JPS58140280A - Manufacture of thermal printer head - Google Patents
Manufacture of thermal printer headInfo
- Publication number
- JPS58140280A JPS58140280A JP58002586A JP258683A JPS58140280A JP S58140280 A JPS58140280 A JP S58140280A JP 58002586 A JP58002586 A JP 58002586A JP 258683 A JP258683 A JP 258683A JP S58140280 A JPS58140280 A JP S58140280A
- Authority
- JP
- Japan
- Prior art keywords
- thermal printer
- paste
- glaze layer
- layer
- printer head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/345—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads characterised by the arrangement of resistors or conductors
Landscapes
- Electronic Switches (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Non-Adjustable Resistors (AREA)
Abstract
Description
【発明の詳細な説明】
この発明はサーマルlプリンタヘッドの製造法に関する
う
この柿ヘッドにお−で一高熱伝導性の基板の表面一部分
にガラスグレーズ層を形成する構成はよく知Il−わて
いAつ前記グレーズ層の形成は厚膜印刷μ同じ印刷法を
使用するのが普通であるが、このグレーズ層の表面は極
力平坦であることが・+/、、 U3゛である。第1図
は従来のヘッドの平面図を示ゴ゛もので、1けセラミッ
クなどの基板、2σガラスグレ一ズ層、3け抵抗発熱素
子であるうなお図(第2M以降の図をも含む。)でけ抵
抗発熱素子への通I11のためのへ一線は省略1.であ
る。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a thermal printer head. The formation of the glaze layer is usually done using the same printing method as thick film printing, but the surface of this glaze layer should be as flat as possible. FIG. 1 shows a plan view of a conventional head, which includes a single-digit ceramic substrate, a 2σ glass glazing layer, and a three-digit resistance heating element (including figures 2M and subsequent figures). ) The line for connecting I11 to the resistive heating element is omitted 1. It is.
このヘッドを製作するにあたって前述1.たよりに基板
lの表面にグレーズM2を形成するべくそのベースFを
基板表面に印刷焼成すると焼成後周縁が盛わ上がね一中
央の平坦部よりも]O〜]5μ程厚くなふことが知ki
ている。もつともこの盛り土がりは、印刷部分の幅を約
25朋1刃−[・にす、イ、左、はとんど生じないので
−々レーズ廟2の幅をこの@JFにすわばその左右周縁
は中央の平H1部^同じ厚みとなるが、グレーズ層2の
侵さを25酊以下にすることがfき々I/−II−1そ
の17下θ)周縁・l/l’図のように盛hヒが6部2
Aが形成さ・ねるようになる。ところがこのような盛ね
上がり部2Aが残ったまま使用すると、プリントする際
、盛h+−カb部2Aが邪魔1て抵抗発熱素子の表面が
1^酷組−に接触!、に〈〈なって鮮明なプリントがで
きなくなる。こhを確実に接触させようとするには、ヘ
ッドの感熱紙に対する押「F力を高めなけ相ばなちな(
ハ。In manufacturing this head, the above-mentioned 1. In order to form a glaze M2 on the surface of the substrate 1, when the base F is printed and fired on the surface of the substrate 1, the periphery becomes raised after firing and becomes about 5μ thicker than the flat part in the center of the top. Knowledge
ing. Of course, the width of this mound is about 25mm wide, so if you change the width of Reze Mausoleum 2 to this @JF, it will be the left and right edges. is the same thickness as the central flat H1 part, but it is necessary to make the erosion of the glaze layer 2 less than 25mm. Sei hhi ga 6 part 2
A begins to form and curl. However, if you use the raised part 2A with such a raised part 2A remaining, the raised part 2A will get in the way when printing, and the surface of the resistance heating element will come into contact with the 1^ rough assembly! , and it becomes impossible to print clearly. In order to ensure contact with the heat-sensitive paper, it is necessary to increase the F force of the head against the thermal paper.
Ha.
このようなグレーズ層の盛れ十がね部をグレーズ層の子
端Mνr形成されないように製作する方法が木発明者V
よって別に提案さhた。こhを第3図、第41♂によっ
て説、明すると、高熱伝導性(たとえばア4/ミナのよ
うなセラミック)の基illの表面に部分的VCペース
トを印刷することによってガラスグレーズ層12を形成
する。その表面に抵抗発熱素子]3を形成する。トころ
でこのグレーズ層12の形成のためのペースト印刷時に
、基板11の一端を延長【7て延長部11Aと11.こ
こに〃゛レー1層12 J−1,て必要な長さよね延長
lて印刷する。このj+l侵部工部12′焼成後盛り上
がわ部12.Aが形成さfすることid′賓易に理解さ
れる。The inventor V has proposed a method of manufacturing such a bulge portion of the glaze layer so that the terminal end Mνr of the glaze layer is not formed.
Therefore, I made a separate proposal. 3 and 41, the glass glaze layer 12 is formed by printing a partial VC paste on the surface of a substrate of high thermal conductivity (eg, ceramic such as A4/Mina) Form. A resistance heating element] 3 is formed on the surface thereof. When printing the paste for forming the glaze layer 12, one end of the substrate 11 is extended [7] with the extension portion 11A and 11. Here, print one layer of 12 J-1 and extend it to the required length. This j+l encroachment part 12' is a raised part 12 after firing. It is easily understood that A is formed.
そのあとこの延し部12をブレークする。こ引によって
残ったブレース°胎12にはその上端に盛り十がh部]
2 A ir、−1ωII−残I−な(八ようになる
。この状態を示したのが第5図である。After that, this extended portion 12 is broken. The brace left by the pulling process 12 has a bulge at its upper end.
2 A ir, -1 ω II - remainder I - (8). This state is shown in Fig. 5.
ブレークを容易にするために、基板コ1の表面にあらか
じめスナップライン]4をほどこしておくとよ因。この
場合、グレーズ層のためのペーストを印刷また後焼成時
にそのペーストがスナップラインに沿って清・ね出て−
スナップラインを埋めてしまうことがあるシ、あとでブ
レーク11.にくくなることがあるうこ引を避けるため
に基板」1の裏面にもI目りようにスリーツブライン1
4 A H−!t トこしておくと、ブレークは容易と
なる、なお裏面にスナップライン14Aをほどこ17た
場合は、表面のスナップライン14filして本よll
)。In order to make the break easier, it is a good idea to create a snap line 4 on the surface of the board 1 in advance. In this case, the paste for the glaze layer is printed, and during post-baking, the paste swells out along the snap lines.
Sometimes you bury the snap line, then break later 11. In order to avoid lining that may become difficult, place sleeve brine 1 on the back side of the board 1 so that there is an I mark.
4 A H-! If you apply the snap line 14A on the back, it will be easier to break.
).
ところで上記した製造法にょ引ば、延長部]、lAは破
棄されるの′″r″−r″−無駄経済的でな1b。By the way, according to the above-mentioned manufacturing method, the extension part 1A is discarded, which is wasteful and economical.
どの発明−°、破棄される部分をなくすことによって上
端に盛hJ:がゎ部のないガラスグレーズ層を有するサ
ーマフレプリンタヘッドの製造法全提案するこシを目的
とする。The object of the present invention is to propose a method for manufacturing a thermal photoreprinter head having a glass glaze layer without a glaze on the upper end by eliminating discarded parts.
この発明の実施例を第6図、第7図によって説明する。An embodiment of this invention will be explained with reference to FIGS. 6 and 7.
なお第3図、フ1.41りと同じ符号を附;た部分は同
−又は対応する部分を示す。第6図、第7図か乙班解さ
れるように、ひとつの基板21Aと、その上端fつちな
る仙の基板21Bとか医なる2個分の基板21が用意さ
れる。すなわちこ引を第3図と比較1′#場合、基板1
1け基板21Aに、延長部11Aは基板11Bに対応す
ることになる。争1て一基板21A、2!1B の境界
にスナップライン14ヲ形成する。グレーズ層]2のた
めのペーストラスナツプライン]4をまたいで印刷lて
焼成するうこのふき、グレーズ層12の上端と下端J−
F盛り上がり部分1.2Aが形成さhることになる。こ
のあと、スナップライン14≠\医基板21をブレーク
!、て部分する。こhによりば、−膚に2個のヘッドが
製作できるとともに得I−れた一基板21△、21B
土のグレーズ層は第5図と同じく上端に盛わ士がね部分
に何らなりものとなる。なお−13△、131−1 は
各ヘッド用の抵抗@熱素子である。In addition, parts with the same reference numerals as in FIG. 3 and F1.41 indicate the same or corresponding parts. As can be seen in FIGS. 6 and 7, two substrates 21 are prepared, such as one substrate 21A and a substrate 21B, which is the upper end of the substrate 21A. In other words, when comparing the drawing with Figure 3, if 1'#, the board 1
The extension portion 11A corresponds to the substrate 11B. First, a snap line 14 is formed at the boundary between the substrates 21A and 2!1B. Paste lath nut line for glaze layer] 2] Print and bake across 4, the upper and lower ends of glaze layer 12
A raised portion 1.2A will be formed. After this, break snap line 14≠\medical board 21! , part. According to this, two heads can be manufactured on the skin and one substrate 21Δ, 21B obtained.
As in Figure 5, the soil glaze layer is raised at the top and has some form on the shingle area. Note that -13Δ and 131-1 are resistors for each head @thermal element.
なおグレーズ層]2の幅はその左右周縁に焼成後に盛り
上が11部が牛しない程度の幅とする。このようにする
こμによって−盛り土がね部がグレーズ層の上端と下端
とのみに生ずるようになるう実1際この種ヘッドは−1
Cチップと同じように4数を一摩にIJI9作する。そ
こで基板の表面に縦横方向に又は縦方向にスリーツブラ
インを−ヌ裏面にスナップラインコ4Afはどこ11.
てがち%−Hvに向かい合う2個のヘッドを対と12、
その両方にまたがって第6図のようにブレ1ズ層のため
のペース) ’r 印Jiltl していけばよい。こ
の場合スナップラインを弧状の溝に1.ておくと、ブレ
ーク後に得ちhるヘッドの周縁は弧状となるうこのよう
に弧状になっていると、プリント時ヘッドが仮hrtt
a斜してその周縁が感熱紙に接触1.たとしても、感熱
紙が送hKよって#動するとき周縁が感熱紙表面をけづ
わとるようなことがなくなって都合がよlA。Note that the width of the glaze layer 2 is such that the raised 11 parts do not form on the left and right edges after firing. By doing this in this way, the bulge will form only at the top and bottom of the glaze layer.
Just like the C chip, make 4 numbers in one stroke to create 9 IJIs. Therefore, place sleeve lines on the front surface of the board in the vertical and horizontal directions or in the vertical direction.
Two heads facing each other in %-Hv as a pair and 12,
All you have to do is straddle both of them and do the pace for the blended layer as shown in Figure 6. In this case, place the snap line in the arcuate groove 1. If you keep this in mind, the periphery of the head obtained after the break will be in an arc shape.
a diagonally and its periphery touches the thermal paper 1. Even so, it is convenient because when the thermal paper is moved by the feed hK, the peripheral edge does not scratch the surface of the thermal paper.
第5図か1も輝解さ引るように−グレーズ層]2の下端
の盛ね上がり部分は解消さhないが、へパ・ドに相対す
るプラテンがこの残った盛り十が)) ’flits分
とは向かい合わないようにすわば、プリント時に何1邪
魔にならない存在シなる、
以上詳述またようにと−の発明によ名ば、グレーズ層の
形成の際に牛する盛り上がh部分がグレーズ層の上端に
も・いて存在しないヘッドが得ら名るようになり、と引
によって鮮明なプリントが可能となるふともν(、一度
V2個分のヘッドが得ら引るようになる11、炉に破棄
−する部分がないので極めて経済的であるといった効果
を奏する。As shown in Figure 5, the bulge at the bottom of the glaze layer 2 has not been removed, but the platen facing the hepa-do has this remaining bulge. If you do not face the glaze layer, it will not get in the way at all during printing. The head that does not exist is also obtained at the top of the glaze layer, and the head that does not exist is obtained by pulling it. 11. Since there is no part to be discarded in the furnace, it is extremely economical.
第1図は従来例の平面図、第2図は同側断面図、第3図
はこの発明の基本的な製造法を船団するための平面M−
第4図は同側断面図−第5図はブレ、−り後の側断面1
′;A、第6図はとの発明の詳細な説明するための平面
1ン1、第7菌は同倶I断面図である。
21A、2]1−(・、・私板、]2..・3.グレー
ズ層、12A・・・・盛り+が6部、14 ・・・・境
界となるスナップライン
特許出願人 ローム株式会社
代」(0人中沢謹之助
〜〜へ\Fig. 1 is a plan view of the conventional example, Fig. 2 is a sectional view of the same side, and Fig. 3 is a plane M-
Fig. 4 is a sectional view of the same side - Fig. 5 is a sectional view of the side after blurring - 1
';A, Figure 6 is a cross-sectional view of plane 1-1 and 7th bacterium I for detailed explanation of the invention. 21A, 2] 1-(...Private board,] 2...3. Glaze layer, 12A...6 parts of fill +, 14...Boundary snap line Patent applicant ROHM Co., Ltd. ``(0 people) Kinnosuke Nakazawa~~\
Claims (2)
て、焼成後に左右周縁に盛ね上が杓が牛l;ない程度の
幅をもってガラスゲレーズ層のためのペーストを印刷焼
成j、その焼成後に前記両基板の境界をブレークlてな
るサーマルプ++”Jiへゝソドの製造法9(1) Spread the paste for the glass gelase layer across the substrate and another substrate at one end, and after baking, print and bake the paste for the glass gelatin layer with a width that is not too thick on the left and right edges. Method 9 for manufacturing a thermal paste that breaks the boundary between the two substrates after firing
インを形成1てなる特許請求の範囲第1項記載のサーマ
ルプリンタヘッドの製造法。(2) A method for manufacturing a thermal printer head according to claim 1, which comprises forming snap lines for breaking on the front and back surfaces of the boundary between both substrates.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58002586A JPS58140280A (en) | 1983-01-10 | 1983-01-10 | Manufacture of thermal printer head |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58002586A JPS58140280A (en) | 1983-01-10 | 1983-01-10 | Manufacture of thermal printer head |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12355679A Division JPS5646777A (en) | 1979-09-26 | 1979-09-26 | Manufacture for thermal printer head |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58140280A true JPS58140280A (en) | 1983-08-19 |
JPS614668B2 JPS614668B2 (en) | 1986-02-12 |
Family
ID=11533475
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP58002586A Granted JPS58140280A (en) | 1983-01-10 | 1983-01-10 | Manufacture of thermal printer head |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58140280A (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62189769U (en) * | 1986-05-24 | 1987-12-02 |
-
1983
- 1983-01-10 JP JP58002586A patent/JPS58140280A/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS614668B2 (en) | 1986-02-12 |
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