JPS58144842U - Adhesive thin plate for fixing semiconductor wafers - Google Patents

Adhesive thin plate for fixing semiconductor wafers

Info

Publication number
JPS58144842U
JPS58144842U JP4212882U JP4212882U JPS58144842U JP S58144842 U JPS58144842 U JP S58144842U JP 4212882 U JP4212882 U JP 4212882U JP 4212882 U JP4212882 U JP 4212882U JP S58144842 U JPS58144842 U JP S58144842U
Authority
JP
Japan
Prior art keywords
thin plate
semiconductor wafers
adhesive thin
fixing semiconductor
fixing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4212882U
Other languages
Japanese (ja)
Inventor
重村　栄二
植村　剛正
黒野　龍夫
Original Assignee
日東電工株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日東電工株式会社 filed Critical 日東電工株式会社
Priority to JP4212882U priority Critical patent/JPS58144842U/en
Publication of JPS58144842U publication Critical patent/JPS58144842U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

図面は本考案の実例を示す部分拡大側面図である。 １・・・・・・プラスチックフィルムからなる基材、２
・・・・・・感圧接着剤層。The drawing is a partially enlarged side view showing an example of the present invention. 1...Base material made of plastic film, 2
...Pressure sensitive adhesive layer.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体ウェハを素子小片に切断分離する際に該ウェハを
固定する感圧接着薄板であって、該薄板の基材は少なく
とも３０ｇｍ７２５μｍの引裂伝播強さと１００μｍ以
上の厚みを有するプラスチックフィルムで構成されてい
ることを特徴とする半導体ウェハ固定用接着薄板。A pressure-sensitive adhesive thin plate for fixing a semiconductor wafer when it is cut and separated into element pieces, the base material of the thin plate being composed of a plastic film having a tear propagation strength of at least 30 gm and 725 μm and a thickness of 100 μm or more. A thin adhesive plate for fixing semiconductor wafers, characterized by:
JP4212882U 1982-03-24 1982-03-24 Adhesive thin plate for fixing semiconductor wafers Pending JPS58144842U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4212882U JPS58144842U (en) 1982-03-24 1982-03-24 Adhesive thin plate for fixing semiconductor wafers

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4212882U JPS58144842U (en) 1982-03-24 1982-03-24 Adhesive thin plate for fixing semiconductor wafers

Publications (1)

Publication Number Publication Date
JPS58144842U true JPS58144842U (en) 1983-09-29

Family

ID=30053274

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4212882U Pending JPS58144842U (en) 1982-03-24 1982-03-24 Adhesive thin plate for fixing semiconductor wafers

Country Status (1)

Country Link
JP (1) JPS58144842U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52134646A (en) * 1976-05-06 1977-11-11 Nippon Petrochemicals Co Ltd Substrate for adhesivee backed tape

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52134646A (en) * 1976-05-06 1977-11-11 Nippon Petrochemicals Co Ltd Substrate for adhesivee backed tape

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