JPS58138089A - Circuit board - Google Patents
Circuit boardInfo
- Publication number
- JPS58138089A JPS58138089A JP1958082A JP1958082A JPS58138089A JP S58138089 A JPS58138089 A JP S58138089A JP 1958082 A JP1958082 A JP 1958082A JP 1958082 A JP1958082 A JP 1958082A JP S58138089 A JPS58138089 A JP S58138089A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- chip component
- cylindrical chip
- board
- cylindrical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明は円筒形チップ部品を搭載する回路基板に関する
ものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a circuit board on which cylindrical chip components are mounted.
従来５円筒形チップ部品を搭載する場倉１回路基板は、
＊＊される位置に仮固定用Ｏ熱硬化性接着剤やハンダペ
ースト等が印刷基れており搭載装置にお−て円筒形チッ
プ部品を正確に位置決めし搭−畜れる。この方法１ｃＴ
ｈいて基板にＳ噴する前に円筒形チップ部品を正確に位
置決めする必要があり又、基板に仮固定する工程が必要
となシさらに基板の厚さが１板と円ＩｉＩ形チップ部品
を加えた分となシ薄形化が出自ないという欠点がある。Previously, the Bakura 1 circuit board mounted with 5 cylindrical chip components was
** A thermosetting adhesive, solder paste, etc. for temporary fixing is printed at the position to be used for temporary fixing, and the cylindrical chip component can be accurately positioned and mounted using a mounting device. This method 1 cT
It is necessary to accurately position the cylindrical chip component before spraying S on the board, and a process of temporarily fixing it to the board is required.Furthermore, the thickness of the board is 1 plate and the circular III-shaped chip part is added. However, it has the disadvantage that it cannot be made thinner.
本発明の目的は、上記した従来技術の欠点ななくし円筒
形チップ部品の搭載時に位置決めを正確にしなくてもよ
く、又、仮固定も不必要とな〕さらに基板を薄形化出来
る回路基板を提供するにある。The object of the present invention is to eliminate the drawbacks of the prior art described above, eliminate the need for accurate positioning when mounting cylindrical chip components, and eliminate the need for temporary fixing; and provide a circuit board that can be made thinner. It is on offer.
上記目的な達成するために５本発明においては１回路基
板に円筒形チップ部品を搭載される位置に円筒形チップ
部品の径よ）小さく、長手方向に長い穴を明け、基板の
配線部分に半田ペーストを印刷し上記穴の中に円筒形チ
ップ部品を落しこみ半田ペーストを溶かし円１１１形チ
ップ部品を固定する事を特徴とする。In order to achieve the above object, in the present invention, a hole smaller than the diameter of the cylindrical chip component and long in the longitudinal direction is made at the position where the cylindrical chip component is mounted on the circuit board, and the wiring part of the circuit board is soldered. The method is characterized in that a paste is printed, a cylindrical chip component is dropped into the hole, the solder paste is melted, and the circular 111-shaped chip component is fixed.
本発明の一実施例をｉｌＩ園にしたがりて説明する。第
１図ないし第５図は本発明の一実施例を示すもので、同
図において、＠路基板１は円筒形チップ部品２をｌＩＦ
載する位置に円筒形チップ部品５ｏ径よシ若干小さく義
手方向に着干長−穴宜を敵け、半田ペースト４が電極部
分に印属されて−る。以上の構成において、図示しない
方法で円筒形チップ部品Ｓを搭載装置が基板１Ｋｌｌ載
されると、第ｉ図、第４図に示す如く基板１０穴２の中
に落ちこみ円筒形チップ部品暴は位置決めされる。基板
１は図示しな一方法によ）半田ペースト４を溶かす炉に
入ｎｕｓ図に示す如く円筒形チップ部品Ｓの電極部分と
基板１の電極部分が固着され１回路が形成される。An embodiment of the present invention will be described according to the ILI garden. FIGS. 1 to 5 show an embodiment of the present invention, in which a @ road board 1 has a cylindrical chip component 2
At the mounting position, a cylindrical chip component 5o with a diameter slightly smaller than that of the prosthesis arm is placed, and a solder paste 4 is applied to the electrode portion, with the length and hole of the chip component being slightly smaller than that of the cylindrical chip component 5o. In the above configuration, when the cylindrical chip component S is placed on the board 1Kll by a mounting device using a method not shown, the cylindrical chip component S falls into the hole 2 of the board 10 as shown in FIGS. be done. The substrate 1 is placed in a furnace for melting the solder paste 4 (by a method not shown), and the electrode portions of the cylindrical chip component S and the electrode portions of the substrate 1 are fixed to form one circuit as shown in the figure.
又＠４図〜第７図におｉで基板１の裏向にも半田ペース
ト４′を印刷し１円筒形チップ部品墨を落しζみ半田ペ
ースｌ−４，４’を溶かすと、スルホール的な４＆日付
が可能となる。さらに第８図に示す如く基板１と基板１
゛を２枚合せ牛田付する事によ妙２枚が固定され、基板
の専有面積が小さくなシ、小形化が可能となる。Also, as shown in Figures 4 to 7, if you print solder paste 4' on the back side of the board 1, remove the ink from the cylindrical chip component, and melt the solder paste 1-4, 4', it will look like a through hole. 4 & date is possible. Furthermore, as shown in FIG.
By putting two pieces together and attaching them together, the two pieces are fixed together, and the area occupied by the board is small, making it possible to downsize.
以上述べた如く本発明によれば円筒形チップ部品を、回
路！！４にの穴に落しこんだために、＊−装置において
正確な位置決めが不必要となシ又仮固定が不必要となる
。さらに基板の薄形化が可能であるなどの効果がある。As described above, according to the present invention, cylindrical chip components can be used as circuits! ! 4, there is no need for accurate positioning or temporary fixation in the *-device. Furthermore, there are effects such as the possibility of making the substrate thinner.
【図面の簡単な説明】
第１図は本発明による回路基板の平面図、第２ 図ｕｌ
ｌｔ ｔ 図ｏＸ−Ｘｌｌｌｒ１１ｍｌ、 第１図ハ第
！図に部品を搭載した時の断面図、第４図は第１図にる
。
１．１’？回路基板。
５二円筒形チップ部品、
４．４−二牛田ペースト。
才 １ 図
２ ６ 図
オフ図
１−８ 図[Brief Description of the Drawings] Fig. 1 is a plan view of a circuit board according to the present invention, Fig. 2 is a plan view of a circuit board according to the present invention;
lt t Figure oX-Xlllr11ml, Figure 1 Ha No.! The cross-sectional view when the parts are mounted in the figure, Figure 4, is shown in Figure 1. 1.1'? circuit board. 5 Two cylindrical chip parts, 4.4-Niguda paste. Figure 1 Figure 2 6 Figure Off Figure 1-8 Figure
Claims (1)
に円筒形チップ部品の径よシ若干小さく長手方向に着干
長い穴を明は基板の電極部分に半田ペースト等を、ｊ１
１Ｅ布し、前記穴に円筒形チップ部品を入れられる事に
よ抄回路を薄形化する事を＊＊とする回路基板。16 At the position where the cylindrical chip component will be mounted on the circuit board, make a long hole slightly smaller than the diameter of the cylindrical chip component and run in the longitudinal direction. Apply solder paste, etc. to the electrode part of the circuit board.
1E fabric, and a cylindrical chip component is inserted into the hole, thereby making the circuit board thinner.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1958082A JPS58138089A (en) | 1982-02-12 | 1982-02-12 | Circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1958082A JPS58138089A (en) | 1982-02-12 | 1982-02-12 | Circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58138089A true JPS58138089A (en) | 1983-08-16 |
Family
ID=12003202
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1958082A Pending JPS58138089A (en) | 1982-02-12 | 1982-02-12 | Circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58138089A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6071169U (en) * | 1983-10-20 | 1985-05-20 | 八木アンテナ株式会社 | Mounting structure of chip parts |
-
1982
- 1982-02-12 JP JP1958082A patent/JPS58138089A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6071169U (en) * | 1983-10-20 | 1985-05-20 | 八木アンテナ株式会社 | Mounting structure of chip parts |
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