JPS5812875U - LSI test probe card - Google Patents
LSI test probe cardInfo
- Publication number
- JPS5812875U JPS5812875U JP10492381U JP10492381U JPS5812875U JP S5812875 U JPS5812875 U JP S5812875U JP 10492381 U JP10492381 U JP 10492381U JP 10492381 U JP10492381 U JP 10492381U JP S5812875 U JPS5812875 U JP S5812875U
- Authority
- JP
- Japan
- Prior art keywords
- probe card
- test probe
- lsi test
- metal needle
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図はプローブ・カードによりウェハの測定を行なう
状態を一部破断して示す斜視図、第２図は第１図のプロ
ーブ・カードを示す斜視図、第３図は従来の金属針を拡
大して示す断面図、第４図は本考案の一実施例によるプ
ローブ・カードの金属針を拡大して示す断面図である・
。
１・・・・・・絶縁物基板、２・・・・・・孔、３・・
・・・・プリント・配線、４・・・・・・金属針、５・
・・・・・プローブ・カード、６・・・・・・ウェハ、
７・・・・・・ＬＳＩ素子、８・・・・・・合成樹脂製
チューブ、９・・・・・・銅管、１０・・・・・・導電
性ペースト。Figure 1 is a partially cutaway perspective view showing the state in which a wafer is measured using a probe card, Figure 2 is a perspective view showing the probe card in Figure 1, and Figure 3 is an enlarged view of a conventional metal needle. FIG. 4 is an enlarged cross-sectional view showing a metal needle of a probe card according to an embodiment of the present invention.
. 1... Insulator substrate, 2... Hole, 3...
...Print/wiring, 4...Metal needle, 5.
...Probe card, 6...Wafer,
7... LSI element, 8... Synthetic resin tube, 9... Copper tube, 10... Conductive paste.
Claims (1)
が前記孔の周縁に集束するようにプリント配線を形成し
、このプリント配線の先端に夫々金属針を接続したＬＳ
Ｉ試験用プローブ・カードにおいそ、前記金属針に合成
樹脂製チューブを被せ、更にその外周に導電性ペースト
を塗布したことを特徴とするＬＳＩ試験用プローブ・カ
ード。An LS in which printed wiring is formed on the surface of an insulating substrate with a hole for positioning so that the tip thereof converges on the periphery of the hole, and a metal needle is connected to each tip of the printed wiring.
1. A probe card for LSI testing, characterized in that the metal needle is covered with a synthetic resin tube, and a conductive paste is further applied to the outer periphery of the tube.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10492381U JPS5812875U (en) | 1981-07-15 | 1981-07-15 | LSI test probe card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10492381U JPS5812875U (en) | 1981-07-15 | 1981-07-15 | LSI test probe card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5812875U true JPS5812875U (en) | 1983-01-27 |
Family
ID=29899481
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10492381U Pending JPS5812875U (en) | 1981-07-15 | 1981-07-15 | LSI test probe card |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5812875U (en) |
-
1981
- 1981-07-15 JP JP10492381U patent/JPS5812875U/en active Pending
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