JPS58139410A - Inductance element - Google Patents
Inductance elementInfo
- Publication number
- JPS58139410A JPS58139410A JP2233182A JP2233182A JPS58139410A JP S58139410 A JPS58139410 A JP S58139410A JP 2233182 A JP2233182 A JP 2233182A JP 2233182 A JP2233182 A JP 2233182A JP S58139410 A JPS58139410 A JP S58139410A
- Authority
- JP
- Japan
- Prior art keywords
- inductance element
- conductor
- substrate
- hole
- manhours
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims abstract description 19
- 239000000758 substrate Substances 0.000 claims abstract description 13
- 238000000034 method Methods 0.000 abstract description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 4
- 239000011889 copper foil Substances 0.000 abstract description 4
- 238000005476 soldering Methods 0.000 abstract description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は電気回路に使用するインダクタンス素子に関す
るものであり、小さな平面形インダクタンス素子を提供
することを目的とするものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an inductance element used in an electric circuit, and an object thereof is to provide a small planar inductance element.
従来電気回路に使用されているインダクタンス素子とし
ては、ディスクリート型部品としてのピーキングコイル
部品と、回路基板上に形成された第１図ａ、ｂに示され
る基板１上に螺旋状の導体２を有する構造の平面形イン
ダクタンス素子があった。前者はディスクリート型部品
であることから所定の部品高さを必要とするため高さが
高く、回路への接続は部品から出た２本のリード端子を
半田付けすることにより行なわれていた。後者は、例え
ば紙フェノール及びガラスエポキシ積層板よりなる基板
に銅箔を張り合わせた銅張り積層板の所定の箇所の銅箔
を写真食刻法により第１図ａに示される様な角形の螺旋
状に形成後、螺旋状導体２の内部最終端３からジャンパ
ー線４により外部回路端子６へ接続するインダクタンス
素子であった。又、この内部最終端３から外部回路端子
６への接続手段としては、真空蒸着技術による薄膜形成
及びスクリーン印刷技術による厚膜形成を利用して第２
図ａ、ｂに示されるように螺旋状導体１の内部最終端３
と外部回路端子部６とをクロスオーバと呼ばれる絶縁層
６上に設けた接続用導体７で接続してもよい。前者はジ
ャンノ（−線４を接続する工程を、後者はクロスオーバ
接続工程を必要とするため、作業工数が増大するという
欠点がある０
そこで本発明は従来例のジャンパー接続工程及びクロス
オーバ接続工程を必要としない接続作業工数を低減した
インダクタンス素子を提供しようとするものであり、以
下本発明の実施例について図面を参照して説明する。Inductance elements conventionally used in electric circuits include a peaking coil component as a discrete component, and a spiral conductor 2 on a substrate 1 shown in FIGS. 1a and 1b formed on a circuit board. There was a planar inductance element in the structure. Since the former is a discrete type component, it requires a predetermined component height and is therefore high in height, and connection to the circuit is accomplished by soldering two lead terminals coming out of the component. The latter is, for example, a copper-clad laminate in which copper foil is laminated onto a substrate made of paper phenol and glass epoxy laminate. After formation, the inductance element was connected from the inner final end 3 of the spiral conductor 2 to the external circuit terminal 6 by a jumper wire 4. Further, as a connection means from this internal final end 3 to the external circuit terminal 6, a second connection is made using thin film formation using vacuum evaporation technology and thick film formation using screen printing technology.
The inner final end 3 of the helical conductor 1 as shown in figures a, b
and the external circuit terminal portion 6 may be connected by a connecting conductor 7 provided on the insulating layer 6 called a crossover. The former requires a process for connecting the Jeanno (- wire 4), and the latter requires a crossover connection process, which has the disadvantage of increasing the number of work steps. Therefore, the present invention has the disadvantage that the jumper connection process and crossover connection process of the conventional example require It is an object of the present invention to provide an inductance element that does not require a connection operation and reduces the number of man-hours for connection work.Examples of the present invention will be described below with reference to the drawings.
第３図に示されるように、紙フェノール積層板及びガラ
スエポキシ積層板８の螺旋状導体９の内部最終端１０の
位置する基板部にパンチング等により角形又は円形の透
孔１１を形成する。次にこの透孔１１の形成された基板
３にエポキシ系接着剤等を介して導体９となる銅箔を張
り合わせる。As shown in FIG. 3, a rectangular or circular through hole 11 is formed by punching or the like in the substrate portion of the paper phenol laminate and the glass epoxy laminate 8 where the inner final end 10 of the spiral conductor 9 is located. Next, a copper foil that will become the conductor 9 is pasted onto the substrate 3 in which the through hole 11 is formed using an epoxy adhesive or the like.
次に写真食刻法を利用して所定の角形螺旋状及び円形螺
旋状のパターンを形成する。この時、目的とするインダ
クタンス素子の電気性能に応じて、使用する導体の銅箔
の厚さを選定する。又、螺旋状の導体パターン１を形成
後、導体抵抗値を下げるためハンダコート及び金メッキ
等を行なっても良い。さらに必要に応じて螺旋状導体パ
ターン１を形成後絶縁樹脂をコートしても良い。このよ
うにして形成されたインダクタンス素子を電気回路に組
み込むには、第４図に示されるように形成されたインダ
クタンス素子を実装する電気回路基板１２の導体１３．
１４に、当該素子の螺旋状導体９が基板８より外側には
み出た部分と、内部最終端１０とを半田接続又は熱圧着
接続により接続する。本考案では第２図ｄのように電気
回路基板１０に４該素子を接続後、絶縁性樹脂（エポキ
シ樹脂。Next, a predetermined square spiral pattern and circular spiral pattern are formed using photolithography. At this time, the thickness of the copper foil used as the conductor is selected depending on the electrical performance of the intended inductance element. Further, after forming the spiral conductor pattern 1, solder coating, gold plating, etc. may be performed in order to lower the conductor resistance value. Furthermore, if necessary, an insulating resin may be coated after the spiral conductor pattern 1 is formed. In order to incorporate the inductance element thus formed into an electric circuit, the conductor 13 of the electric circuit board 12 on which the inductance element formed as shown in FIG.
At step 14, the portion of the spiral conductor 9 of the element protruding outward from the substrate 8 and the inner final end 10 are connected by soldering or thermocompression bonding. In the present invention, after connecting the four elements to the electric circuit board 10 as shown in FIG. 2d, insulating resin (epoxy resin) is used.
シリコン樹脂等）で素子全体を被覆しても良い。The entire element may be covered with silicone resin, etc.).
また第５図に示すように、素子を第４図の場合と逆にし
て基板１２に取付けてもよい。Further, as shown in FIG. 5, the element may be attached to the substrate 12 in the opposite manner to that shown in FIG.
以上のように本発明は従来のディスクリ−・ト部品であ
るピーキングコイル部品と比較しても、その実装後の高
さは低くなり、一方第１図、第２図に示される平面形イ
ンダクタンス素子と比較しても、インダクタンス素子の
接続工数が低減されるという利点を有するものであるΩAs described above, the height of the present invention after mounting is lower than that of the conventional peaking coil component, which is a discrete component. Compared to inductance elements, it has the advantage of reducing the number of connections required for inductance elements.
第１図ａ、ｂは従来例におけるインダクタンス素子の平
面図および側面図、第２図ａ、ｂｉｄ−他の従来例にお
けるインダクタンス素子の平面図および側面図、第３図
ａ、ｂは本発明の一実施例におけるインダクタンス素子
の斜視図および断側面図、第４図、第６図はそれぞれ同
インダクタンス素子の使用状態を示す断側面図である。
８・・・・・・積ｆ−板、９・・・・・・螺旋状導体、
１０・・・・・最終端、１１・・・・・・透孔。
代理人の氏名 弁理士 中 尾 敏 男 ほか１名４
１５１１
１４２図Figures 1a and b are a plan view and a side view of an inductance element in a conventional example, Figures 2a and b are a plan view and a side view of an inductance element in another conventional example, and Figures 3a and b are a plan view and a side view of an inductance element in another conventional example. A perspective view and a cross-sectional side view of an inductance element in one embodiment, and FIGS. 4 and 6 are cross-sectional side views showing the use state of the same inductance element, respectively. 8... Product f-plate, 9... Spiral conductor,
10...Final end, 11...Through hole. Name of agent: Patent attorney Toshio Nakao and 1 other person 4 1511 142
Claims (1)
て上記絶縁基板の上面に螺旋状に導体を形成し、この導
体の内部最終端を上記透孔にのぞませたことを特徴とす
るインダクタンス素子。A through hole is formed in the center of the insulating substrate, a conductor is formed spirally on the upper surface of the insulating substrate with this through hole as the center, and the inner final end of this conductor is exposed to the through hole. Characteristic inductance element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2233182A JPS58139410A (en) | 1982-02-15 | 1982-02-15 | Inductance element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2233182A JPS58139410A (en) | 1982-02-15 | 1982-02-15 | Inductance element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58139410A true JPS58139410A (en) | 1983-08-18 |
Family
ID=12079719
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2233182A Pending JPS58139410A (en) | 1982-02-15 | 1982-02-15 | Inductance element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58139410A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020161725A (en) * | 2019-03-27 | 2020-10-01 | 株式会社ダイヘン | Transformer |
-
1982
- 1982-02-15 JP JP2233182A patent/JPS58139410A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020161725A (en) * | 2019-03-27 | 2020-10-01 | 株式会社ダイヘン | Transformer |
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