JPS58135657A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS58135657A
JPS58135657A JP57016962A JP1696282A JPS58135657A JP S58135657 A JPS58135657 A JP S58135657A JP 57016962 A JP57016962 A JP 57016962A JP 1696282 A JP1696282 A JP 1696282A JP S58135657 A JPS58135657 A JP S58135657A
Authority
JP
Japan
Prior art keywords
semiconductor
semiconductor element
cooling
semiconductor device
cooling fins
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57016962A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0340504B2 (https=
Inventor
Teigo Okada
岡田 定五
Hisao Sonobe
久雄 園部
Hisashi Kuwana
桑名 寿
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP57016962A priority Critical patent/JPS58135657A/ja
Publication of JPS58135657A publication Critical patent/JPS58135657A/ja
Publication of JPH0340504B2 publication Critical patent/JPH0340504B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00Arrangements for thermal protection or thermal control
    • H10W40/70Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP57016962A 1982-02-06 1982-02-06 半導体装置 Granted JPS58135657A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57016962A JPS58135657A (ja) 1982-02-06 1982-02-06 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57016962A JPS58135657A (ja) 1982-02-06 1982-02-06 半導体装置

Publications (2)

Publication Number Publication Date
JPS58135657A true JPS58135657A (ja) 1983-08-12
JPH0340504B2 JPH0340504B2 (https=) 1991-06-19

Family

ID=11930726

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57016962A Granted JPS58135657A (ja) 1982-02-06 1982-02-06 半導体装置

Country Status (1)

Country Link
JP (1) JPS58135657A (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4864385A (en) * 1987-12-29 1989-09-05 Hitachi, Ltd. Power semiconductors connected antiparallel via heatsinks
JP2013093343A (ja) * 2011-10-24 2013-05-16 Toyota Motor Corp 半導体装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5349767U (https=) * 1976-09-30 1978-04-26
JPS55134783U (https=) * 1979-03-16 1980-09-25

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5349767U (https=) * 1976-09-30 1978-04-26
JPS55134783U (https=) * 1979-03-16 1980-09-25

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4864385A (en) * 1987-12-29 1989-09-05 Hitachi, Ltd. Power semiconductors connected antiparallel via heatsinks
JP2013093343A (ja) * 2011-10-24 2013-05-16 Toyota Motor Corp 半導体装置

Also Published As

Publication number Publication date
JPH0340504B2 (https=) 1991-06-19

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