JPH06152145A - Electronic circuit device and its manufacture - Google Patents

Abstract

PURPOSE:To provide an electronic circuit device containing film-state coil parts by inserting the lower main body part of a core into a through hole of a printed wiring board, formed in lamination. CONSTITUTION:Consists of a core 8 having an upper projecting part 8a and a lower main body part 8b, the first printed wiring board 1a having the first through hole 7a, and the second printed wiring board 1b having the second through hole 7b. In addition, a core land 10 is formed around the peripheral of the first printed wiring board 1a, and a coil pattern 4 is formed around the peripheral of the second printed wiring board 1b. These the first and second printed wiring board 1a and 1b configured in lamination. Then the lower main body part 8b of the core 8 is inserted into the through holes 7a and 7b, and a soldering metal coating 8c coated on the upper projecting part 8a is soldered to the core land 10. Further, an electronic part 2 is soldered to an electronic parts land 9.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION This invention relates to electronic circuit devices, and more particularly to
The present invention relates to an electronic circuit device using a printed wiring board on which at least a wire ring component having a core and other electronic components are mounted, and a method for manufacturing the same.

[0002]

[Prior art]

(2) Conventionally, electronic circuit devices using a printed wiring board have been widely put into practical use in response to demands for downsizing, thinning, and cost reduction. In addition, various printed wiring boards have been developed in order to realize high density, high function and high reliability, and the progress thereof is remarkable. As the printed wiring board, for example, a paper-based copper-clad laminate, a glass-based copper-clad laminate, a ceramic substrate, or the like is used.

In addition to active and passive elements such as semiconductor parts, resistors and capacitors, wire ring parts such as transformers, chokes and inductors are also widely used as parts to be mounted on a printed wiring board. The most common structure of coil parts is the one that is wound on a resin bobbin and fits the core, and the one that inserts a sheet coil into the core and solder-connects the metal lead terminals. However, there are drawbacks such that the height dimension of the mounting structure on the printed wiring board is large and it is not suitable for thinning, and the manufacturing process of the coil component is complicated.

A structure of an electronic circuit device such as the perspective assembly view of FIG. 1 has also been proposed. 1a to 1d are printed wiring boards, 2 are electronic components, 3 is a core of a wire ring component, and 4 is a wire ring. Coil patterns of parts 5 are via holes for connecting the coil 4.
Reference numeral 6 is a wiring conductor pattern such as copper foil, 7a to 7d are through holes, and 9 is a land for electronic parts.

A coil pattern 4 such as a silver layer and a wiring conductor pattern 6 are formed on the printed wiring boards 1a to 1d, and each coil pattern 4 is continuously formed with a via hole 5 and a through hole. Are electrically connected to each other by soldering, and other necessary electronic components 2 and the like are soldered to the lands 9. Then, each printed wiring board 1
The through holes 7a to 7d of a to 1d are put together and integrated in a laminated shape, and further, the threaded ferrite core is embedded and fixed in the through holes 7a to 7d.

In the conventional structure shown in FIG. 1, the through holes 7a to 7 of the printed wiring boards 1a to 1d in which the main body of the core 3 is laminated.
Since it exists in d, the height dimension is reduced and the thickness (3) is achieved, but a screwing process is required and soldering of electronic components other than the coil components mounted on the printed wiring board 1 is required. It requires a manufacturing line that is separate from the process, making it difficult to automate.
Further, since the core has a cylindrical shape, it is difficult to obtain high inductance.

[0007]

The problem to be solved is that when a bobbin-type wire ring component is mounted in a structure of an electronic circuit device using a printed wiring board, its height dimension becomes large and it cannot be thinned. However, when a sheet transformer is used as a sheet transformer, it is difficult to manufacture the sheet transformer itself. When a threaded cylindrical core is used, the manufacturing process is different from other electronic components. And the fact that high inductance cannot be obtained.

[0008]

DISCLOSURE OF THE INVENTION The present invention is directed to an electronic circuit device comprising a printed wiring board having at least a wire ring component having a core and other electronic components as a mounting component, and an upper part formed with a metal film for soldering. A core of a wire wheel component having a protrusion and a lower body portion, a first through hole penetrating the lower body portion of the core are provided, and a first coil pattern is provided near the outer periphery of the first through hole. A first printed wiring board having a core land and a second through hole penetrating the lower main body portion of the core, with or without It is composed of a second printed wiring board having a second coil pattern formed in the vicinity of the periphery thereof.
The second printed wiring board is formed in a laminated shape, the lower main body of the core is inserted into the first and second through holes, and the wiring conductor pattern of the first printed wiring board is changed to the first coil pattern. Electronic circuit device characterized in that it is electrically connected to the second coil pattern with or without a solder, and the soldering metal coating of the upper protrusion and the core land are fixed by soldering. And the soldering metal film for the upper protruding portion and the core land, and other electronic parts to be mounted are soldered in the same manufacturing step (4). A device manufacturing method is used as a solution.

[0009]

FIG. 2 is a perspective assembly view of an electronic circuit device according to an embodiment of the present invention, and FIG. 3 is a sectional structural view thereof. The same reference numerals as those in FIG. 1 represent the same parts. Reference numeral 8 is a core of the wire wheel component of the present invention, 8a is an upper projection of 8, 8b is a lower main body, and 8c is a metal coating for soldering formed on 8a. Reference numeral 10 is a core land, 11 is an internal wiring, and 12 is a solder.

The basic structure of the present invention will be described below with reference to the sectional structural view of FIG. The components of the structure of the present invention include a core 8 having at least an upper protrusion 8a and a lower body 8b, and a first
The first printed wiring board 1a having the through hole 7a and the second printed wiring board 1b having the second through hole 7b. At least the core land 10 is formed near the outer periphery of the first printed wiring board 1a, and the coil pattern 4 is formed near the outer periphery of the second printed wiring board 1b.

These first and second printed wiring boards 1a,
1b has a laminated structure. As a laminated integrated forming means, a laminating means such as adhesion, tightening, pressure bonding, firing, etc. according to various printed wiring boards such as a paper base copper clad laminate, a glass base copper clad laminate and a ceramic substrate. Can be arbitrarily selected. Therefore, depending on the material and laminating means, 1
A gap as shown in FIG. 3 does not occur between a and 1b. The coil pattern 4 is a wiring conductor pattern 6 and a via hole 5.
Are electrically connected to form a coil portion of the coil component.

Next, the lower body portion 8b of the core 8 is inserted into the first through holes 7a and 7b, and the soldering metal coating 8c and the core land 10 attached to the upper body portion 8a are soldered 1
It is fixed by 2. Also, the electronic component 2 is soldered to the electronic component land 9 by the solder 12 (5). Reference numeral 11 is an internal wiring provided as necessary and is used for electrical connection between the printed wiring boards.

Although not shown in the embodiment of the present invention, a first coil pattern can be formed near the outer periphery of the first through hole 7a provided in the first printed wiring board 1a. In this case, the first coil pattern is preferably provided between the outer periphery of 7a and the core land 10. Also, when the first coil pattern is provided in 1a, the second coil pattern 4 of the second printed wiring board 1b (called the second coil pattern to distinguish it from the first coil pattern). The electrical connection to is made by the via hole 5 from the wiring conductor pattern 6 through the first coil pattern.
The first coil pattern and the second coil pattern are formed in a single ring shape around the through holes 7a and 7b, respectively, but may be formed in a multiple ring shape.

The number of laminated printed wiring boards having the structure of the present invention is
At least the first and second printed wiring boards may be provided, but because of the need to design an electronic circuit device, for example, the number of stacked layers can be increased to have a four-layer structure as shown in FIG.
Further, the shape of the upper protruding portion 8a of the core 8 is brim-shaped, that is, the lower main body portion 8b is projected upwards over the entire circumference, but the projections may be provided radially or linearly. As for the lower body portion 8b, a prismatic shape other than the cylindrical shape can be selected. Although the core land 10 is formed of a conductor layer such as copper foil, as shown in FIG. 2, the first through hole 7a is formed.
It is necessary to consider that loops are not formed by the conductor layers, for example, as two conductor layers are provided in the vicinity of. Also, although only one surface mount type electronic component 2 is illustrated, all the components generally mounted on a printed wiring board such as an insert type component and a terminal block can be selectively mounted.

FIG. 4 is a manufacturing process diagram showing a manufacturing example of the structure of the present invention, in which the same reference numerals as in the preceding drawings indicate (6) equivalent portions. The printed wiring boards 1a to 1d are shown after being integrally formed, and the respective sections 1a to 1d are not clearly shown.

FIG. 4A shows a process of forming the core land 10 and the electronic component land 9, and FIG. 4B shows a solder paste 1.
2'is a forming process, FIG. 4C is a mounting process of the core 8 and the electronic component 2, and FIG. 4D is a soldering process.

As described above, the soldering metal coating 8c of the upper protruding portion 8a and the core land 10 and the electronic component 2 and the electronic component land 9 are soldered in the same manufacturing process, and the same process as shown in FIG. The structure of the present invention as in d) is obtained.

[0018]

According to the above-described structure of the present invention and the manufacturing method thereof, a. An electronic device including coil parts such as transformers, chocks, and other inductors that are made thinner by inserting the core of the coil part into a printed wiring board with a coil pattern and mounting other electronic parts. Get the circuit device. B.
By soldering the soldering metal coating formed on the upper protrusion of the core to the core land, the means for fixing the core becomes easy. C. The formation of the upper protrusion of the core increases the inductance of the coil component. D. Soldering of the core and manufacturing of other electronic components are performed in the same process, and the manufacturing line can be simplified. Due to these effects, it is possible to meet the demands for small size, thinness, high density, and low price by using it in general electronic circuit devices including power supply devices, and it is extremely effective in industry.

[Brief description of drawings]

FIG. 1 is a perspective assembly view of a conventional structure.

FIG. 2 is a perspective assembly view of the embodiment of the structure of the present invention.

FIG. 3 is a sectional structural view of an embodiment of the structure of the present invention.

FIG. 4 is a manufacturing process diagram showing a manufacturing example of the structure of the present invention.

[Explanation of symbols]

 1a to 1d Printed wiring board 2 Electronic component 3 Core of wire ring component 4 Coil pattern of wire ring component 5 Via hole 6 Wiring conductor pattern 7a to 7d Through hole 8 Core of wire ring component used in the present invention 8a 8 Upper protrusion 8b 8 lower body 8c 8a soldering metal coating formed on 8a 8 land for electronic component 10 land for core 11 internal wiring 12 solder 12 'solder paste

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁵ Identification code Office reference number FI technical display location H05K 1/18 M 9154-4E

Claims (2)

[Claims] 1. An electronic circuit device comprising a printed wiring board having at least a wire ring component having a core and other electronic components as a mounting component, and an upper projection portion having a soldering metal coating formed thereon and a lower main body portion. The core of the wire wheel component,
A first through hole that penetrates the lower main body portion of the core is provided, and a first coil pattern is provided near the outer periphery of the first through hole.
A first printed wiring board having a core land and a second through hole penetrating the lower main body portion of the core, with or without It is composed of a second printed wiring board in which a second coil pattern is formed in the vicinity of the periphery, and the first and second printed wiring boards are laminated so that the lower main body of the core is the first and the second. Of the first printed wiring board and electrically connected to the second coil pattern with or without the first coil pattern from the wiring conductor pattern of the first printed wiring board. An electronic circuit device characterized in that a soldering metal coating on a protrusion and a core land are fixed by soldering. 2. The soldering metal coating for the upper protrusion and the land for the core, and the other electronic components to be mounted are soldered in the same manufacturing process. Manufacturing method of electronic circuit device.