JP3356103B2 - Printed wiring board manufacturing method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method for manufacturing a printed wiring board and a printed wiring board. In particular, the present invention relates to a printed wiring board in which benzocyclobutene resin (hereinafter, referred to as “BCB resin”) or the like can be used as an insulating layer, and a method for manufacturing the same.

[0002]

2. Description of the Related Art Conventionally, a printed wiring board using a BCB resin, which is a low dielectric constant resin, is shown in FIG. 5 of the drawings as an example, and has been manufactured as follows. FIG.
BCB resin layer 11 is a cured BCB resin layer, on which a sputtered copper layer 10 and a plated copper foil 9 are formed. In the following description, the BCB resin layer before curing is used.
The reference numeral “11” is also given to those on which the resin layer, the plated copper foil 9 and the sputtered copper layer 10 are not formed.

[0003] First, a core for a printed wiring board, FR-
Base copper foil 12 of base material composed of 4 cores 13 and base copper foil 12
A BCB resin is applied in a thin film form by spin coating or the like on the surface on the side where the BCB resin is present to form a BCB resin layer (before curing) 11. Is formed to form a concave depression. Note that the "F
R-4 "is based on the NEMA (American Electrical Manufacturers Association) standard.

Thereafter, the BCB resin layer (before curing) 11 is cured in a curing furnace in a nitrogen (N ₂ ) atmosphere, and the surface of the base copper foil 12 in the concave shape and the surface of the BCB resin layer therearound are cured. Then, after forming the sputtered copper layer 10 by the sputtering method, the plated copper foil 9 is formed on the surface of the sputtered copper layer 10. As a result, as shown in part C of FIG. 5, the VIA connecting the base copper foil 12 at the bottom of the concave depression of the BCB resin layer 11 and the surface layer around the depression is formed.
(Via hole) 8 was formed.

[0005]

However, according to the above-mentioned conventional manufacturing method, the following problems occur.

The first problem is that the BCB resin layer (before curing)
Is difficult to form with a desired thickness, in particular, it is difficult to form a thicker layer with a desired thickness. The reason is that a BCB resin must be applied to the substrate by spin coating to form a BCB resin layer (before curing).

A second problem is that a curing step using a curing furnace in a nitrogen (N ₂ ) atmosphere must be provided only for curing the BCB resin layer. The reason is that it is necessary to cure the BCB resin layer (before curing) in order to provide a predetermined strength for handling in a later step,
This is because it is necessary to prevent oxidation of the BCB resin layer during curing.

A third problem is that it is necessary to form a sputtered copper layer 10 by a sputtering method as a pretreatment for facilitating the formation of a plated copper foil on the entire surface of the BCB resin layer 11. The reason is BCB
This is because it is very difficult to deposit the plated copper foil 9 directly on the surface of the resin layer 11.

Accordingly, the present invention has been made in view of the above problems, and provides (1) a method of manufacturing a printed wiring board which can manufacture an insulating resin layer with a desired thickness. This is the first purpose. Also, the present invention
(2) A method for manufacturing a printed wiring board which can be manufactured without necessarily providing a hardening step using a hardening furnace in a nitrogen (N ₂ ) atmosphere just to completely harden the insulating resin layer without oxidizing the insulating resin layer. The second purpose is to provide. Further, the present invention provides (3) a printed wiring that can be manufactured by forming a plated conductor layer on an insulating layer where formation of the plated conductor layer is difficult, without requiring pretreatment for forming the plated conductor layer. A third object is to provide a board and a method for manufacturing the board.

[0010]

According to a first method of manufacturing a printed wiring board of the present invention, which achieves the first object, a base material having a printed wiring board core and a conductive layer; And a laminate including a temporarily cured insulating resin film fixed and laminated to the conductor film, and pressure-bonded to have the conductor layer of the base material as an interlayer conductor layer as an inner layer, and to laminate the conductor film of the laminate at the end. The method includes at least a pressure bonding step of obtaining a multilayer substrate having an outer layer, wherein the insulating resin film is difficult to form a plated conductor layer at least as much as a benzocyclobutene resin.

A second method of manufacturing a printed wiring board according to the present invention, which achieves the second object, comprises a substrate having a printed wiring board core and a conductive layer, a conductive film and a conductive film fixed to the conductive film. The laminate including the temporarily cured insulating resin film to be pressed,
Have a crimping step of obtaining a multilayer substrate having a conductive film of the laminate as an outermost layer and having the conductor layers of the substrate as an interlayer conductor layer is an inner layer, a conductor having a coating of an insulating resin
The film is temporarily cured at a temperature at which the insulating resin does not deteriorate,
The laminate forming step of obtaining the laminate is performed before the pressure bonding step.
To have, the insulating resin layer is characterized by formation of at least a benzocyclobutene resin comparable to plating the conductive layer is difficult.

According to a third method of manufacturing a printed wiring board of the present invention for achieving the third object, at least benzocyclo
A plating conductor layer is grown on the conductor layer of the multilayer substrate having at least one pair of conductor layers and a printed wiring board core laminated through an insulating layer in which the formation of a plating conductor layer is as difficult as the butene resin , At least a plating step of forming a plated conductor layer that connects the at least one pair of conductor layers is provided.

A printed wiring board of the present invention that achieves the third object is a printed wiring board having a printed wiring board core, an insulating layer, and a conductor layer, wherein at least one of the insulating layers is At least same as benzocyclobutene resin
A difficult insulating layer formed of the plating conductor layer to the extent of at least one pair conductor layer forming the <br/>-out conductor layer Tsu order are stacked through a difficult said insulating layer is connected by a plated conductor layer It is characterized by having been done. In the following, "It is difficult to form a plated conductor layer
"Difficult insulating layer" means "at least benzocyclobutene resin
An insulating layer that is as difficult to form a plated conductor layer as
It is.

[0014]

Embodiments of the present invention will be described below.

[Method of Manufacturing First and Second Printed Wiring Boards] In the first method of manufacturing a printed wiring board according to the present invention, the press-bonding step includes the steps of: A conductor film and a laminate including an insulating resin film laminated on the conductor film are pressure-bonded, and the conductor layer of the base material is provided as an interlayer conductive layer which is an inner layer, and the conductor film of the laminate is provided as an outermost layer. This is a step of obtaining a multilayer substrate.

According to a second method of manufacturing a printed wiring board of the present invention, as a laminate used for crimping in the pressing step in the first method of manufacturing a printed wiring board of the present invention, a conductive film and a temporary fixed to the conductive film are fixed. A laminate including a cured insulating resin film is used. An embodiment of such a method for manufacturing the first and second printed wiring boards is as follows.

The substrate having the printed wiring board core and the conductor layer can have at least one printed wiring board core and at least one conductor layer. The laminate including the conductor film and the insulating resin film laminated on the conductor film can have at least one conductor film, and can have at least one insulating resin film. The laminate including the conductive film and the temporarily cured insulating resin film fixed to the conductive film may have at least one conductive film, and may have at least one temporarily cured insulating resin film.

The substrate and the laminate are preferably pressure-bonded by a lamination press. The pressure at the time of pressure bonding is set to a pressure at which the substrate and the laminate can be sufficiently fixed, and heating or heating can be performed so as not to adversely affect the substrate and the laminate. .

In the first and second methods for manufacturing a printed wiring board according to the present invention, a laminate is obtained by temporarily curing a conductive film having a coating of an insulating resin at a temperature at which the insulating resin does not deteriorate. A step may be included before the crimping step. When using BCB resin as the insulating resin,
For example, temporary curing can be performed without heating by heating at 150 to 170 ° C. in the atmosphere.

In a laminate including a conductor film and an insulating resin film laminated on the conductor film, the thickness of the conductor film and the thickness of the insulating resin film respectively depend on the structure of the printed wiring board to be manufactured. Can be set appropriately. The thickness of the conductive film and the thickness of the insulating resin film in the laminate including the conductive film and the temporarily cured insulating resin film fixed to the conductive film are respectively the structure of the printed wiring board to be manufactured. Can be set appropriately according to the conditions.

In the first and second methods of manufacturing a printed wiring board according to the present invention, the step of forming a conductive circuit and the step of plating can be provided after the step of crimping. The conductor circuit forming step is a step of forming a conductor circuit layer from a conductor film that is the outermost layer of the multilayer substrate. The plating step is a step of forming a plated conductor layer that connects an end surface of the interlayer conductor layer in the multilayer substrate to the conductor film or conductor circuit layer that is the outermost layer. The conductor circuit forming step may be provided before the plating step.

The second method of manufacturing a printed wiring board according to the present invention may include a heat treatment step after the pressure bonding step, and the deterioration of the temporarily cured insulating resin film is prevented by taking advantage of the heat treatment step. In this way, the temporarily cured insulating resin film can be completely cured.

In the first and second methods of manufacturing a printed wiring board of the present invention, a low dielectric constant resin such as a BCB resin can be used as a material of the insulating resin film. The manufacturing method of the present invention can also be applied to the case where it is difficult for the insulating resin film to form a plated conductor layer.

[Third Method of Manufacturing Printed Wiring Board] The third method of manufacturing a printed wiring board of the present invention is characterized in that at least one pair of conductor layers laminated via an insulating layer in which formation of a plated conductor layer is difficult. At least a plating step of growing a plated conductor layer on the conductor layer of the multilayer substrate having a printed wiring board core and forming a plated conductor layer connecting the at least one pair of conductor layers is provided.

As an insulating layer in which it is difficult to form a plated conductor layer, for example, there is an insulating layer in which part or all is made of BCB resin or the like. Examples of the plating include electroplating and electroless plating.

As the multilayer substrate, the first substrate of the present invention is used.
Alternatively, a multilayer substrate that can be obtained in a pressure bonding step in the second method for manufacturing a printed wiring board can be used. The multilayer substrate may have a hole. The “hole” includes both a through hole penetrating in the thickness direction of the multilayer substrate and a bottomed hole having a bottom without penetrating.

On the inner wall surface of the hole of the multilayer board, the inner wall surface of each hole of the core for the printed wiring board, the conductor layer, and the insulating layer can be exposed. At least a part of the inner wall surface of the hole of the multilayer substrate can expose the inner wall surface of the hole of the insulating layer (preferably, the through hole of the insulating layer). The multilayer substrate can have a printed wiring board core having two or more layers, if necessary.

The pair of conductor layers may be an interlayer conductor layer between a printed wiring board core and an insulating layer where it is difficult to form a plated conductor layer, and a conductor layer laminated as the outermost layer on the insulating layer. Can be.

When the conductor layer in the multilayer substrate exists between the layers, a plated conductor layer can be grown on an end face of the conductor layer. The “end surface” includes the inner wall surface of the hole.

The plated conductor layer can be formed on the inner wall surface of the hole of the insulating layer. The hole of the insulating layer may be a through hole.

According to the third method of manufacturing a printed wiring board of the present invention, the insulating layer in which the formation of the plated conductor layer is difficult is performed, for example, by using BC
The present invention can also be applied to a case of a low dielectric constant resin such as a B resin or a case of a temporarily cured insulating resin layer.

[Printed Wiring Board] The printed wiring board of the present invention is a printed wiring board having a printed wiring board core, an insulating layer, and a conductive layer, wherein at least one of the insulating layers is a plated conductive layer. Are formed, and at least one pair of conductor layers laminated via the insulating layer, on which the plated conductor layer is difficult to form, are connected by a plated conductor layer.

[0033] The multilayer substrate may have a hole. The hole may be a through hole penetrating in the thickness direction of the multilayer substrate, or may be a bottomed hole having a bottom without penetrating. On the inner wall surface of the hole of the multilayer substrate, the inner wall surface of each hole of the core for the printed wiring board, the conductor layer, and the insulating layer can be exposed as necessary. Preferably, the inner wall surface of the hole of the insulating layer is exposed on the wall surface of the hole of the multilayer substrate. The multilayer substrate can have a printed wiring board core having two or more layers, if necessary.

The plated conductor layer may be provided so as to cover at least a part or all of the inner wall surface of the hole, and further, to the periphery of the opening of the hole.

[0035] The plated conductor layer may be provided so as to cover the inner wall surface of the hole of the insulating layer. The hole of the insulating layer may be a through hole.

The pair of conductor layers may be an interlayer conductor layer between the printed wiring board core and an insulating layer where it is difficult to form a plated conductor layer, and an outermost conductor layer. The plated conductor layer can be formed on an inner wall surface of a hole of the insulating layer where formation of the plated conductor layer is difficult. At least a part or all of the insulating layer can be made of a low dielectric constant resin such as a benzocyclobutene resin.

[0037] The plated conductor layer can be formed on an inner wall surface of a through hole of the insulating layer where it is difficult to form the plated conductor layer.

The end surface of the interlayer conductor layer may constitute at least a part of an inner wall surface of a through hole or a bottomed hole, and at least a part of the inner wall surface is covered with the plating conductor layer. can do. The plating conductor layer may be provided so as to be connected to an end face of the interlayer conductor layer.

Hereinafter, the first to third methods of manufacturing a printed wiring board of the present invention and the printed wiring board core, insulating resin film and insulating layer, conductive film and conductive layer in the printed wiring board will be described.

[Core for Printed Wiring Board] The core for a printed wiring board may be any of those conventionally used as a core for a printed wiring board. One example of the core is made of fiber such as glass fiber and resin. For example, there is a glass fiber substrate impregnated with a resin such as an epoxy resin such as an epoxy resin varnish.

[Insulating Resin Film and Insulating Layer] As the material of the insulating resin film and the insulating layer, a low dielectric constant resin such as a BCB resin is preferably used. By using a low dielectric resin for the material of the insulating resin film and the insulating layer, it is possible to provide a printed wiring board having a structure that reduces loss in a high-frequency circuit, such as a printed wiring board of a wireless device or the like. .

[Conductive Film and Conductive Layer] The conductive film and the conductive layer can be made of a material having electrical conductivity. The conductor layer can be a conductor circuit layer as needed.

[0043]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS [Configuration of Embodiment] An embodiment of the present invention will be described below with reference to FIGS. FIG. 1 is a sectional view in the thickness direction of a part of a printed wiring board that can be manufactured by the manufacturing method of the present invention. FIG. 2 is an enlarged view of a portion corresponding to the portion A in FIG. FIG. 3 is a cross-sectional view of a part of a copper foil with a resin layer, which is a laminate of a BCB resin layer 2 and a copper foil 3 obtained by applying a BCB resin to a copper foil, which can be used in the manufacturing method of the present invention. It is. FIG. 4 shows the plated copper layer 4
FIG. 3 is a cross-sectional view in the thickness direction of a part of a multilayer substrate of an example before forming a substrate.

As shown in FIG. 1, a printed wiring board according to one embodiment which can be manufactured by the manufacturing method of the present invention comprises a single FR-4 core 6 which is a core for a printed wiring board, and an insulating layer. It has two BCB resin layers 2 and two base copper foils 5 as interlayer conductive layers existing between the FR-4 core 6 and the BCB resin layer 2. The BCB resin layer 2 is difficult to form a plated conductor layer, and has a copper foil 3
And a plated copper layer 4 for connecting the end face of the base copper foil 5 as an interlayer conductor layer and the copper foil 3 as an outer conductor layer.
The plated copper layer 4 is formed on the inner wall surface of the through hole and the surface of the copper foil of the multilayer substrate shown in FIG.

As shown in FIG. 1, the printed wiring board according to the embodiment of the present invention has a T / H (through hole) 1 whose inner wall surface is a plated copper layer. End face of copper foil 3, BCB resin layer 2
, The entire surface of the inner wall surface of the through hole composed of the end surface of the FR-4 core 6, the end surface of the base copper foil 5, and the surface of the copper foil 3 around the opening of the through hole. I have. That is, the shape of the plated copper layer 4 is a substantially tubular body having two open ends, and each of the open ends has an annular plate extending radially outward.

[Manufacturing Method] Next, a method of manufacturing the printed wiring board shown in FIG. 1 will be described. The base copper foil of the inner base material composed of the FR-4 core and the base copper foil is patterned by etching to form an inner base material having a desired conductor circuit. The BC shown in FIG.
Lamination is performed by a lamination press in a direction in which the resin surfaces of the copper foil 3 with the B resin layer 2 are overlapped to form a multilayer substrate. The copper foil 3 with the BCB resin layer 2 can be manufactured by applying a BCB resin to a copper foil and temporarily curing the same at 150 to 170 ° C. in the air. A through hole is formed by drilling at a desired position on the formed multilayer substrate, and a multilayer substrate having a through hole shown in FIG. 4 is formed.

A plated copper layer is formed on the inner wall surface of the through hole of the multilayer substrate having the through hole shown in FIG. 4 and on the surface of the outermost copper foil 3 of the multilayer substrate. T / which can be electrically connected to the through hole by connecting with the plated copper layer
H.

In particular, although it is extremely difficult to deposit plated copper on the end surface of the BCB resin layer 2 in the portion B shown in FIG. 2, the end surface of the base copper foil 5 and the plated copper 4 deposited on the copper foil 3 grow. The base copper foil 5 and the copper foil 3 are electrically connected to form a conductor circuit together with the inner and outer layer circuits.

As described above, by forming a copper foil with a resin by coating a copper foil with a BCB resin, which is originally extremely difficult to deposit plated copper, lamination by a lamination press becomes possible, and Conductive circuits can be formed on the surface of the BCB resin. In addition, it is possible to form a T / H (through hole) by applying plated copper to a through-hole formed by drilling, and to provide a printed wiring board excellent in high frequency characteristics using a BCB resin as an insulating layer. This has the effect of improving the performance of wireless devices and the like.

[Other Embodiments of the Invention] The present invention is not limited to the above-described embodiment, but may be applied to a low-loss printed wiring board in a high-frequency circuit that does not use T / H. Can be.

[0051]

The first effect of the first method for manufacturing a printed wiring board of the present invention is that a printed wiring board can be manufactured by forming an insulating resin layer to a desired thickness. This means that the layers can be formed thicker at the desired thickness to produce a printed wiring board.

The reason is that the first method for manufacturing a printed wiring board according to the present invention is that the base material having the printed wiring board core and the conductive layer, the conductive film, and the conductive film are fixedly laminated to the conductive film.
A laminate including a temporarily cured insulating resin film is compression-bonded to obtain a multilayer substrate having the conductor layer of the base material as an interlayer conductive layer which is an inner layer and having a conductor film of the laminate as an outermost layer. This is because the insulating resin film has at least the same difficulty as that of the benzocyclobutene resin in forming the plated conductor layer.

That is, the insulating resin film in the laminate including the conductive film and the insulating resin film laminated on the conductive film can be formed by using a film forming method or a film forming apparatus other than the spin coating method. Therefore, for example, it is possible to use a film forming apparatus capable of accurately forming an insulating resin film on a conductive film with a desired thickness, so that the insulating resin film can be formed on the conductive film with a desired thickness. it can. Further, for example, it is possible to use a film forming apparatus that can form a conductive film by laminating a plurality of insulating resin films accurately at a desired thickness, so that the insulating resin film is formed to have a desired thickness. Can be membrane.

The effect of the second method for manufacturing a printed wiring board of the present invention is that the printing method does not necessarily require a curing step using a curing furnace in a nitrogen (N ₂ ) atmosphere just for curing the insulating resin layer. That is, a wiring board can be manufactured.

The reason is that the second method for manufacturing a printed wiring board according to the present invention employs a method in which a base having a printed wiring board core and a conductive layer, a conductive film, and a temporary cured film fixed to the conductive film. and a laminate including an insulating resin film, and pressed to have a bonding process to obtain a multi-layer substrate having a conductive film of the laminate as an outermost layer and having the conductor layers of the substrate as an interlayer conductor layer is an inner layer, The conductor film having the insulating resin coating is insulated.
Preliminary curing at a temperature at which the resin does not deteriorate to obtain the laminate
This is because the laminated body forming step is provided before the pressure bonding step, so that the insulating resin film is difficult to form a plated conductor layer at least as much as the benzocyclobutene resin.

That is, in the second method of manufacturing a printed wiring board of the present invention, a laminate including a conductive film and a temporarily cured insulating resin film fixed to the conductive film is used. Since the insulating resin film of this laminate is only temporarily cured, it can be manufactured without deteriorating (oxidizing, etc.) the insulating resin even when it is manufactured by heating in an air atmosphere. Further, since the insulating resin film is temporarily cured, the insulating resin film has such a strength that it can be handled in a process subsequent to the pressure bonding process.

For this reason, the temporarily cured insulating resin film is formed in any one of the steps after the pressure bonding step.
A heat treatment step after which the temporary curing of the insulating resin film can be completely cured without altering its original purpose except for the complete curing of the insulating resin film, for example, to completely cure the insulating resin film By taking advantage of a heat treatment step performed in an atmosphere that is at a sufficient temperature and does not deteriorate, the insulating resin film can be completely cured without being deteriorated.
As such a heat treatment step, for example, there is a heat treatment step under reduced pressure or vacuum performed in the final stage of manufacturing a printed wiring board.

Therefore, in the second method of manufacturing a printed wiring board of the present invention, a curing furnace in a nitrogen (N ₂ ) atmosphere is used only to completely cure the insulating resin layer without deteriorating such as oxidation. It is possible to manufacture a printed wiring board without having to provide a curing step.

The effect of the third method for producing a printed wiring board of the present invention is that the pretreatment for forming the plated conductor layer is not essential, and the plated conductor layer is formed on the insulating layer where the formation of the plated conductor layer is difficult. That is, the printed wiring board can be manufactured.

The reason is that the third method for manufacturing a printed wiring board of the present invention has at least one pair of conductor layers and a core for a printed wiring board which are laminated via an insulating layer in which formation of a plated conductor layer is difficult. This is because at least a plating step of growing a plated conductor layer on the conductor layer of the multilayer substrate and forming a plated conductor layer connecting the at least one pair of conductor layers is provided.

The effect of the printed wiring board of the present invention is that it is possible to manufacture a printed wiring board by forming a plated conductive layer on an insulating layer where formation of the plated conductive layer is difficult, without requiring pretreatment for forming the plated conductive layer. It is possible to do.

The reason is that the printed wiring board of the present invention
A printed wiring board having a printed wiring board core, an insulating layer, and a conductive layer, wherein at least one of the insulating layers is an insulating layer in which formation of a plated conductive layer is difficult, and formation of the plated conductive layer. This is because at least one pair of conductor layers laminated via an insulating layer, which is difficult to perform, is connected by a plated conductor layer. That is, the printed wiring board of the present invention can be manufactured by the third method for manufacturing a printed wiring board of the present invention.

[Brief description of the drawings]

FIG. 1 is a sectional view in the thickness direction of a part of a printed wiring board according to an embodiment of the present invention.

FIG. 2 is an enlarged view of a portion corresponding to a portion A in FIG. 1;

FIG. 3 is a cross-sectional view of a part of the copper foil with a resin layer.

FIG. 4 is a cross-sectional view in the thickness direction of a part of an example of a multilayer substrate before forming a plated copper layer 4 in the manufacturing method of the present invention.

FIG. 5 is a sectional view of a part of a conventional printed wiring board.

[Explanation of symbols]

 Reference Signs List 1 T / H 2 BCB resin layer 3 Copper foil 4 Plated copper layer 5 Base copper foil 6 FR-4 core 8 VIA 9 Plated copper foil 10 Sputtered copper layer 11 BCB resin layer 12 Base copper foil 13 FR-4 core

──────────────────────────────────────────────────続 き Continued on front page (58) Field surveyed (Int. Cl. ⁷ , DB name) H05K 3/46

Claims (15)

(57) [Claims] 1. A substrate having a core for a printed wiring board and a conductor layer, a temporary film fixed to and laminated to the conductor film and the conductor film.
A laminate including the converted insulating resin film, and at least a crimping step of obtaining a multilayer substrate having the conductive layer of the base material as an interlayer conductive layer as an inner layer and having the conductive film of the laminate as an outermost layer. A method for manufacturing a printed wiring board, wherein the insulating resin film is difficult to form a plated conductor layer at least as much as a benzocyclobutene resin. 2. A substrate comprising a core for a printed wiring board and a conductor layer, and a laminate comprising a conductor film and a temporarily cured insulating resin film fixed to the conductor film are pressure-bonded to each other. Pressure-bonding step of obtaining a multilayer substrate having the above-described conductor layer as an inner-layer interlayer conductor layer and also having the conductor film of the laminate as the outermost layer
Have a, a conductive film having a coating of insulating resin said insulating resin is deteriorated
Laminate forming process of temporarily curing at a non-existent temperature to obtain the laminate
A process prior to the pressing step, wherein the insulating resin film is at least as difficult to form a plated conductor layer as a benzocyclobutene resin. 3. The method according to claim 1, wherein the step of forming the laminate comprises :
Temporarily hardens a conductor film having a coating film of resin at 150 to 170 ° C.
3. The method for producing a printed wiring board according to claim 2, wherein the step is a laminate forming step of forming the laminate by forming the laminate . 4. The method according to claim 1, wherein a conductor circuit forming step of forming a conductor circuit layer from a conductor film that is an outermost layer of the multilayer substrate is provided after the crimping step. The method for producing a printed wiring board according to the above. 5. An electroplating method according to claim 1, wherein an end surface of said interlayer conductive layer and said outermost conductive film or conductive circuit layer in said multilayer substrate are plated.
A body layer is grown, and the end face of the interlayer conductive layer and the conductive film or
The method for manufacturing a printed wiring board according to any one of claims 1 to 4, further comprising a plating step of forming a plated conductor layer for connecting to the conductor circuit layer after the pressing step. 6. A heat treatment step after the pressure bonding step, wherein the heat treatment step is piggybacked to completely cure the temporarily cured insulating resin film while preventing deterioration of the temporarily cured insulating resin film. The method for manufacturing a printed wiring board according to claim 2, wherein: 7. The insulating resin film according to claim 1, wherein at least
The method for manufacturing a printed wiring board according to any one of claims 1 to 6, wherein it is difficult to form a plated copper layer as much as butene resin . 8. At least as much as a benzocyclobutene resin
A plated conductor layer is grown on the conductor layer of a multilayer substrate having at least one pair of conductor layers and a printed wiring board core, which are laminated via an insulating layer which is difficult to form each time. A method for manufacturing a printed wiring board, comprising at least a plating step of forming a plated conductor layer for connecting said conductor layers. 9. conductor layer of said pair, wherein, wherein the interlayer conductive layer between the insulating layer and the printed circuit board core, that the conductor layer to be laminated as an outermost layer on the insulating layer Item 10. The method for producing a printed wiring board according to item 8. 10. The method for manufacturing a printed wiring board according to claim 8, wherein the plated conductor layer is formed on the inner wall surface of the hole of the insulating layer. 11. Before Kize' edge layer manufacturing method of the printed wiring board according to any one of claims 8 to 10, characterized in that the temporarily cured insulating resin layer. 12. A printed wiring board having a printed wiring board core, an insulating layer, and a conductor layer, wherein at least one of the insulating layers is at least benzosic.
Formation of the plating conductor layer to the same extent as Robuten resin is difficult insulating layer, at least one pair conductor layer formation because Kki conductive layers are laminated through a difficult said insulating layer is connected by a plated conductor layer A printed wiring board characterized by being made. 13. conductor layer of the pair, and wherein an interlayer conductor layer between the forming of the printed wiring board core and plating the conductive layer is difficult the insulating layer, that the conductive layer of the outermost layer The printed wiring board according to claim 12, wherein 14. The plating conductor layer according to claim 12, wherein the plating conductor layer is formed on an inner wall surface of a hole of the insulating layer where it is difficult to form the plating conductor layer. Printed wiring board. 15. The printed wiring board according to claim 12, wherein at least a part of said insulating layer in which formation of a plated conductor layer is difficult is made of a benzocyclobutene resin.