JPS58139A - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法

Info

Publication number
JPS58139A
JPS58139A JP56098526A JP9852681A JPS58139A JP S58139 A JPS58139 A JP S58139A JP 56098526 A JP56098526 A JP 56098526A JP 9852681 A JP9852681 A JP 9852681A JP S58139 A JPS58139 A JP S58139A
Authority
JP
Japan
Prior art keywords
bonding
semiconductor element
semiconductor device
inner lead
tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56098526A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0126174B2 (cs
Inventor
Hiroshi Aoyama
弘 青山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP56098526A priority Critical patent/JPS58139A/ja
Publication of JPS58139A publication Critical patent/JPS58139A/ja
Publication of JPH0126174B2 publication Critical patent/JPH0126174B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/79—Apparatus for Tape Automated Bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP56098526A 1981-06-25 1981-06-25 半導体装置の製造方法 Granted JPS58139A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56098526A JPS58139A (ja) 1981-06-25 1981-06-25 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56098526A JPS58139A (ja) 1981-06-25 1981-06-25 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS58139A true JPS58139A (ja) 1983-01-05
JPH0126174B2 JPH0126174B2 (cs) 1989-05-22

Family

ID=14222107

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56098526A Granted JPS58139A (ja) 1981-06-25 1981-06-25 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS58139A (cs)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01230240A (ja) * 1987-06-10 1989-09-13 Hitachi Ltd ボンディング方法及び装置
JPH01251729A (ja) * 1988-03-31 1989-10-06 Toshiba Corp インナーリードボンディング装置及びインナーリードボンディング方法
JPH0344041A (ja) * 1989-07-12 1991-02-25 Shinkawa Ltd ボンディング方法及びその装置
JPH0388344A (ja) * 1989-08-31 1991-04-12 Seiko Epson Corp インナーリードのボンディング方法
JPH0397239A (ja) * 1989-09-11 1991-04-23 Nec Corp ボンディング方法及びその装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51146350A (en) * 1975-06-11 1976-12-15 Hitachi Ltd Ultrasonic wire bonding device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51146350A (en) * 1975-06-11 1976-12-15 Hitachi Ltd Ultrasonic wire bonding device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01230240A (ja) * 1987-06-10 1989-09-13 Hitachi Ltd ボンディング方法及び装置
JPH01251729A (ja) * 1988-03-31 1989-10-06 Toshiba Corp インナーリードボンディング装置及びインナーリードボンディング方法
JPH0344041A (ja) * 1989-07-12 1991-02-25 Shinkawa Ltd ボンディング方法及びその装置
JPH0388344A (ja) * 1989-08-31 1991-04-12 Seiko Epson Corp インナーリードのボンディング方法
JPH0397239A (ja) * 1989-09-11 1991-04-23 Nec Corp ボンディング方法及びその装置

Also Published As

Publication number Publication date
JPH0126174B2 (cs) 1989-05-22

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