JPS58126534A - Photomask preparation device - Google Patents

Photomask preparation device

Info

Publication number
JPS58126534A
JPS58126534A JP57008903A JP890382A JPS58126534A JP S58126534 A JPS58126534 A JP S58126534A JP 57008903 A JP57008903 A JP 57008903A JP 890382 A JP890382 A JP 890382A JP S58126534 A JPS58126534 A JP S58126534A
Authority
JP
Japan
Prior art keywords
mask
section
plate
cleaning
automatically
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP57008903A
Other languages
Japanese (ja)
Inventor
Soichi Tsuuzawa
通沢 壮一
Morihisa Hoko
法亢 盛久
Hiroyuki Ibe
伊部 宏幸
Takao Kawanabe
川那部 隆夫
Yoshiharu Mori
森 佳治
Akira Minoguchi
美濃口 章
Susumu Kawagishi
川岸 進
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Hitachi High Tech Corp
Original Assignee
Hitachi Ltd
Hitachi Electronics Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Electronics Engineering Co Ltd filed Critical Hitachi Ltd
Priority to JP57008903A priority Critical patent/JPS58126534A/en
Publication of JPS58126534A publication Critical patent/JPS58126534A/en
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68Preparation processes not covered by groups G03F1/20 - G03F1/50

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)

Abstract

PURPOSE:To reduce attachment of dust of a mask and defects of the mask, and to enhance yield of mask preparation, labor saving and manufacturing efficiency, by conveying the mask mechanically and automatically between respective processing sections. CONSTITUTION:A photomask preparation device is composed, as a whole, of a pretreatment device 1 and a posttreatment device 2, and the mask is conveyed from the left to the right to process it in each section. The device 1 is provided with a scrubber 3, a paper dryer 4, a coater 5, a baker 6, and a storage section 7, and the mask is automatically conveyed between respective sections. A mask plate is coated with a photoresist with the device 1, and it is exposed to a prescribed optical pattern with an exposing device, and then, it is developed with the device 2 to complete the mask. It is automatically conveyed between a developing and etching section 29 and a stripping section 31 and also between this section 31 and a washing section 32, and all the conveyances except the exposing process executed between the devices 1 and 2 are automatically operated.

Description

【発明の詳細な説明】 本発明はホトマスクの製造装置に関し、%に装置を機械
的(自動化することに工す省人化お工び製品の歩vII
秒同上を達成することができるホトマスク製造装置に関
するものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a photomask manufacturing device, and the present invention relates to a photomask manufacturing device.
The present invention relates to a photomask manufacturing apparatus that can achieve the same speed as above in seconds.

半導体装置の製造に使用されるホトマスクは、マスクプ
レートの洗浄、ホトレジスト塗布、べ一り、保管等の前
処理工程と、感光後における璃儂エツチング、剥離、洗
浄、保管等の後処理工程を経て製造されており、その詳
IlはIIEI図に示す通りである。ところで、前述し
た前処置と後処理の各処理装置を備えた製造装置では従
来から自動化が図られており、洗浄、ホトレジスト塗布
、べ一り、浅漬、剥雌等の各地llsでは殆んど作業者
が関与することなく処理の自動化が可能とされている。
Photomasks used in the manufacture of semiconductor devices undergo pre-processing processes such as mask plate cleaning, photoresist coating, baling, and storage, and post-processing processes such as photolithographic etching, peeling, cleaning, and storage. The details are shown in Figure IIII. By the way, manufacturing equipment equipped with the pre-treatment and post-treatment equipment mentioned above has been automated for a long time, and most of the work such as cleaning, photoresist coating, baling, dipping, and peeling is done. It is said that it is possible to automate processing without human involvement.

しかしながら、これまでの装置では洗浄、ホトレジスト
塗布、ベータ等の各処@部間でマスクプレートを搬送す
る作業を自動化するまでKは到っておらず、具体的にみ
れは前処理工1の洗浄と塗布、塗布と保管の間、また後
処理工種の現儂と剥離、剥離と洗浄、保管の閣では作業
者が手作業でマスクプレートを移動さぜ℃いる。このた
め、手作業の度にマスクプレー)ti!!lt処11俵
置内から外気中に引き出されることになり、マスクプレ
ートに塵埃が付着してマスク欠陥を生じ歩留りの低下を
招く。従来のマスク欠陥の60911ri前処理におけ
る塵埃の付着から生じ、40嘔は後処理における塵埃の
付着から生じている。また、前述の1うにマスクプレー
トの移動を手作業に頼る場合には装置に付き添う人員数
が争くなるという問題もある。
However, with conventional equipment, K has not been achieved until the task of transporting the mask plate between each section such as cleaning, photoresist coating, and beta processing has been automated. Workers must manually move the mask plate between application, application and storage, as well as during post-processing, peeling, peeling and cleaning, and storage. For this reason, I wear a mask every time I do manual work)ti! ! The mask is drawn out from inside the bale rack of the lt shop 11 into the outside air, and dust adheres to the mask plate, causing mask defects and lowering yield. 60,911 ri of conventional mask defects arise from dust adhesion in pre-processing, and 40 ri arise from dust adhesion in post-processing. Furthermore, when moving the mask plate manually as described in 1 above, there is a problem in that the number of personnel attending the apparatus becomes competitive.

なお、従来罠おいても一部の処m@ではマスクプレート
を自動的に移動さぜるL5にしたものがあるが、これは
機械式ではなく空気搬送方式であるために空気流によっ
て周辺の塵埃を巻吉上げてマスクVcJ1%智を付着し
易いという問題がある。
In addition, even with conventional traps, some clinics have L5 models that automatically move the mask plate, but this is a pneumatic conveyance system rather than a mechanical one, so the air flow can move the surrounding area. There is a problem in that it raises dust and tends to adhere to the mask VcJ1%.

17たがって本発明の目的は、各処理部間を機械方式で
かつ自動的にマスク搬送させることKより、マスクへの
塵埃の付着を防止してマスク欠陥を低減し、マスク製造
の歩留りを同上するとともに作業者KJる手作業を不要
にし工省人化および製造効率の向上を達成すること蝉で
きるホトマスク製造装置を提供することに′hる。
17 Therefore, an object of the present invention is to automatically transport masks between processing sections by a mechanical method, thereby preventing dust from adhering to masks, reducing mask defects, and increasing the yield of mask manufacturing. At the same time, it is an object of the present invention to provide a photomask manufacturing apparatus that eliminates the need for manual labor by workers and achieves labor savings and improved manufacturing efficiency.

以下、本発明装置を図面に基づいて説明する。Hereinafter, the apparatus of the present invention will be explained based on the drawings.

第Saは本発明装置の全体構成図であり、lは前処理装
置、2は後処1lliI!置である。マスクは図示の左
儒から右側へ向けて搬送されながら各処理が行なわれ、
前処理装置16cJcリマスクプレートにホトレジスト
が塗布され、図外の感光装置にて所定パターンの感光が
行なわれた後、後処理装置SK工り現偉が行なわれマス
クが完成される。
No. Sa is an overall configuration diagram of the apparatus of the present invention, where l is a pre-processing device and 2 is a post-processing device. It is a place. Each process is performed while the mask is being transported from the left side to the right side as shown in the diagram.
A photoresist is coated on the pre-processing device 16cJc remask plate, and a predetermined pattern is exposed to light using a photosensitive device (not shown). After that, processing is carried out in the post-processing device SK to complete the mask.

前記前処理装置1は、第8図に合わぜて示す15に、ス
クラブ洗浄部8、ベークく乾燥@4.塗布s5.1−一
り@6.保管s7を備え、しか%’fWr部間ではマス
クは機械式に自動搬送される。また、特に本例ではバッ
ファカセットを設けることにエリ、洗争、乾燥や塗布、
ベーク、保管を単独に使用できるLうにしている。即ち
1本実施例値置では、先ずマスクプレートMが複数枚入
ったカセット8をローダls9Kmillll。ローダ
部9は下降方向にステップ送りされるLうに構成してお
り、プレートMは一枚づつ真空吸着のトランスファに″
′C吸着された状態でEllローダlOに運ばれる。前
記トランスファの真空吸着板は通常の往復運動機構と上
下運動機構とを備えており、BIlローダlOLり上の
位置で搬送し、B!lローダ部で下降することにょう℃
マスクプレートの剰り移りが行なわれる。もちろん直前
に真空はオフになる。前記EllローダlOも通常の往
復運動機構と上下運動機構とが偏見られ、洗浄部80回
転スピンナ110位置りり上の位置で搬送し、スピンナ
11で下降することKよってマスクプレートの剰り移り
が行なわれる。前記回転スピンナ11は通常の上下機構
を備え、下降することKL−て洗浄槽11の中に入うて
回転ブラシ1Bで洗浄液をかけながら洗浄する。洗浄完
了後、回転スピンナ11が上昇し、同じE型ローダlO
の先端部で捨い上げてベーパ乾燥するプレート保持具1
4Vcf)Jする。マスクプレートの両面を洗浄するた
めにはプレート180°反転機構15でプレートを真空
吸着しながら回転スピンナ11の上で180°反転させ
る。このプレート180°反転機構は往復運動、も行な
う、前記プレート保持具14は90′反転を上下運動を
行ない、90°反転と下降することKよってペーパ槽1
6の中に入る。所定時間後再び上昇し、90”逆反転し
てマスクプレートが水平位置になる。そして、キャリア
l 7[jって塗布W65の回転スピンナ18に運ぶた
めに先ず上下運動する突き上げ棒19に工っ℃プレート
保持具工す外れて上におかれる。
The pretreatment device 1 includes a scrub cleaning section 8, a baking drying section 15 shown in FIG. 8, and a baking drying section 4. Coating s5.1-one @6. A storage section s7 is provided, and the masks are mechanically and automatically transported between the sections. In addition, especially in this example, there is a problem with providing a buffer cassette, such as cleaning, drying, coating, etc.
It is designed so that it can be used independently for baking and storage. That is, in the values of this embodiment, first, the cassette 8 containing a plurality of mask plates M is loaded into the loader ls9Kmill. The loader section 9 is configured to be fed in steps in the downward direction, and the plates M are transferred one by one by vacuum suction.
'C is transported to the Ell loader IO in an adsorbed state. The vacuum suction plate of the transfer is equipped with a normal reciprocating mechanism and an up-and-down movement mechanism, and is transferred at a position above the BIl loader lOL. ℃ It will be lowered by the loader section.
A residual transfer of the mask plate is performed. Of course, the vacuum will turn off just before that. The Ell loader 1O also has a normal reciprocating mechanism and a vertical movement mechanism, and the cleaning section 80 rotates and the spinner 110 transports the mask plate at a higher position and lowers it using the spinner 11, thereby transferring the remaining mask plate. It will be done. The rotary spinner 11 is equipped with a normal up-and-down mechanism, and when it is lowered, it enters the cleaning tank 11 and performs cleaning while spraying cleaning liquid with the rotary brush 1B. After cleaning is completed, the rotary spinner 11 rises and the same E-type loader lO
Plate holder 1 for discarding and vapor drying at the tip of
4Vcf)J. In order to clean both sides of the mask plate, the plate is reversed 180° on a rotary spinner 11 while being vacuum-adsorbed by a plate 180° reversing mechanism 15. This plate 180° reversal mechanism also performs a reciprocating motion, and the plate holder 14 performs a 90' reversal, an up and down movement, and a 90° reversal and a downward movement.
Enter 6. After a predetermined period of time, the mask plate rises again, reverses itself by 90 inches, and the mask plate becomes a horizontal position.Then, in order to convey the carrier l7[j to the rotary spinner 18 of the coating W65, a push-up rod 19 that moves up and down is first machined. ℃ plate holder removed and placed on top.

キャリア17は往復運動と180”回転連動お1びマス
クプレートを爪ではさみ込むLうに作動する。第4図に
詳細を示すLうに、搬送本体1?Aを中心1?BKおい
℃揺動可能とし、ばねl ? C。
The carrier 17 operates in a reciprocating motion, a 180" rotation interlocking motion, and a mask plate sandwiching between its claws. As shown in detail in Fig. 4, the carrier 17 can swing around the conveyor body 1A. and spring l?C.

1?Dを掛合し℃レバー17EKより互に連結した一対
の爪17F、l?Gをエアシリンダ1 ? Hにて作動
することにLリマスクプレー)Mを挾持しかつ搬送でき
る。そし℃、その作用は供給側にあるマスクプレートに
爪17F、l?Gが開いた状態で搬送本体17Aが上方
向から接近−する。七シl、 爪17 F 、 17 
Gt’−C7シリン/17HKて閉じてプレートをチャ
ックする。再び上昇してから中心178にて揺動し回転
スピンナ18の位置で下降する。次いで爪17F、17
Gを開いてプレー)Mをスピンナ18の上にの忙る。本
体17Aは逆方向に揺動して次のプレートをチャックす
る。スピ/す18による処理の完了後なキャリアzOが
作動し℃スピンナ18からプレートを取り出す。なお、
プレートはスピンナ18に真空吸着され、またキャリア
1710の作動時にはカップが上に上がって干渉しない
1うにしている一プレートはスピンナ18に吸着され回
転されながらホトレジストが塗布される。塗布完了後の
プレートはキャリアzOにてベーク炉6に搬送され、ベ
ーク炉の前では上下運動する突き上げ棒21に工って真
空吸着されながらベーク炉内搬送機構2zに乗り移る。
1? A pair of pawls 17F and l? which are engaged with D and connected to each other by the °C lever 17EK. G as air cylinder 1? By operating at H, it can hold and transport L remask spray) M. Then ℃, the effect is that the mask plate on the supply side has claws 17F and 1? With G open, the transport main body 17A approaches from above. Seven sills, claw 17 F, 17
Close the Gt'-C7 cylinder/17HK and chuck the plate. After rising again, it swings at the center 178 and descends at the position of the rotating spinner 18. Next, claws 17F, 17
Open G and play) M is busy on top of spinner 18. The main body 17A swings in the opposite direction to chuck the next plate. After the processing by the spinner 18 is completed, the carrier zO is activated to remove the plate from the ℃ spinner 18. In addition,
The plate is vacuum-adsorbed by the spinner 18, and when the carrier 1710 is operated, the cup rises to prevent interference.One plate is adsorbed by the spinner 18 and rotated while the photoresist is applied. After the coating is completed, the plate is transported to the baking oven 6 by a carrier zO, and transferred to the baking oven transport mechanism 2z while being vacuum-adsorbed by a push-up rod 21 that moves up and down in front of the baking oven.

ベータ炉内は複数ステージ璽ンエりなり、往復運動と上
下運動工すなる搬送機構22で所定時間後に搬送される
。ベーク炉から出たプし・・−トは真空吸着のトランス
ファ28でアンローダ24のカセット25に入れられる
。プレートで満杯になったカセットは90°反転され、
プレートが縦向きになってベルトコンベアz6の上にの
せられ、次々にステップ送りされる。アンローダSには
次の空力セラ)95を通常の往復運動する空カセット送
り機で送りこむ。そして、保管棚27には適宜作業者が
載せることができる。
The interior of the beta furnace consists of a plurality of stages, and the materials are transported after a predetermined time by a transport mechanism 22 consisting of reciprocating motion and vertical motion. The output from the baking oven is transferred to a cassette 25 of an unloader 24 by a vacuum suction transfer 28. The cassette filled with plates is turned 90 degrees,
The plates are placed vertically on a belt conveyor z6 and are fed step by step one after another. The next aerodynamic cellar) 95 is fed into the unloader S using a normal reciprocating empty cassette feeder. An operator can place items on the storage shelf 27 as appropriate.

−万、後処理装置2は、第2図に示すように、ネームプ
リント部28.現儂・エソブング部29、全面露光部8
0、剥S部81、洗浄部8z、乾燥部88を備え、その
詳細を第5図に示す、、本例では、現儂とエツチングと
け同一スピンナ上で連続的にスプレ一方式で処理する。
- As shown in FIG. 2, the post-processing device 2 includes a name print section 28. Current part 29, full exposure part 8
0, a stripping section 81, a cleaning section 8z, and a drying section 88, the details of which are shown in FIG.

また、剥離法はポジレジストの特徴を生かして全面露光
を行ない浅漬液をかけて剥離する。更に、バ・・ファカ
セットを設けてネームプリントと浅漬工ヴチ、全面露光
と剥離、洗浄と乾燥だけでも使用できる。
Further, in the peeling method, the entire surface is exposed by taking advantage of the characteristics of a positive resist, and then a shallow dipping solution is applied to peel it off. In addition, a cassette set is provided so that it can be used for name printing, shallow dipping, full exposure, peeling, washing and drying.

ローダ部84は前処理装置lと同じであり、真空吸着ト
ランファ85とキャリア86%同じである。ただし、キ
ャリア86はプレートが爪に保持されてから90°回転
して前進し、そしてネームプリント部z8で停止1−イ
る。ネーノ、ri−に字板が円板の周辺に彫ってあり、
レンズで縮小してプリントされろ。この文字板とレンズ
を含む光学系が往復運動して所定の文字をマスクプレー
トの上に露光する。ネーム、露光が終ると更にヤヤリア
86が前進して浅漬・エッチのカップの直前で90@回
転し、また前進して回転スピンナ37の真上にきて停止
する。スピンナ87は上昇し℃プレートを真空吸着し、
キャリア86が戻った状態で浅漬・エッチの所定のプロ
セスが行なわれる。エツチング完了後のプレートは次の
キャリア88に!つて全面露光部80に運ばれる。そし
て、下から回転スピンナ89が上昇し℃真空吸着し1回
転しながらプレート全面に光を受ける。完了後回転スピ
ンナ89が下降して同じキャリアに再び載せられる。剥
離部81の直前て90°回転して更に前進して回転スピ
ンナ40の真上に移動する。そして、回転スピンナが上
昇してプレートを真空吸着し、キャリア88が戻った状
態で剥離のための現儂液をかける。剥離が完了したプレ
ートは他のキャリア41にぶって洗浄部8zのEIIC
I−ダlaK搬送される。E型ローダ4zの真上では上
下運動する突き上げ棒48に1−℃真空吸着されながら
E型ローダに移載する。後は前処理装置lと同様の洗浄
を行ない、一枚づつアンローダカセット44に真空吸着
トランスファ45によって装入されることになる。図中
、46はプレート+8(1°回転機構、47はスピンナ
である。また、全図を通してBはバッファカセットであ
る。
The loader section 84 is the same as the preprocessing device 1, and the vacuum suction transferer 85 and the carrier are 86% the same. However, after the plate is held by the claws, the carrier 86 rotates 90 degrees and moves forward, and then stops at the name print portion z8. Neno and ri- have letters carved around the disk,
Use a lens to reduce the size and print it. An optical system including the dial and lens moves back and forth to expose a predetermined character onto the mask plate. When the name and exposure are completed, the Yayaria 86 advances further and rotates 90 @ just in front of the shallow dipping/etching cup, and advances again until it comes directly above the rotary spinner 37 and stops. The spinner 87 rises and vacuum-adsorbs the °C plate.
With the carrier 86 returned, a predetermined process of shallow dipping and etching is performed. After etching is completed, the plate will be transferred to the next carrier 88! Then, it is transported to the entire surface exposure section 80. Then, a rotary spinner 89 rises from below and performs vacuum suction at a temperature of 0.degree. C., making one rotation while receiving light over the entire surface of the plate. After completion, the rotary spinner 89 is lowered and placed again on the same carrier. It rotates 90 degrees just before the peeling part 81 and moves further forward to right above the rotary spinner 40. Then, the rotary spinner moves up and vacuum-chucks the plate, and with the carrier 88 returned, a current solution for stripping is applied. The plate that has been completely peeled is placed on another carrier 41 and placed in the EIIC of the cleaning section 8z.
I-da laK is transported. Directly above the E-type loader 4z, the loader is transferred to the E-type loader while being vacuum-adsorbed at 1-°C by a push-up rod 48 that moves up and down. After that, the same cleaning as in the pretreatment device 1 is performed, and the sheets are loaded one by one into the unloader cassette 44 by the vacuum suction transfer 45. In the figure, 46 is a plate +8 (1 degree rotation mechanism, 47 is a spinner. Throughout the figures, B is a buffer cassette.

以上の工うに本発明のマスク製′fI!L装賀では、前
処理と後処理の閣で行なう感光工程を作發者が直擬担轟
し℃処理する以外は、全てマスクプレートを自動的に搬
送処理することかで1′!ル。そして、本発明でri少
なくとも前処理の洗浄と塗布、塗布と保管の間、また後
処理の浅漬と剥離、剥離と洗浄、保管の閣の自動化を図
り、かつ全ての処理部間で機械方式にてマスクプレート
を搬送しているので塵埃を巻き上げること本なく異物が
マスクプレートに付着することも殆んどないう因みに本
発明に工れば、約処理工程でdll1m以上の欠陥を0
.6個/clIIから0.4個/dと改善し、後工程で
は1μmの欠陥を04個/dからOJ(!I/dと改善
することができた。また、全自動化にエリ前処理では作
業員数を15人から18人に、後処理では18人から1
0人に低減できたへしたがう1、本発明装置に工れば、
マスク歩留りの向上を図る−方で省人化を図り、結局マ
スクの製造効率を極めて高いものにできる。更罠、マス
クへの異物の付着防止を図ることにエリ、特に後処11
におけろベーク、スカム除去、超音波洗浄等の従来性な
−ていた1糧を省略することもできるのである。
As described above, the mask of the present invention is made of fI! At L Soga, the designer directly handles the exposure process in the pre-treatment and post-treatment halls, and except for the temperature treatment, the mask plate is automatically transported and processed. Le. In addition, the present invention aims to automate at least the pre-treatment cleaning and coating, coating and storage, and the post-treatment shallow soaking, peeling, peeling, cleaning, and storage, and all processing sections are automated using mechanical methods. Since the mask plate is conveyed using the same method, there is no dust being stirred up, and there is almost no chance of foreign matter adhering to the mask plate.In addition, if the present invention is applied, it is possible to eliminate defects of dll 1 m or more in about 100 yen in the processing process.
.. This was improved from 6/clII to 0.4/d, and in the post-process, we were able to improve the number of 1 μm defects from 04/d to OJ (!I/d). The number of workers has been increased from 15 to 18, and post-processing has been reduced from 18 to 1.
The number of people can be reduced to 0. 1. If the device of the present invention is used,
By improving the mask yield, it is possible to save labor and ultimately make the mask manufacturing efficiency extremely high. In addition, it is important to prevent foreign matter from adhering to the mask, especially afterward 11.
It is also possible to omit conventional procedures such as baking, scum removal, and ultrasonic cleaning.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来の工程図、第2図は本発明装置の全体構成
図、第8図囚、a3)は前処理装置の平面図と正面図、
第4図は一部の詳細の平面図、第5図囚、■は後処理装
置の平面図と正面図である。 1・・・前処理装置、2・・・後処lll!装置、訃・
・スクラブ洗浄部、4・・・ベーパ乾燥部、ト・・塗布
部、6・・・べ−り部、7・・・保管9部、8・・・カ
セット、9・・・ローダ部、17.20・・・キャリア
、28・・・ネームプリント部、29・・・現儂・エツ
チング部、80・・・全面露光部、81・・・剥離部、
82j・・洗浄部、88・・・乾燥部、85,88.4
1・・・キ卆リア、M・・・マスクプレート。 代理人 弁理士  −1)利 幸 −′;1、第1頁の
続き 0発 明 者 美濃口車 神奈川県足柄上郡中井町入所30 0番地日立電子エンジニアリン グ株式会社内 0発 明 者 用岸進′ 神奈川県足柄上郡中井町入所30 0番地日立電子エンジニアリン グ株式会社内 ■出 願 人 日立電子エンジニアリング株式%式%
Figure 1 is a conventional process diagram, Figure 2 is an overall configuration diagram of the device of the present invention, Figure 8, a3) is a plan view and front view of the pretreatment device,
FIG. 4 is a plan view of some details, and FIG. 1... Pre-processing device, 2... Post-processing! equipment, deceased
- Scrub cleaning section, 4... Vapor drying section, G... Coating section, 6... Baling section, 7... Storage 9 sections, 8... Cassette, 9... Loader section, 17 .20...Carrier, 28...Name print part, 29...Etching part, 80...Full surface exposure part, 81...Peeling part,
82j...Washing section, 88...Drying section, 85, 88.4
1... Keyboard rear, M... Mask plate. Agent Patent Attorney -1) Yuki Toshi -';1, continued on page 10 Inventor Minokuchi Kuruma, 300 Nakai-cho, Ashigarakami-gun, Kanagawa Prefecture Hitachi Electronics Engineering Co., Ltd. Inventor Susumu Yokishi' Kanagawa Hitachi Electronics Engineering Co., Ltd., 30-0 Nakai-cho, Ashigarakami-gun, Prefecture ■Applicant: Hitachi Electronics Engineering Co., Ltd.

Claims (1)

【特許請求の範囲】 1、洗浄、ホトレジスト塗布、ベーク′、保管等の各処
理部を有する前処理装置と、感光後のマスクプレートの
印字、現儂・エツチング、全面露光。 剥離、洗浄、乾燥、保管を°行なう各処理部とを有する
後処理装置とを備え、少なくとも前記前処理装置の洗浄
とホトレジスト塗布の間、塗布と保管の間、後処理装置
の現蜜・エツチングと剥離の間、剥離と洗浄、保管の間
を夫々自動搬送可能にするとともに、全ての処II@間
での搬送を機械的に行なう工うにしたことを特徴とする
ホトマスク製造装置。
[Scope of Claims] 1. A pre-processing device having processing sections for cleaning, photoresist coating, baking, storage, etc., and printing, printing/etching, and full-surface exposure of the mask plate after exposure. a post-processing device having respective processing sections for stripping, cleaning, drying, and storage; A photomask manufacturing apparatus characterized in that it is capable of automatic conveyance between processing and peeling, between peeling and cleaning, and between storage, and mechanically performs conveyance between all processes.
JP57008903A 1982-01-25 1982-01-25 Photomask preparation device Pending JPS58126534A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57008903A JPS58126534A (en) 1982-01-25 1982-01-25 Photomask preparation device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57008903A JPS58126534A (en) 1982-01-25 1982-01-25 Photomask preparation device

Publications (1)

Publication Number Publication Date
JPS58126534A true JPS58126534A (en) 1983-07-28

Family

ID=11705629

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57008903A Pending JPS58126534A (en) 1982-01-25 1982-01-25 Photomask preparation device

Country Status (1)

Country Link
JP (1) JPS58126534A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6703170B1 (en) * 2000-12-13 2004-03-09 Dupont Photomasks, Inc. Method and apparatus for reducing loading effects on a semiconductor manufacturing component during an etch process

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6703170B1 (en) * 2000-12-13 2004-03-09 Dupont Photomasks, Inc. Method and apparatus for reducing loading effects on a semiconductor manufacturing component during an etch process

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