JPS58133952U - Board structure - Google Patents
Board structureInfo
- Publication number
- JPS58133952U JPS58133952U JP1982029887U JP2988782U JPS58133952U JP S58133952 U JPS58133952 U JP S58133952U JP 1982029887 U JP1982029887 U JP 1982029887U JP 2988782 U JP2988782 U JP 2988782U JP S58133952 U JPS58133952 U JP S58133952U
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- board structure
- substrate
- electrically connected
- diagram showing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Combinations Of Printed Boards (AREA)
- Multi-Conductor Connections (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は従来の基板の斜視図、第2図は従来の基板構造
を示す図、第3図Aは従来の基板の側面に印刷を行なう
ために整列した状態を示す図、第3図Bは従来の基板の
側面番と印刷を行なっている状態を示す図、第4図は従
来の基板の側面に印刷を行なっている状態を示す要部拡
大図である。第5図以下は本考案になる基板構造の実施
例を示す図であり、第5図は基板の斜視図、第6図は基
板の側面に印刷を行なっている状態を示す図、第7図は
、基板の側面に印刷を行なっている状態を示す要部拡大
図、第8図は基板構造の要部拡大図、第9図は第5図の
基板を使用したチップ状可変抵 ・抗器を示す図。
1・・・基板、1a・・・表面、1b・・・側面、IC
・・・裏面、11、 112. 1 lb、 I I
C,12,13−・・電極、20・・・抵抗体、21・
・・摺動片、31・・・スキージ、32・・・スクリー
ン。
CB)
第4図
第7図
第9図FIG. 1 is a perspective view of a conventional substrate, FIG. 2 is a diagram showing a conventional substrate structure, FIG. 3A is a diagram showing a state in which the conventional substrate is aligned for printing on the side surface, and FIG. 3B 4 is a diagram showing the side surface number of a conventional substrate and a state in which printing is performed, and FIG. 4 is an enlarged view of the main part showing a state in which printing is performed on the side surface of a conventional substrate. Figure 5 and subsequent figures are diagrams showing an embodiment of the substrate structure according to the present invention, in which Figure 5 is a perspective view of the substrate, Figure 6 is a diagram showing the state in which printing is performed on the side surface of the substrate, and Figure 7. Figure 8 is an enlarged view of the main parts showing the printed side of the board, Figure 9 is an enlarged view of the main parts of the board structure, and Figure 9 is a chip-shaped variable resistor using the board shown in Figure 5. Diagram showing. 1...Substrate, 1a...Surface, 1b...Side surface, IC
...Back side, 11, 112. 1 lb, II
C, 12, 13-- Electrode, 20... Resistor, 21-
... Sliding piece, 31... Squeegee, 32... Screen. CB) Figure 4 Figure 7 Figure 9
Claims (1)
が形成され、該表面及び裏面の少なくとも一方の電極は
該側面の電極と面取された稜にて電気的に接続され、該
表面及び裏面の少なくとも一方の電極は側面の電極によ
って互に電気的に接続されていることを特徴とする基板
構造。Electrodes are formed on at least one of the front and back surfaces of the substrate, and on at least one of the side surfaces, and the electrode on at least one of the front and back surfaces is electrically connected to the electrode on the side surface at a chamfered edge. A substrate structure characterized in that at least one electrode on the back surface is electrically connected to each other by an electrode on the side surface.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1982029887U JPS58133952U (en) | 1982-03-03 | 1982-03-03 | Board structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1982029887U JPS58133952U (en) | 1982-03-03 | 1982-03-03 | Board structure |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS58133952U true JPS58133952U (en) | 1983-09-09 |
Family
ID=30041649
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1982029887U Pending JPS58133952U (en) | 1982-03-03 | 1982-03-03 | Board structure |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58133952U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02281794A (en) * | 1989-03-29 | 1990-11-19 | Internatl Business Mach Corp <Ibm> | Multilayer printed circuit board |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5234948B1 (en) * | 1968-02-02 | 1977-09-06 |
-
1982
- 1982-03-03 JP JP1982029887U patent/JPS58133952U/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5234948B1 (en) * | 1968-02-02 | 1977-09-06 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02281794A (en) * | 1989-03-29 | 1990-11-19 | Internatl Business Mach Corp <Ibm> | Multilayer printed circuit board |
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