JPS58134435A - ワイヤボンデイング方法 - Google Patents

ワイヤボンデイング方法

Info

Publication number
JPS58134435A
JPS58134435A JP57017256A JP1725682A JPS58134435A JP S58134435 A JPS58134435 A JP S58134435A JP 57017256 A JP57017256 A JP 57017256A JP 1725682 A JP1725682 A JP 1725682A JP S58134435 A JPS58134435 A JP S58134435A
Authority
JP
Japan
Prior art keywords
wire
clamper
tool
motor
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57017256A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0139212B2 (enrdf_load_stackoverflow
Inventor
Toru Takamura
徹 高村
Kiyoshi Chokai
鳥海　清
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP57017256A priority Critical patent/JPS58134435A/ja
Publication of JPS58134435A publication Critical patent/JPS58134435A/ja
Publication of JPH0139212B2 publication Critical patent/JPH0139212B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP57017256A 1982-02-05 1982-02-05 ワイヤボンデイング方法 Granted JPS58134435A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57017256A JPS58134435A (ja) 1982-02-05 1982-02-05 ワイヤボンデイング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57017256A JPS58134435A (ja) 1982-02-05 1982-02-05 ワイヤボンデイング方法

Publications (2)

Publication Number Publication Date
JPS58134435A true JPS58134435A (ja) 1983-08-10
JPH0139212B2 JPH0139212B2 (enrdf_load_stackoverflow) 1989-08-18

Family

ID=11938874

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57017256A Granted JPS58134435A (ja) 1982-02-05 1982-02-05 ワイヤボンデイング方法

Country Status (1)

Country Link
JP (1) JPS58134435A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109514016A (zh) * 2018-11-23 2019-03-26 重庆市金泽鑫科技有限公司 线路板微型刀具平焊方法及自动焊接机
US11420287B2 (en) * 2019-09-29 2022-08-23 Ningbo Shangjin Automation Technology Co., Ltd. Wire clamping system for fully automatic wire bonding machine

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109514016A (zh) * 2018-11-23 2019-03-26 重庆市金泽鑫科技有限公司 线路板微型刀具平焊方法及自动焊接机
US11420287B2 (en) * 2019-09-29 2022-08-23 Ningbo Shangjin Automation Technology Co., Ltd. Wire clamping system for fully automatic wire bonding machine

Also Published As

Publication number Publication date
JPH0139212B2 (enrdf_load_stackoverflow) 1989-08-18

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