JPS58131631U - Soft adhesive thin plate for fixing semiconductor wafers - Google Patents

Soft adhesive thin plate for fixing semiconductor wafers

Info

Publication number
JPS58131631U
JPS58131631U JP2735982U JP2735982U JPS58131631U JP S58131631 U JPS58131631 U JP S58131631U JP 2735982 U JP2735982 U JP 2735982U JP 2735982 U JP2735982 U JP 2735982U JP S58131631 U JPS58131631 U JP S58131631U
Authority
JP
Japan
Prior art keywords
thin plate
semiconductor wafers
soft adhesive
adhesive thin
fixing semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2735982U
Other languages
Japanese (ja)
Inventor
黒野　龍夫
健次 鈴木
重村　栄二
Original Assignee
日東電工株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日東電工株式会社 filed Critical 日東電工株式会社
Priority to JP2735982U priority Critical patent/JPS58131631U/en
Publication of JPS58131631U publication Critical patent/JPS58131631U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

図面は本考案の実例を示す部分拡大側面図である。 １・・・軟質薄板、２・・・感圧性接着剤層、３１・・
・シリコーン系剥離層、’　３２・・・ポリエステルフ
ィルム。The drawing is a partially enlarged side view showing an example of the present invention. 1... Soft thin plate, 2... Pressure sensitive adhesive layer, 31...
- Silicone release layer, '32...polyester film.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 軟質薄板の表面に感圧性接着剤層を形成し、該層面に表
面にシリコーン系剥離層を形成してなるポリエステルフ
ィルムを該剥離層面を介して密着させてなることを特徴
とする半導体ウェハ固定用軟質接着性薄板。For fixing a semiconductor wafer, characterized in that a pressure-sensitive adhesive layer is formed on the surface of a soft thin plate, and a polyester film formed by forming a silicone release layer on the surface of the layer is adhered via the release layer surface. Soft adhesive thin plate.
JP2735982U 1982-02-26 1982-02-26 Soft adhesive thin plate for fixing semiconductor wafers Pending JPS58131631U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2735982U JPS58131631U (en) 1982-02-26 1982-02-26 Soft adhesive thin plate for fixing semiconductor wafers

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2735982U JPS58131631U (en) 1982-02-26 1982-02-26 Soft adhesive thin plate for fixing semiconductor wafers

Publications (1)

Publication Number Publication Date
JPS58131631U true JPS58131631U (en) 1983-09-05

Family

ID=30039271

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2735982U Pending JPS58131631U (en) 1982-02-26 1982-02-26 Soft adhesive thin plate for fixing semiconductor wafers

Country Status (1)

Country Link
JP (1) JPS58131631U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50141591A (en) * 1974-05-02 1975-11-14

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50141591A (en) * 1974-05-02 1975-11-14

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