JPS5977260U - semiconductor equipment - Google Patents
semiconductor equipmentInfo
- Publication number
- JPS5977260U JPS5977260U JP17366282U JP17366282U JPS5977260U JP S5977260 U JPS5977260 U JP S5977260U JP 17366282 U JP17366282 U JP 17366282U JP 17366282 U JP17366282 U JP 17366282U JP S5977260 U JPS5977260 U JP S5977260U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- wiring board
- printed wiring
- lead rod
- semiconductor equipment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の半導体装置の構成を示す斜視図、第２図
はこの考案の一実施例の構成を示す斜視図、第３図は第
２図の他の実施例を示す斜視図である。
図に於て、１は半導体素子、２は第一のリード棒、３は
印刷配線板、４は第一の穴、５は第一の配線、８は第二
の配線、９は第二のリード線、１０は第二の穴である。
尚各図中、同一符号は同一または相当部分を示すものと
する。FIG. 1 is a perspective view showing the structure of a conventional semiconductor device, FIG. 2 is a perspective view showing the structure of one embodiment of this invention, and FIG. 3 is a perspective view showing another embodiment of the invention. . In the figure, 1 is a semiconductor element, 2 is a first lead rod, 3 is a printed wiring board, 4 is a first hole, 5 is a first wiring, 8 is a second wiring, and 9 is a second wiring. Lead wire 10 is the second hole. In each figure, the same reference numerals indicate the same or corresponding parts.
Claims (1)
の電極を有する半導体素子、導電材を用いて形成され、
上記第一の電極に電気的に接続され、印刷配線板に形成
された第一の穴に挿入して上記印刷配線板番ヒ固着され
た第一の配線に電気的に接続される第一のリード棒、導
電材を用いて上記第一のリード棒と異る上記第一の穴に
挿入不可能な形状に形成されて上記第二の電極に接続さ
れ、上記印刷配線板の上記第一の穴と異る位置に異る内
形に形成された第二の穴に挿入されて、上記印刷配線板
に固着された第二の配線に電気的に接続される第二のリ
ード棒を備えた半導体装置。A semiconductor element formed using a semiconductor and having first, second, and second electrodes therein; a semiconductor element formed using a conductive material;
A first wire electrically connected to the first electrode and inserted into a first hole formed in the printed wiring board and fixed to the printed wiring board. A lead rod, using a conductive material, is formed in a shape that cannot be inserted into the first hole different from the first lead rod, and is connected to the second electrode, and is connected to the first hole of the printed wiring board. A second lead rod is inserted into a second hole formed in a different position and with a different inner shape from the hole and electrically connected to a second wiring fixed to the printed wiring board. Semiconductor equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17366282U JPS5977260U (en) | 1982-11-15 | 1982-11-15 | semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17366282U JPS5977260U (en) | 1982-11-15 | 1982-11-15 | semiconductor equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5977260U true JPS5977260U (en) | 1984-05-25 |
Family
ID=30378258
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17366282U Pending JPS5977260U (en) | 1982-11-15 | 1982-11-15 | semiconductor equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5977260U (en) |
-
1982
- 1982-11-15 JP JP17366282U patent/JPS5977260U/en active Pending
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