JPS58134456A - Ic card - Google Patents
Ic cardInfo
- Publication number
- JPS58134456A JPS58134456A JP57016589A JP1658982A JPS58134456A JP S58134456 A JPS58134456 A JP S58134456A JP 57016589 A JP57016589 A JP 57016589A JP 1658982 A JP1658982 A JP 1658982A JP S58134456 A JPS58134456 A JP S58134456A
- Authority
- JP
- Japan
- Prior art keywords
- card
- modules
- module
- information
- cards
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 claims abstract description 8
- 230000002950 deficient Effects 0.000 abstract 1
- 239000004593 Epoxy Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/072—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising a plurality of integrated circuit chips
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】 本発明はＩＣカードに関する。[Detailed description of the invention] The present invention relates to an IC card.
近年マイクロコンピュータ、メモリー等の１Ｃチツプを
装着もしくは内蔵させたチップカード、メモリーカード
、マイコンカード、電子カードなどと呼ばれるカード（
以下ＩＣカードという）の研究がなされている。In recent years, cards called chip cards, memory cards, microcomputer cards, electronic cards, etc. that are equipped with or have built-in 1C chips such as microcomputers and memory (
(hereinafter referred to as IC cards) is being researched.
このＩＣカードは従来の磁気ストライブカードに比べ、
その記憶容量が大きいことから銀行関係では預金通帳に
替り預貯金の履歴、クレジット関係では買物等の取引履
歴を記録・記憶させよつと考えられている。またこれら
金銭取引り
関係のみならず特殊■尋カードや音譬機器のメそり媒体
としても使用が検討さハている。Compared to conventional magnetic stripe cards, this IC card has
Due to its large storage capacity, it is considered to be used in banks to record and store the history of deposits and savings in place of passbooks, and in credit cards to record and store the history of transactions such as shopping. In addition to these financial transactions, their use is also being considered as a mesori medium for special cards and musical instruments.
ところで、従来、同一のＩＣモジュール内に複数個のＩ
Ｃチップを結線して設けたＩＣカードは存在するが、各
ＩＣチップを結線するため回路パターンが複雑になった
り、或いはどれか１個のＩＣモジュールが何んらかの原
因で破壊し、記憶データが消失した場合に各々のＩＣモ
ジュールが結線されているので、他のＩＣモジュールの
記憶データも共に消失する虞れが非常に高かった。又、
外力によるカードの曲げ等により前記結線が破断するこ
ともあり、この場合には、ＩＣモジュール自体は正常で
あっても作動させることが出来ないという問題があった
。By the way, conventionally, a plurality of I
There are IC cards that have C chips connected together, but the circuit pattern becomes complicated because each IC chip is connected, or one of the IC modules gets destroyed for some reason and the memory is lost. Since each IC module is wired together, there is a very high possibility that data stored in other IC modules will also be lost if data is lost. or,
The connection may break due to bending of the card due to external force, and in this case, there is a problem that the IC module itself cannot be operated even if it is normal.
前述の如＜ＩＣカードはその記憶容量が大きいことから
取引履歴（情報）を記憶させることが出来る為、現状の
ＣＤカードの如きオンライン方式ではなくオフライン方
式に多大なメリットがあるとされている。As mentioned above, since IC cards have a large storage capacity and can store transaction history (information), it is said that an offline system has a great advantage over the current online system such as the CD card.
しかしながら、もしＩＣモジュールが機能を停止するよ
うなことが発生したならば記憶情報の消失となり、カー
ド発行者に限らずカードユーザーにとっても多大なトラ
ブルとなってしまうであろう。However, if the IC module were to stop functioning, the stored information would be lost, which would cause great trouble not only to the card issuer but also to the card user.
本発明は、上記のような問題を解決すべく、カード基材
に、複数のＩＣモジュールを独立して設け、各々のＩＣ
モジュールを独立して機能させて、どれか１つのＩＣモ
ジュールが破壊されても他のＩＣモジュールは、正常に
作動するようにし、記憶させるべき情報の一部若しくは
全部を各ＩＣモジュール内のＩＣチップに重複して記憶
させて、信頼性を向上させるか或いは各ＩＣモジュール
内のＩＣチップに別々の情報を容易に記憶させることの
できるＩＣカードを提供することを目的とするものであ
る。In order to solve the above-mentioned problems, the present invention provides a card base material with a plurality of IC modules independently, and each IC
The modules are made to function independently so that even if one IC module is destroyed, the other IC modules can operate normally, and some or all of the information to be stored is stored on the IC chip in each IC module. It is an object of the present invention to provide an IC card that can store information redundantly to improve reliability, or can easily store separate pieces of information on IC chips in each IC module.
以下、本発明の実施例を内に基づいて説明する。Embodiments of the present invention will be described below.
第１図及び第２図（第１図のＡ−Ａ線拡大断面図）に示
すように、七ンンコア（ハ）の一部にＩＣモジュール＋
３１ 、 （３１が設けられ、父、前記センタコア（至
）の表面及び裏面（Ｆ、オーバーシート＠、α４が施さ
れ、更にセンタ→ア（至）とオーバーシートα４．α４
との間には印刷絵柄（４）が設けられて、本発明のＩＣ
カード（１）が構成されている。また、必要な場合は第
１図示の如く、エンボス文字（５ンを施すことも出来る
Ｇ
尚、上記各部の位置関係については特に限定するもので
なく、例えば＠３図の如く２つのＩＣモジュール（３）
、 ＋３）をカード基材（至）上に配設しても良い。As shown in Fig. 1 and Fig. 2 (enlarged cross-sectional view taken along the line A-A in Fig. 1), a part of the seven core (C) is equipped with an IC module +
31, (31 is provided, the front and back surfaces (F, oversheet @, α4) of the center core (to) are applied, and the center → A (to) and oversheet α4.α4 are applied.
A printed pattern (4) is provided between the IC of the present invention.
Card (1) is configured. In addition, if necessary, embossed letters (G) can be applied as shown in Figure 1. Note that the positional relationship of the above parts is not particularly limited. For example, as shown in Figure @3, two IC modules ( 3)
, +3) may be arranged on the card base material (to).
またＩＣモジュールの形状も特に限定される・ものでは
なく、更にＩＣモジュールの数も２つ以上であれば、い
くつでも良い。Further, the shape of the IC module is not particularly limited, and the number of IC modules may be any number as long as it is two or more.
工Ｃモジュール（３）について詳しく述べるならばＩ’
！４図の如くである。To discuss the engineering C module (3) in detail, I'
! As shown in Figure 4.
即ち、マイクロコンピュータ、メモリー等の工０チップ
（９）が上面を除いてエポキシ樹脂ａυに取り囲まれて
お（す、前記ＩＣチップ（９）の上面には、回路（７）
が設けられ、ＩＣチップ（９）と回路（７）はリード線
αＱに′よって結ばれており、一方ＩＣモジュール（３
） −面には外部接続端子が接する電極（６）が設け２
らｔｖ・：ており、該電極（６見回路（７）はガラユエ
ボキ、フ；：、・７．Ｉの基板（８） ４：よって保持
されていて、且つ電極（６）と回路（７）はスルーホー
ル（図示せず）によって導通している。又、ＩＣモジュ
ール（３）の製造時のエポキシ樹脂０の流れ止めとして
ＩＣモジュール（３）の側部にはガラスエポキシフィル
ムの枠＠が設けられている。以上のような構成からなる
ＩＣモジュール【３）は接着剤（至）によってカード基
材に）の凹部に取り付けられている。That is, a microcomputer, memory, etc. chip (9) is surrounded by an epoxy resin except for the top surface.The top surface of the IC chip (9) has a circuit (7).
The IC chip (9) and the circuit (7) are connected by lead wire αQ', while the IC module (3
) - side is provided with an electrode (6) that is in contact with an external connection terminal 2
7.I's substrate (8) 4:Therefore, the electrode (6) and the circuit (7) are held together, and the electrode (6) and the circuit (7) are electrically connected through through holes (not shown).Furthermore, a frame of glass epoxy film is provided on the side of the IC module (3) to prevent the epoxy resin from flowing during the manufacture of the IC module (3). The IC module [3] having the above structure is attached to the recess of the card base material with an adhesive.
ここに図示したものは硬質塩化ビニルのプラスチックカ
ード仕様でありセンタコア（至）とオーバーシート（ロ
）とからカード基材（至）が構成されているが、特にこ
の仕様に限定するものでない。The one shown here is a plastic card made of hard vinyl chloride, and the card base material (1) is composed of a center core (1) and an oversheet (2), but the card is not limited to this specification.
以上のような複数のＩＣモジュール（３）の各ＩＣチッ
プ（９）には、ＩＣカードに記憶させるべき情報の一部
若しくは全部を重複して記憶させるか、又は別々の情報
を記憶させても良い。尚、ＩＣモジュール内のＩＣチッ
プへの、情報の記憶方式は通常用いられている方式で行
なう。Each IC chip (9) of the plurality of IC modules (3) as described above may store some or all of the information to be stored in the IC card in duplicate, or may store separate information. good. Note that information is stored in the IC chip within the IC module using a commonly used method.
以上のように、本発明のＩＣカードは１枚のカード基材
上に複数のＩＣモジュールを独立して設けたものであり
、ＩＣカードに、外力が加わったり水分が侵入しても、
全てのＩＣモジュールが破壊される可能性は非常に低く
、又たとえいくつかのＩＣモジュールが破壊されても、
それによって他のＩＣモジュールに記憶されたデータが
消失したり、或いは、記憶されたデータが正常であって
も、外部へ呼出すことが出来なくなるということはない
。従って各ＩＣモジュール内のＩＣチップｌ二記憶させ
るべき情報の一部若しくは全部を重複して記憶させれば
、外力その他の原因でいくつかのＩＣモジュールが破壊
されて記憶データの呼出しが不可能になっても、最低１
つのＩＣモジュールが正常であれば、必要な情報を呼出
すことが出来るので従来のＩＣカードに比較して信頼性
が非常に向上する。又、本発明のＩＣカードはＩＣモジ
ュールを複数設けたので、各ＩＣモジュールに全く異な
った情報、例えば銀行関係では預貯金の履歴情報やクレ
ジット関係では買物等の取引き履歴情報等を記憶させる
ことも出来るので、１枚のＩ Ｃカードを複数の目的の
ために使用出来るという効果もある。As described above, the IC card of the present invention has a plurality of IC modules independently provided on one card base material, and even if an external force is applied to the IC card or moisture enters the IC card,
It is very unlikely that all IC modules will be destroyed, and even if some IC modules are destroyed,
As a result, data stored in other IC modules will not be lost, or even if the stored data is normal, it will not be possible to call it out. Therefore, if some or all of the information that should be stored on the IC chips in each IC module is stored redundantly, some of the IC modules may be destroyed by external force or other causes, making it impossible to recall the stored data. Even if it becomes, at least 1
If one IC module is normal, necessary information can be retrieved, so reliability is greatly improved compared to conventional IC cards. Furthermore, since the IC card of the present invention is provided with a plurality of IC modules, each IC module can store completely different information, such as history information of deposits and savings in the case of banks, transaction history information of shopping etc. in the case of credit cards, etc. This also has the effect of allowing one IC card to be used for multiple purposes.
図は本発明の工０カードを示しており、＠１図は本発明
の一実施例を示すＩＣカードの平面図、＠２Ｐｌ第１図
１７）Ａ−Ａ断面図、第３図は他の実施例を示すＩＣカ
ードの平面図、第４図はＩＣモジュールの構成を示すｌ
ｌＩ２図の部分拡大断面図である。
１・・・・・・・・・−Ｉ Ｃカード
３・・・・・・・・・・・・ＩＣモジュール５・・・・
・・・・・・・・エンボス文字６・・・・・・・・・・
・・電 極
９・・・・・・・・−・・・ＩＣチップ１１・・・・・
・・・・エポキシ潰脂
１４・・・・・・・・・オーバーシート１５・・・・・
・・・・センタコア
１６・・・・・・・・・カード基材
特許出願人 大日本印刷株式会社
代理人 弁理士 小 西 淳 美
ｍ
才２図The figure shows an IC card according to the present invention, @1 figure is a plan view of an IC card showing an embodiment of the present invention, @2Pl is a cross-sectional view taken along line 17) A-A, and figure 3 is a plan view of an IC card showing an embodiment of the present invention. A plan view of an IC card showing an embodiment, and FIG. 4 shows a configuration of an IC module.
FIG. 2 is a partially enlarged sectional view of FIG. 1......-IC card 3......IC module 5...
・・・・・・・・・Embossed character 6・・・・・・・・・・・・
・・Electrode 9・・・・・・・・−・IC chip 11・・・・
... Epoxy fat 14 ... Oversheet 15 ...
...Centacore 16 ...Card base material patent applicant Dai Nippon Printing Co., Ltd. Agent Patent attorney Atsushi Konishi Mim Sai 2
Claims (1)
とを特徴とするＩＣカード。An IC card characterized in that a plurality of ICC modules are independently provided on a card base material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57016589A JPS58134456A (en) | 1982-02-04 | 1982-02-04 | Ic card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57016589A JPS58134456A (en) | 1982-02-04 | 1982-02-04 | Ic card |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58134456A true JPS58134456A (en) | 1983-08-10 |
| JPH0241073B2 JPH0241073B2 (en) | 1990-09-14 |
Family
ID=11920459
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57016589A Granted JPS58134456A (en) | 1982-02-04 | 1982-02-04 | Ic card |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58134456A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62167679U (en) * | 1986-04-15 | 1987-10-24 | ||
| FR2604274A1 (en) * | 1986-09-22 | 1988-03-25 | Flonic Sa | ELECTRONIC MEMORY CARD WITH MULTIPLE FUNCTIONS AND DEVICES FOR PROCESSING THESE CARDS |
| FR2627880A1 (en) * | 1988-02-26 | 1989-09-01 | Sgs Thomson Microelectronics | Multi-function card which can be inserted in opposite senses - uses multiple integrated circuits in single card to implement different functions, selected by direction of card insertion |
| EP0387366A1 (en) * | 1987-10-30 | 1990-09-19 | DEUTSCHE BUNDESPOST, vertreten durch den Präsidenten des Fernmeldetechnischen Zentralamtes | Credit card incorporating integrated circuits |
| US5736781A (en) * | 1993-10-18 | 1998-04-07 | Oki Electric Industry Co., Ltd. | IC module and a data carrier employing the same |
| US5952713A (en) * | 1994-12-27 | 1999-09-14 | Takahira; Kenichi | Non-contact type IC card |
| US7293717B1 (en) * | 1999-12-17 | 2007-11-13 | Centre For Wireless Communications Of National University Of Singapore | Method for recovering information stored in a smart card |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5446447A (en) * | 1977-08-26 | 1979-04-12 | Cii | Portable data carrier for storing and processing data |
| JPS5556639A (en) * | 1978-10-19 | 1980-04-25 | Cii | Strip for carrying device for processing electric signal and method of manufacturing same |
| JPS5626451A (en) * | 1979-05-17 | 1981-03-14 | Gao Ges Automation Org | Identification card having ic chip and method of manufacturing same |
| JPS5680896A (en) * | 1979-12-03 | 1981-07-02 | Fujitsu Ltd | Main memory device information recovery system |
-
1982
- 1982-02-04 JP JP57016589A patent/JPS58134456A/en active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5446447A (en) * | 1977-08-26 | 1979-04-12 | Cii | Portable data carrier for storing and processing data |
| JPS5556639A (en) * | 1978-10-19 | 1980-04-25 | Cii | Strip for carrying device for processing electric signal and method of manufacturing same |
| JPS5626451A (en) * | 1979-05-17 | 1981-03-14 | Gao Ges Automation Org | Identification card having ic chip and method of manufacturing same |
| JPS5680896A (en) * | 1979-12-03 | 1981-07-02 | Fujitsu Ltd | Main memory device information recovery system |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62167679U (en) * | 1986-04-15 | 1987-10-24 | ||
| FR2604274A1 (en) * | 1986-09-22 | 1988-03-25 | Flonic Sa | ELECTRONIC MEMORY CARD WITH MULTIPLE FUNCTIONS AND DEVICES FOR PROCESSING THESE CARDS |
| EP0387366A1 (en) * | 1987-10-30 | 1990-09-19 | DEUTSCHE BUNDESPOST, vertreten durch den Präsidenten des Fernmeldetechnischen Zentralamtes | Credit card incorporating integrated circuits |
| FR2627880A1 (en) * | 1988-02-26 | 1989-09-01 | Sgs Thomson Microelectronics | Multi-function card which can be inserted in opposite senses - uses multiple integrated circuits in single card to implement different functions, selected by direction of card insertion |
| US5736781A (en) * | 1993-10-18 | 1998-04-07 | Oki Electric Industry Co., Ltd. | IC module and a data carrier employing the same |
| US5952713A (en) * | 1994-12-27 | 1999-09-14 | Takahira; Kenichi | Non-contact type IC card |
| US7293717B1 (en) * | 1999-12-17 | 2007-11-13 | Centre For Wireless Communications Of National University Of Singapore | Method for recovering information stored in a smart card |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0241073B2 (en) | 1990-09-14 |
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