JPH0139212B2 - - Google Patents

Info

Publication number
JPH0139212B2
JPH0139212B2 JP57017256A JP1725682A JPH0139212B2 JP H0139212 B2 JPH0139212 B2 JP H0139212B2 JP 57017256 A JP57017256 A JP 57017256A JP 1725682 A JP1725682 A JP 1725682A JP H0139212 B2 JPH0139212 B2 JP H0139212B2
Authority
JP
Japan
Prior art keywords
wire
tool
clamper
bonding
motor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57017256A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58134435A (ja
Inventor
Tooru Takamura
Kyoshi Chokai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP57017256A priority Critical patent/JPS58134435A/ja
Publication of JPS58134435A publication Critical patent/JPS58134435A/ja
Publication of JPH0139212B2 publication Critical patent/JPH0139212B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP57017256A 1982-02-05 1982-02-05 ワイヤボンデイング方法 Granted JPS58134435A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57017256A JPS58134435A (ja) 1982-02-05 1982-02-05 ワイヤボンデイング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57017256A JPS58134435A (ja) 1982-02-05 1982-02-05 ワイヤボンデイング方法

Publications (2)

Publication Number Publication Date
JPS58134435A JPS58134435A (ja) 1983-08-10
JPH0139212B2 true JPH0139212B2 (enrdf_load_stackoverflow) 1989-08-18

Family

ID=11938874

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57017256A Granted JPS58134435A (ja) 1982-02-05 1982-02-05 ワイヤボンデイング方法

Country Status (1)

Country Link
JP (1) JPS58134435A (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109514016A (zh) * 2018-11-23 2019-03-26 重庆市金泽鑫科技有限公司 线路板微型刀具平焊方法及自动焊接机
US11420287B2 (en) * 2019-09-29 2022-08-23 Ningbo Shangjin Automation Technology Co., Ltd. Wire clamping system for fully automatic wire bonding machine

Also Published As

Publication number Publication date
JPS58134435A (ja) 1983-08-10

Similar Documents

Publication Publication Date Title
US4603802A (en) Variation and control of bond force
US3954217A (en) Method and apparatus for bonding and breaking leads to semiconductors
US3863827A (en) Tailless wire bonder
US4053096A (en) Thermocompression welding device
JPH0139212B2 (enrdf_load_stackoverflow)
US4878609A (en) Apparatus for manual wire bonding
US4234117A (en) Vibration-free tailless wire bonder
JP2575066B2 (ja) 半導体組立装置
JP2627968B2 (ja) 半導体組立装置
JPS5919462B2 (ja) ワイヤボンデイング装置
JPS62179733A (ja) ワイヤボンデイング方式
JPS6348123Y2 (enrdf_load_stackoverflow)
JPS6084829A (ja) ワイヤボンデイング装置
JPS59181027A (ja) ワイヤボンデイング装置
US3709422A (en) Wire bonding means
JPS5911636A (ja) ボンデイング装置
JPS63127543A (ja) ワイヤボンデイング装置
JPS5988841A (ja) ワイヤボンデイング装置
JPH0236064B2 (enrdf_load_stackoverflow)
JP2814121B2 (ja) ワイヤボンディング方法
JPS59222186A (ja) ミシン
JPH0213815B2 (enrdf_load_stackoverflow)
JPS63127542A (ja) ワイヤボンデイング装置
JPS63136536A (ja) ワイヤボンデイング方法
JPS6035526A (ja) ワイヤボンディング方法