JPH0238063A - Thermal head - Google Patents
Thermal headInfo
- Publication number
- JPH0238063A JPH0238063A JP18940888A JP18940888A JPH0238063A JP H0238063 A JPH0238063 A JP H0238063A JP 18940888 A JP18940888 A JP 18940888A JP 18940888 A JP18940888 A JP 18940888A JP H0238063 A JPH0238063 A JP H0238063A
- Authority
- JP
- Japan
- Prior art keywords
- heating resistor
- lead electrodes
- insulating
- width
- thermal head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims abstract description 45
- 239000000758 substrate Substances 0.000 claims abstract description 15
- 239000011521 glass Substances 0.000 abstract description 13
- 230000001681 protective effect Effects 0.000 abstract description 9
- 238000007639 printing Methods 0.000 abstract description 4
- 238000007650 screen-printing Methods 0.000 abstract description 2
- 239000010408 film Substances 0.000 description 13
- 238000010586 diagram Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 239000010931 gold Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 241000257465 Echinoidea Species 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 241001092070 Eriobotrya Species 0.000 description 1
- 235000009008 Eriobotrya japonica Nutrition 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- YBCAZPLXEGKKFM-UHFFFAOYSA-K ruthenium(iii) chloride Chemical compound [Cl-].[Cl-].[Cl-].[Ru+3] YBCAZPLXEGKKFM-UHFFFAOYSA-K 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/345—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads characterised by the arrangement of resistors or conductors
Landscapes
- Electronic Switches (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野］
この発明は、ファクシミリやプリンター等の記録装置に
使用するサーマルヘッドに係るもので、特に絶縁基板上
に百緑状に発熱抵抗体ケ配列し、この上面に感熱記鎌紙
を接触させ、発熱抵抗体の選択的加熱にエリ記録するサ
ーマルヘッドの発熱基板に関するものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a thermal head used in recording devices such as facsimiles and printers, and particularly relates to a thermal head in which heating resistors are arranged in a circular pattern on an insulating substrate. This invention relates to a heat-generating substrate of a thermal head, in which heat-sensitive recording paper is brought into contact with the upper surface of the heat-sensitive substrate, and recording is performed by selectively heating a heat-generating resistor.
第６図、第７図は例えば特開昭ｆｉ４−１１０８４８号
公報にある従来のサーマルヘッドの発熱基板間を示す図
で、第６図は断面図、第７図は平面図を示す。図に２い
て、ｒｔ） ｉｄセラミックなどの絶縁基板、＋２１ｉ
”ｔクレー、（層、 ＋３）ｄ ＩＪ −トｌ［ｆｆｌ
テ＜ ｔ、型状をなすコモンリード成極（３ａ）と、
直緑状の七しクトリード電極（３ｂ）と？交互に複数個
対向配置することに、、ｃ９構成されている。（４）？
′ｉ発熱抵抗体で断面が凸状に形成されている。（５）
は保護膜カラスで上面は上記発熱抵抗体＋４）の形状を
倣い凸状となっている０な２、この発熱抵抗体（４）の
幅寸法（Ｌ）は０．２ｍｍ程度が一般的に用いられてい
る。6 and 7 are diagrams showing the space between the heat generating boards of a conventional thermal head disclosed in, for example, Japanese Patent Application Laid-open No. 110848/1984, with FIG. 6 showing a sectional view and FIG. 7 showing a plan view. Insulating substrate such as id ceramic, +21i
”t clay, (layer, +3)d IJ -tl[ffl
Te < t, common lead polarization (3a) forming a shape,
The straight green seven lead electrodes (3b)? C9 is configured by arranging a plurality of them alternately and facing each other. (4)?
'i The heating resistor has a convex cross section. (5)
is a protective film glass whose upper surface is convex following the shape of the heating resistor (4) above.The width dimension (L) of this heating resistor (4) is generally about 0.2 mm. It is being
次に、この発熱基板間の製作法り一工び動作を説明丁、
ｂ 。Next, we will explain the manufacturing method and operation between this heat generating board.
b.
第６図、第７図に２いて、絶縁基板（１）の上に、ガラ
ス材料等で構成されたグレーズ層（２）を印刷し、こ゛
のグレーズ層（２）の上に、Ａｕ （金）等の導体ペー
スト金印刷、焼成しリード１を極（３）を形成する。次
にＲｕｎｇ （１！１！化ルテニウム）等を主成分とす
る抵抗ペーストを印刷、焼成し、（Ｌ）なる幅をもつ発
熱抵抗体〈４）全形成する。次にＡｌ３２０Ｂ 、 ５
ｉｎ２等を主成分とするガラスペーストを発熱抵抗体（
４）ヲ覆うＬうに印刷、焼成し、保護膜ガラス（５＞
１−形成する。6 and 7, a glaze layer (2) made of glass material or the like is printed on an insulating substrate (1), and Au (gold) is printed on this glaze layer (2). ) etc. is printed with gold conductor paste and fired to form the lead 1 and the pole (3). Next, a resistor paste containing Rung (1!1! ruthenium chloride) as a main component is printed and fired to completely form a heating resistor (4) having a width of (L). Next, Al320B, 5
A heating resistor (
4) Print and bake the L sea urchin to cover the protective film glass (5>
1- form.
以上の工うにして製作され友サーマルヘッドの感熱基板
間は、コモンリード電極（蕊）に電圧を印加し、セレク
トリード電極（：（ｂ）を選択的にＯＮ −０ＦＦする
ことにエリ、発熱抵抗体（４）は例えば、第７図の斜線
部に示す発熱素子（４ａ）が発熱する。この発熱素子（
４ａ）の発熱は上部の保護膜ガラス【５）に伝熱し部分
加熱される。この熱にエリ図示しない・プラテンローラ
と保護膜カラス（５）との間の感熱紙（図示せず）が発
色し、ドラトラ形成する。Between the heat-sensitive substrates of the thermal head produced in the above manner, voltage is applied to the common lead electrode (b), and the select lead electrode (b) is selectively turned on and off. In the resistor (4), for example, a heating element (4a) shown in the shaded area in Fig. 7 generates heat.
The heat generated in step 4a) is transferred to the upper protective film glass [5] and is partially heated. Thermal paper (not shown) between the platen roller and the protective film crow (5) develops color due to this heat, forming a drab color.
第８図は上記に１９感熱紙に印字させた時のドツト（６
）ヲ例示し友ものであシ、第１ラインの印字が完了後感
熱紙が１ラインステツプして、第２ラインの印字が行わ
れる。Figure 8 shows the dots (6
) As an example, after the printing of the first line is completed, the thermal paper steps one line, and the printing of the second line is performed.
従来のサーマルヘッドは以上の工うに構成されてｉるの
で、次のような問題点があった。すなわち、発熱抵抗体
２工び保護膜ガラスの上面が凸状となっているのでサー
マルヘッドとプラテンローラとの間に挿入され移送され
る感熱紙の押しつけ圧力が局部的に高くなると共に局部
加熱される。Since the conventional thermal head is constructed as described above, it has the following problems. That is, since the upper surface of the protective film glass with two heating resistors is convex, the pressing pressure of the thermal paper inserted and transferred between the thermal head and the platen roller increases locally, and the thermal paper is locally heated. Ru.
その友め、感熱紙に含有しているバインダを部分融解さ
せ、プラテンローラとの摩擦の増大を招き、プラテンロ
ーラに感熱紙が付層する。その結果、感熱紙の搬送ムラ
や躍動が生じると共に騒音を発生させている。As a result, the binder contained in the thermal paper is partially melted, causing increased friction with the platen roller, and the thermal paper is layered on the platen roller. As a result, uneven conveyance and movement of the thermal paper occur, and noise is also generated.
この発明に上記のような問題点全解消するためになされ
九もので、保護膜カラス上面を平坦化して、プラテンロ
ーラとの押しつけ圧力を均等にし、局部加熱をなくし感
熱紙の搬送ムラを軽減し、かつ騒音を低下させるサーマ
ルヘッドｔｍるこトラ目的とする。This invention has been made to solve all of the above-mentioned problems by flattening the top surface of the protective film glass to equalize the pressing pressure with the platen roller, eliminating local heating, and reducing uneven conveyance of thermal paper. The purpose of this thermal head is to reduce noise.
この発明に係るサーマルヘッドに、絶縁基板とこの絶縁
基板上に形成され九発熱抵抗体と、上記発熱抵抗体に電
圧を印加する複数の電極対エリなるリード電極とを備え
たものに２いて、上記発熱抵抗体と上記リード電極の一
方の電極とが接する界面に絶縁膜を設けるとともに、上
記発熱抵抗体の幅を印字ドツトの副走査方向寸法工す幅
広とし友ものである。A thermal head according to the present invention includes an insulating substrate, a heating resistor formed on the insulating substrate, and a lead electrode serving as a plurality of electrode pairs for applying voltage to the heating resistor, An insulating film is provided at the interface where the heat generating resistor and one of the lead electrodes come into contact with each other, and the width of the heat generating resistor is widened to match the dimension of the printed dots in the sub-scanning direction.
この発明に３けるサーマルヘッドは、発熱抵抗体を幅広
な寸法としたので、保護膜カラス面が平坦化され、プラ
テンローラによる感熱紙の押しつけ圧力が均等となり、
局部加熱をなくシ、搬送ムラや騒音を少くさせる。′！
ｔ、発熱抵抗体と一方の１値との！！ｆ−面に杷碌膜を
設は友ので、損失抵抗が少く効率の良い発熱を行うこと
が出来る。In the thermal head according to the third aspect of the present invention, the heating resistor has a wide dimension, so that the glass surface of the protective film is flattened, and the pressing pressure of the thermal paper by the platen roller is uniform.
Eliminates local heating, reduces uneven conveyance and noise. ′!
t, heating resistor and one value of 1! ! Since a loquat film is provided on the f-plane, loss resistance is small and heat generation can be performed efficiently.
以ド、この発明の一実施例を第１図〜第４図について説
明する。第１図は発熱基板ωの一部を示す平面図、ｉ２
図は第１図の１１断面を示す断面図、第３図は抵抗損失
を説明する等価回格図、第４図は抵抗損失を示すデータ
図である。Hereinafter, one embodiment of the present invention will be described with reference to FIGS. 1 to 4. Figure 1 is a plan view showing a part of the heat generating board ω, i2
The figure is a cross-sectional view showing the 11 cross section of FIG. 1, FIG. 3 is an equivalent circuit diagram explaining resistance loss, and FIG. 4 is a data diagram showing resistance loss.
第１図、第２図に２いて、ｔｔ） ｒｉセラずツク等工
りなる絶縁基板、（２）はガラス材料で構成され九グＶ
−ズ層、（３）はリード電極でくし型状のコモンリード
（３ａ）、複数のセレクトリード′ｆ！Ｌ極（３ｂ）と
によって構成している。１４１１ｒ１発熱抵抗体、（５
１はＭ２Ｏ，。In Figs. 1 and 2, (2) is an insulating substrate made of a glass material, and (2) is made of a glass material.
- layer (3) is a lead electrode, a comb-shaped common lead (3a), and a plurality of select leads 'f! It is composed of an L pole (3b). 1411r1 heating resistor, (5
1 is M2O,.
Ｓｉｎ、等を主成分とする保護膜ガラス、（７）は絶縁
層で、上記発熱抵抗体＋４１１とセレクトリード電ｉ
（３ｂ）との接する界面を絶縁するものであり、絶縁ガ
ラスペースト等でスクリーン印刷されている。(7) is an insulating layer that connects the heating resistor +411 and the select lead electrode i.
It insulates the interface in contact with (3b), and is screen printed with insulating glass paste or the like.
以上の第１図、第２図に示す工うに、この発明の絶縁基
板１１）、グレーズ層（２）、リード電極（３）、発熱
抵抗体ｕｎ、保護膜カラスｔＳ）の基本構成は従来例と
同じであるが２発熱抵抗体（Ａｌ１の幅寸法、２工び発
熱抵抗体ｌとセレクトリードｍ１ｌｌ（３ｂ）との間の
絶縁層（７）が従来例と異る。As shown in FIGS. 1 and 2 above, the basic structure of the insulating substrate 11), glaze layer (2), lead electrode (3), heating resistor un, and protective film tS) of the present invention is the conventional one. However, the width dimension of the two heat generating resistors (Al1) and the insulating layer (7) between the two heat generating resistors l and the select lead M1ll (3b) are different from the conventional example.
すなわち、（１）発熱抵抗体Ｑｎの幅寸法化）を印字ド
ツト副走査方向寸法の約１０倍以上であるａ ｍｍとし
ｆｃｏこれは実験に１つて得ら几たものであって、プラ
テンローラの直径ｔｔｓ〜２０ｍｍψとし、幅寸法（Ｌ
）を種々変更して実験して、上記ａ ｍｍのときに最も
鮮明なドットヶ得ている。That is, (1) Width dimension of the heating resistor Qn) is set to a mm, which is about 10 times or more the sub-scanning direction dimension of the printed dot. The diameter is tts~20mmψ, and the width dimension (L
), and the clearest dots were obtained when the above a mm was used.
この解明なドツトが得られる理由は、プラテンローラ？
ｆＪａ熱基板圀に押しつけることによって、プラテンロ
ーラがわずかに弾性変形？生じてかまぼこ状となる。こ
のかまぼこ状の直線部寸法と発熱抵抗体ｌの幅寸法（Ｌ
）との相関関係で決ってくるものである。Is the platen roller the reason why these mysterious dots are obtained?
Is the platen roller slightly elastically deformed by pressing it against the fJa heated substrate area? It forms and becomes semi-cylindrical. This semi-cylindrical linear part dimension and the width dimension of the heating resistor l (L
) is determined by the correlation with
（２１次に、絶縁層（７）を発熱抵抗体−υとセレクト
’Ｊ −ド′ｆＩＬ極（３ｂ）との間に設ける。絶縁層
（１）が無いときは第３図に示す工すに、セレクトリー
ド電極（３ｂ）の間にリークが生じて、損失抵抗（ハ）
となる。この損失抵抗（ハ）ｒｉ発熱抵抗体Ｇｄ１ｌの
幅（Ｌ）にエリその増加率が異り、第４図にそのデータ
？示す。この損失抵抗（社）を少くするために１発熱抵
抗体はυの形成前に第１図に示す工うに絶１１７）の端
面を、＋７−ド電極（３）の中心Ｊ：り距離（，８）
！り隔てて設け、絶縁カラスペーストをスクリーン印刷
、焼成して形成している。この実施例では距離（２）ヲ
約０．１５ｍｍとしているので、第４図にひいては発熱
抵抗体幅が＋１．３ ｍｍに相当し、損失抵抗の増加率
は約２０優にシーさまっている。(21) Next, an insulating layer (7) is provided between the heating resistor -υ and the select 'J-do'fIL pole (3b). If there is no insulating layer (1), the construction shown in Figure 3 In addition, leakage occurs between the select lead electrodes (3b), resulting in loss resistance (c).
becomes. The rate of increase of this loss resistance (c)ri differs depending on the width (L) of the heating resistor Gd1l, and the data is shown in Fig. 4. show. In order to reduce this loss resistance, the heating resistor is connected to the end face of the heat generating resistor shown in Fig. 1 at a distance (, 8)
! They are separated from each other and formed by screen printing and firing insulating color paste. In this example, the distance (2) is approximately 0.15 mm, so according to Figure 4, the width of the heating resistor corresponds to +1.3 mm, and the rate of increase in loss resistance is well below approximately 20 mm. .
な２、上記実施例では、絶帽［１）として、絶縁ガラス
ペーストをスクリーン印刷する場合を示したが、第５図
に示すＬうにメタルオルガニック誘電体ペースト全使用
することにエリ、絶縁１ｍ （７１）の膜厚を１μｍ以
下とすることができて、画質品位を向上させる。2. In the above example, the case where the insulating glass paste was screen printed was shown as a tip [1], but it was decided to use the entire L sea urchin metal organic dielectric paste shown in Fig. 5, and the insulation 1 m The film thickness of (71) can be reduced to 1 μm or less, improving image quality.
ま之、メルカプチド等の絶縁材を使用しても同様の効果
がある。また、さらにこの実施例では厚膜型サーマルヘ
ッドでリード電極（３）上に発熱抵抗体ｌを形成してい
るが、薄膜型サーマルヘッドでは、発熱抵抗体Ｗｔ＋上
に絶縁層（ン）を形成し、その上部にリードを極（３）
を構成するが、この時の絶縁層（？）にｒｉＴａ Ｓ
ｉ ０２やＴａ２０５等をスパッタまたｎｍＢにＬつて
形成しても工い。A similar effect can be obtained by using an insulating material such as mercaptide or the like. Furthermore, in this embodiment, the heating resistor l is formed on the lead electrode (3) in the thick film type thermal head, but in the thin film type thermal head, an insulating layer (N) is formed on the heating resistor Wt+. and connect the lead to the top (3).
riTaS is used as the insulating layer (?) at this time.
It can also be formed by sputtering or using nmB of I02, Ta205, etc.
以上の工うに、この発明に工れば発熱抵抗体とリード電
極の一方のｔａとが接する界面に絶縁膜を設けるととも
に、上記発熱抵抗体幅全印字ドツトの副走査方向寸法よ
り幅広としたのでサーマルヘッド上面が平坦となり、プ
ラテンローラとの圧力が均等化し発熱抵抗体の発熱が均
一化して、印字ドツトの鮮明化され、感熱紙とプラテン
ローラとの間の摩擦や付着を軽減し、騒音の少ない、ま
た損失抵抗のきわめて少ないサーマルヘッドカ得ら八る
効果がある。As described above, according to the present invention, an insulating film is provided at the interface between the heating resistor and one of the lead electrodes, and the width of the heating resistor is made wider than the width of the printed dot in the sub-scanning direction. The upper surface of the thermal head becomes flat, the pressure with the platen roller is equalized, and the heat generated by the heating resistor becomes uniform, making printed dots clearer, reducing friction and adhesion between the thermal paper and the platen roller, and reducing noise. This has the effect of reducing the amount of thermal head with very low loss resistance.
第１図〜第４図ｒまこの発明の一実施例にＬるサーマル
ヘッドの発熱基板図２工び説明図で、第１図は発熱基板
の一部を示す平面図、第２図は第１図の■−■断面図、
第３図は抵抗損失を説明する等価回路図、第４図は抵抗
損失のデータ図である。
第５図μこの発明の他の実施例？示す発熱基板断面図、
第６図は従来のサーマルヘッド発熱基板断面図で、第７
図は第６図の平面図、第８図は印字ドツトの説明図であ
る。
図に２いて、（１１ｒｉ絶縁基板、（３）はリード電極
、（３ａ）はコモンリード″ｌｔｆＭ、（３ｂ）は（Ｌ
／クトリード！電極畦は発熱抵抗体、圀は発熱基板、（
７）は絶縁層、（Ｌ）は発熱抵抗体幅である。
な２、図中、同一符号は同一 又は相当部分を示す。
第１図
ｆ ：千色斜＃Ｊ、技
ｚ ：２ムー１′４肴
４１：発ヤきｔＬ停
ｊ 、Ｆシ謹膜力′う又
第２図Figures 1 to 4 are explanatory diagrams of the heat generating circuit board of a thermal head according to an embodiment of the present invention; Figure 1 is a plan view showing a part of the heat generating circuit board; ■-■ cross-sectional view of Figure 1,
FIG. 3 is an equivalent circuit diagram explaining resistance loss, and FIG. 4 is a data diagram of resistance loss. Fig. 5μ Other embodiments of this invention? A cross-sectional view of the heating board shown,
Figure 6 is a cross-sectional view of the conventional thermal head heat generating board, and
The figure is a plan view of FIG. 6, and FIG. 8 is an explanatory diagram of printed dots. 2 in the figure, (11ri insulating substrate, (3) lead electrode, (3a) common lead "ltfM, (3b) (L
/ Kutrid! The electrode ridge is a heating resistor, the area is a heating board, (
7) is the insulating layer, and (L) is the width of the heating resistor. 2. In the figures, the same symbols indicate the same or equivalent parts. Figure 1 f: Senshiki diagonal #J, technique z: 2 mu 1'4 appetizer 41: start yaki tL stop j, F shishi memenryoku'umata figure 2
Claims (1)
、上記発熱抵抗体に電圧を印加する複数の電極対よりな
るリード電極と、上記発熱抵抗体と上記リード電極の一
方の電極とが接する界面に設けられた絶縁膜とを備え、
上記発熱抵抗体の幅を印字ドットの副走査方向寸法より
幅広としたことを特徴とするサーマルヘッド。An insulating substrate, a heating resistor formed on the insulating substrate, a lead electrode consisting of a plurality of electrode pairs for applying voltage to the heating resistor, and one electrode of the heating resistor and the lead electrode. and an insulating film provided on the contacting interface,
A thermal head characterized in that the width of the heating resistor is wider than the sub-scanning direction dimension of the printed dots.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18940888A JPH0238063A (en) | 1988-07-28 | 1988-07-28 | Thermal head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18940888A JPH0238063A (en) | 1988-07-28 | 1988-07-28 | Thermal head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0238063A true JPH0238063A (en) | 1990-02-07 |
Family
ID=16240773
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18940888A Pending JPH0238063A (en) | 1988-07-28 | 1988-07-28 | Thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0238063A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH071103A (en) * | 1993-05-13 | 1995-01-06 | Ryobi Ltd | Gas venting device for low speed casting |
| JP2020196211A (en) * | 2019-06-04 | 2020-12-10 | ローム株式会社 | Thermal print head |
-
1988
- 1988-07-28 JP JP18940888A patent/JPH0238063A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH071103A (en) * | 1993-05-13 | 1995-01-06 | Ryobi Ltd | Gas venting device for low speed casting |
| JP2020196211A (en) * | 2019-06-04 | 2020-12-10 | ローム株式会社 | Thermal print head |
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