Also Published As

Publication number Publication date
JPS6255298B2 (enExample) 1987-11-19

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