JPS58140240A - Both-surface copper lined laminated board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] 'AI! I length 4 responsibilities 1 舊temporary, total 1~ku ni 1゛, role 1. My sister who has different VC secrets in IJ (IJ is PJi layer)
] Screen steel clad 1 - What to do on the plate - (・, bru,
--eVC1 On one side of this tub, there are 11 steel foils with a singing pattern on each side. (2a) and between the board (1) and the low density bar 9-y (2+
)) are made of different materials (3a
) (3b), for example, by interposing a resin-impregnated sheet of Rishitar and an impregnated sheet on the opposite side of Kraft, each copper foil (21M21 and each backing lumber (3a) (31)) f4j K
By applying adhesives (4a, 41,)), warping due to the difference in pattern density between the two copper cavities (2a), (2b) and 1fli is completely prevented. However, from z'r, this structure is not effective for continuous warpage prevention +L according to the difference in pattern density on both sides, and the material of the backup material must be considered according to the degree of difference in pattern density. There is a problem that I have to do it.

Suekan 8A was created in view of the above points, and its main purpose is to improve J\ in the copper foil of 111i.
To provide a double-sided copper-clad plate that can reliably prevent the occurrence of warping depending on the difference in turn density.

The present invention will be described in detail below based on embodiments shown in the figures.

The double-sided copper-clad tank 1-board related to Kinoe 1f4VC is high' in the overture of board i11.
a) A seed layer is applied to the entire valve, and a low-density LF copper foil (2b) is applied to the other side of the substrate (1) through an adhesive (4b).
Te Kozue 1-Sane, +I? I+ density Badashi copper foil (2a)
The thickness of the glue (4a) (-1) is low density + 5 thick copper foil (2) The glue (41 thickness (E2))
Pattern density r−v + on both copper foils (21) (2b)
The high-density pattern copper foil (2a), which is characterized by increasing size according to M, printing and T
One cedar was planted by Tsusonku, and one low-density horsefly was planted.
As shown in Figure 3, the copper foil (2a) with a high density pattern is the same as the copper foil (2b) with a low density IW pattern. ) The board + 11K is laminated with an adhesive that is thicker than It depends, but
For example, the former k is 100μ and the L latter is 35μ and γ is thick, the m1 is 50μ and the latter is 35μ to create a significant difference in the thickness of the two1.As described above, the present invention
For example, if you are using a layer of copper foil that is resistant to deformation, the thickness of the adhesive for each tank should be set to 10 - J (1'). In response to the difference in pattern density between foils, IZ is concerned with the difference in thermal expansion coefficient between high-density pattern copper foil and low-density patterned copper foil. It can be canceled out by the difference in the thermal expansion coefficient of the two items, and can prevent the warpage caused by the difference in the coefficient of expansion.In addition, the thickness of the adhesive can be adjusted according to the thickness of the copper foil on the screen. By changing , it is possible to change the corresponding difference in the thickness of the adhesive according to the difference in the pattern density of the copper foil of the 1ifj song, and as a result, it can accurately correspond to the difference in the pattern density of the copper foil of the 1111 song. This has the advantage that warping can be rapidly prevented. Furthermore, since the thickness of the adhesive between the high-density copper foil and the board is large, the electrical performance between the circuits on the high-density 1F copper foil can also be improved.

[Brief explanation of drawings]

Figure @1 is a schematic 1-meter diagram showing the problems of the conventional method, Figure @2 is a schematic exploded 1-meter diagram showing the conventional example, and figure 8 is a schematic cross-sectional diagram showing an embodiment of the present invention.L+l is the substrate; (2a) is a high-density pattern copper foil, (2) a low-strength pattern om foil, (4a) (4b) i (J: adhesive).

Claims (1)

[Claims] ill The overture of the camphor board is drawn through the IW pattern through the dumbing agent.
Copper 91j with a low-density blow pattern for
1-, the laminated layer is 1.1) The thickness of the copper mine glue with the low-density pattern is 1. Butter, increases in size according to the 7 density 1 electric ratio, 1 here and It image at both +1ri
4 boards for adjustment.