JPS58134494A - Circuit board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a wiring board formed with a conductor circuit formed on a mechanical chassis, for example, and is particularly designed to save space when stored in a case.

Electronic equipment, especially video movies and VTs that have been requested to be converted into huts.
For R, etc., a mechanical chassis (1) K conductor circuit may be printed as shown in FIG. Here, the conductor circuit is formed by the wiring pattern or the coil of the motor, and in this figure, the conductor circuit is shown by hatching and surrounded by a dot. Note that the circular holes indicated by broken lines are for the cab stan shaft and Mome shaft. Specifically, as shown in Figure 2, mechanical chassis materials (11) made of aluminum or iron are used.
12) Form a conductor circuit (3Jl) through the terminal. The adhesive layer (2) is an insulating layer, and is formed by etching a conductive circuit (3), such as a copper foil (3), as shown by a broken line.In this way, the mechanical chassis ( When the conductor circuit (3) is formed on 1 and 7,
I! Since the 4th board and the mechanical chassis (11) can be used together, it is very advantageous in terms of reducing the number of parts and cost performance.

To form the mechanical chassis material (la) K conductor circuit (3a), #C1 is first coated with adhesive layer (2
) with the copper foil (3) attached to the material (la) K of the mechanical chassis.After that, the adhesive layer (2) is cured by heat treatment etc. to give sufficient insulation properties (Fig. 3A). . After this, patterning is done by dork printing and photo printing,
Conductor circuit (3a) K-compatible etching resist (4
) on the copper foil (3) (Fig. 3B).

Next, perform etching to remove the copper foil other than the conductor circuit (3 m) (Fig. 3C), and then etching resist).
141 &' remove (813 Figure D). After this.

For example, a solder resist (5) made of epoxy resin is formed to prevent short-circuiting of the conductor circuit (3a) and to prevent the conductor circuit (3a) from shorting (Fig. 3E). Then, after punching, shaping and drilling (Fig. IiEa, F), bending is performed (Fig. 3, G).

in this case,#! The bent portion (6) shown in Figure 3GK is formed for fitting a connector, etc. That is, as shown in FIG.
Form. And the connector (8) of the pond circuit section (7)
? This bent portion (6) K is fitted so that electrical connection can be made at the same time as mechanical connection.

By the way, it is desirable that the R of this bent portion +61 (see FIG. 4) be small. 8.5 As shown in Fig. 8.5, KoV,.

Actually fit the connector (6) 11. , ll'At dimension is a portion without H, and the mechanical chassis (1) becomes less simple by this R. Also, since the edges are not flat, it is difficult to mount them as parts, and if the radius is large, the packaging density will be a proportion of that.Furthermore, there is also a physical radius. This requires extra space and degrades the Space 7 actor.

However, at present, it is difficult to make the R smaller than 3 to 4 square centimeters, for example. That is, if KRy is small as shown in Fig. 4, the conductor circuit (3a) (copper foil (3)
)) becomes extremely large and the conductor circuit (3a) is broken. In addition, the adhesive layer (
2) Because it receives a lot of force from the conductor circuit (3 m) and is thin, the withstand voltage decreases.

The present invention has been made with these 6 and 5 circumstances in mind, and in particular, it is an object of the present invention to provide a wiring shielding board that can reduce the R5 of the bent portion without making the - of the conductor circuit m*. It's something to do...

Hereinafter, an embodiment of the present invention will be described with reference to FIG. 6 and FIG. m7.

FIG. 6 shows an example of this. In this figure, a contact layer Q2 is formed on the wood (lla) of the mechanical chassis, and an insulating film (I:1) is formed on this adhesive layer I.

Then, a [conductor circuit (1s8) t- is formed via this insulating film asK and other adhesive layer (14).In this case as well,
Conductor circuit with conductor foil Qi & - etching (1!!a)
form. Then, a solder resist (not shown) is formed to insulate the conductor circuit (15a).

In this example, as described later, kII adhesion Q, (14) t-
There is a certain degree of mold in that the material is hardened after bending and left in a semi-hardened state during bending.

The material (l1m) used is a plastic metal or synthetic resin, such as aluminum. Paper, polyester, polyimide can be used as the insulating film.

Use fluorinated ethylene propylene or the like. and adhesive layer α
a, Q4) is epoxy nitrile 2. Epoxy polyamide, phenol petral, etc. can be used.

Although an ultraviolet-curable resin or an electron beam-curable resin may be used, in this example, a thermosetting resin is used.

The thickness of these adhesive layers ua, (14) is 110l1 or more.

To manufacture Example 1, the steps shown in FIG. 7 are performed sequentially. That is, wood (11 ri), adhesive layer α ri.

Laminate the insulating film α, the adhesive layer I, and the conductor foil a9, and punch it out as shown in Figure H4 AiC^0 After this, temporarily place it in an atmosphere of 60°C to IH°C for about 10 minutes, for example. (mouth). This is a semi-cured adhesive layer a
This is because preheating is performed to reduce the viscosity of a-. And like this, the adhesive layer Q is removed.

[4] After preheating, bending is performed as shown in Diagram 8 BK. A phenomenon occurs. For this reason, excessive tension is not applied to the conductor circuit (15a).For example, if the conductor circuit (15m) is made of electrolytic steel, its elongation rate is at its limit of 5%; It is possible to prevent the conductor circuit (1!!a) from twisting or breaking due to a slipping phenomenon occurring beforehand.

Furthermore, during the bending process Ilc, there is a possibility that the thickness of the adhesive layer a3, (13) becomes smaller.In order to cope with this problem, insulating films a, it' are provided in this example. Accordingly, the material (1a) and the conductor circuit (15m)
This ensures that an insulating distance can be maintained between the two.

In addition, when the material (lla) is not a metal but a synthetic resin, this bending process is performed by heating at K 150'C to 200'C.

After bending in step 5, heat treatment is performed to form adhesive layers AS and ant-a. At this time, if heating is performed gradually at 80°C for 2 hours, 10G'Ct-2 hours, and 120°C for 2 hours, the adhesive layer will be 0. It allows a great deal of degassing and improves insulation.

As mentioned above! c1 According to the wiring board of the present invention.

Before bending, an insulating layer is used that is semi-cured and then hardened after bending, so when bending is performed to form a bend, even if the KR is small, the conductor circuit will be disconnected. Never. Therefore, it is extremely advantageous.

-...1 Note that the present invention is not limited to the above-mentioned embodiments,
Various changes can be made without departing from the gist.

For example, K as shown in Figure 119.

Adhesive layer a between the material (l1m) and the conductor circuit (ISa)
Time.

Forms fins. Then, the adhesive layer (2) on the material (lla) is hardened before bending, and the conductor circuit (is
a) The adhesive layer of the groove may be set in a semi-hardened state upon bending. In this case, the conductor circuit (15 m) is caused by a sliding phenomenon at the interface between the adhesive layer a7) and the conductor circuit (15 m).
51 can be prevented from being subjected to excessive tension. Therefore, a distance of 1 meter can be avoided. On the other hand, since the adhesive layer a*t has already been hardened during the bending process, a sufficient insulation thickness can be ensured even during the bending process, and a sufficient withstand voltage can be ensured. In this example, the thickness l of the adhesive layer aη was set to be 1071 m or more, and the thickness t of the adhesive layer afa was set to be 1 μm or more.

A comparison was made between this llGa1 example and a conventional wiring board, and it was found that this llGa1 example had an excellent effect. In other words, 1.0 for one example material (l1m)
■Thickness of 5052 (JIB) Alden Ecum, used as conductor foil ms, ij Peng thickness, zso ℃, IH annealing vm -, non-use, *PIj4ae thickness of 20μm, adhesive layer aη The thickness was set at 40 .mu.m, and the thickness was varied within the range of 1.0 to 4.0 .mu.m.

In addition, the temperature of preheating B in Figure 7 was set to 80°C. The previous product is shown in Figure 2, and the material (1m)
As 1.0 5052 (JIB) full i
25μm thick as conductor foil (3a)
The adhesive layer (2) was made to have a thickness of 4Ssrn.

A rolled steel foil and an electrolytic steel foil were used as the copper foil, and the results shown in Table 1 were obtained for each. Here, X is 1liI
Δ indicates a state with cracks, and O indicates a state without cracks. If there are cracks, there is a risk of disconnection due to thermal shock, etc.

゛As is clear from this Table 1, in the example of Figure 8.

Both electrolytic steel foil and pressed copper foil are 1.0-IIR&'
Can be made smaller.

[Brief explanation of the drawing]

Figure FA1 is a perspective view to explain the main koji-goku. Figure M2 is a sectional view showing a conventional example. Figure 319a is a construction diagram to explain the conventional example. Figures 4#A and 5 are both Similar cross-sectional views, Group 651 is a cross-sectional view showing one embodiment of this wiring board, and FIG.
The chart and stripe 8 are similar perspective views, and the MS diagram is a cross-sectional view showing another example of the present IE* wiring board. (l1m) is the mechanical chassis material, Ql, a4) is the adhesive layer, fi is the insulating film, and (15m) is the conductor circuit. Same as Matsuchen Hidemori・I ′sa-・・-′j

Claims (1)

[Claims] A conductor circuit is formed on the substrate, and a part of the wiring is
In the substrate, the bent portion (before being bent and stretched, at least one layer of insulating layer, which is formed by applying a hardening treatment 11 after bending with a semi-hardened wire), the conductive circuit is formed on the substrate.1- *Moldy printed circuit board.