KR100493988B1 - Resist processing method and resist processing apparatus - Google Patents

Abstract

1. TECHNICAL FIELD OF THE INVENTION

The present invention relates to a resist processing method and a resist processing apparatus for applying a resist liquid to a substrate such as a semiconductor wafer and developing the coated resist.

2. The technical problem to be solved by the invention

During transport or processing of the substrate, foreign matter adhering to the substrate can be finally removed and the amount of the chemical filter used can be reduced.

3. Summary of Solution to Invention

The resist processing method includes (a) means for taking out a substrate from a process portion and a cassette for processing the substrate and conveying the substrate to the process portion, a washing portion for final cleaning of the substrate processed in the processing portion, and a substrate from the processing portion to the cleaning portion. And a means for receiving the substrate from the washing section and storing the substrate in the cassette, (b) removing the substrate from the cassette, (c) conveying the removed substrate to the process portion, and (d) And at least a processing step of developing a coating register applied to the substrate, and (e) passing the substrate from the processing section to the cleaning section at least after the development processing step, and (f) in the cleaning section, at least on the non-resist coating surface of the substrate. The cleaning solution is sprayed, and the non-resist coating surface of the substrate is finally cleaned, and (g) the final cleaned substrate is stored in a cassette.

4. Important uses of the invention

It is used for a resist processing method and a resist processing apparatus.

Description

Resist processing method and resist processing apparatus

BACKGROUND OF THE INVENTION Field of the Invention The present invention relates to a resist processing method and a resist processing apparatus for applying a resist liquid to a substrate such as a semiconductor wafer and developing the coated resist.

In the photolithography process, a resist processing system for applying a resist liquid to a semiconductor wafer in sequence and developing the coated resist is used. Such resist processing systems are disclosed in US Patent Application Nos. 08 / 667,712 and 08 / 686,707, respectively. In these resist processing systems, a wafer is conveyed to each processing unit by a plurality of arm mechanisms, and the wafers are sequentially processed. When the series of processes are all finished, the wafer is stored in the cassette of the cassette station, and the wafer is taken out of the system together with the cassette.

By the way, in processing and conveyance, there exists a possibility that various foreign substances may adhere to a wafer. In particular, foreign matters such as resists, developers, particles, various organic materials, and various ions are easily attached to the back surface of the wafer. US patent application Ser. No. 08 / 521,845 discloses an apparatus and method for preventing contamination of the back surface of a wafer during development. However, this prior art only prevents contamination of the back surface of the wafer during the development process, and cannot remove foreign substances adhering to the back surface of the wafer after the development process. For example, if a resist solution or a developer is attached to the holder of the arm mechanism for some reason, they migrate from the holder to the back of the wafer, and the contaminated wafer is stored in the cassette as it is. In addition, particles floating in the system may adhere to the processed wafer, and the contaminated wafer may be stored in the cassette as it is.

In the resist processing system, a chemical filter is used to remove organic components from the atmosphere in the system. Chemical filters are expensive and, moreover, they must be replaced frequently. For this reason, in a resist processing system, it is preferable to suppress the usage-amount of a chemical filter as much as possible. However, in the conventional resist processing system, the chemical filter is also provided for the brush cleaning apparatus and the water washing apparatus which are not related to the organic components, so the amount of the chemical filter is increased as a whole of the system.

SUMMARY OF THE INVENTION An object of the present invention is to provide a resist processing method and a resist processing system capable of finally removing foreign substances adhering to a substrate during transport or processing of the substrate and at the same time reducing the amount of chemical filters used.

The resist processing method according to the present invention includes (a) a process station for processing a substrate, a cleaning unit provided independently from the process station, a main arm mechanism for sequentially transferring the substrate within the process station, and the three A substrate receiving means for handing over the substrate to the government, a sub-arm mechanism for taking out the substrate from the cassette, handing it over to the main arm mechanism or the substrate flipping means, and storing the substrate cleaned in the cleaning portion into a cassette; (b) removing the substrate from the cassette by the subarm mechanism, (c) conveying the removed substrate to the process station by the main arm mechanism, and (d) at least on the surface of the substrate a coating resist applied to the process station. And (e) at least after the development treatment step, the substrate is removed. It is carried out from the said process station by a main arm mechanism, and this board | substrate is handed over to the said washing | cleaning part by the said board | substrate receiving means, (f) The washing | cleaning part sprays a cleaning liquid on the back surface of a board | substrate at least, and finally wash | cleans the back surface of a board | substrate And (g) storing the final cleaned substrate in a cassette by the subarm mechanism.

A resist processing apparatus according to the present invention includes a cassette unit into which a cassette containing a plurality of substrates enters and exits, a process station including at least a developing means for developing a coating resist applied to a surface of the substrate, and a chemical to remove organic components. A first air-conditioning means having a filter and forming a downward flow of clean air in the process station, a main arm mechanism for sequentially conveying the substrate in the process station, and removing the substrates one by one from the cassette of the cassette; A sub-arm mechanism that receives the substrate directly or indirectly into the main arm mechanism, and a final washing machine which is installed in a separate place from the process station and which cleans the substrate by spraying the cleaning liquid on the substrate, is provided by the main arm mechanism. A final cleaning unit which is not conveyed to the final cleaning unit, and a filter for removing particles, A second air conditioning means for forming a down stream of clean air separate from the down stream of clean air formed by the first air conditioning means in the cleaning section, and directly or indirectly a substrate between the final cleaning section and the sub-arm mechanism; And a substrate flipping means for handing over the substrate, and before the substrate having been processed at the process station is stored in the cassette of the cassette portion, the substrate flipping means passes the substrate to the final cleaning portion, A cleaning liquid is sprayed on at least the rear surface of the substrate to wash it, and then the washed substrate is stored in a cassette of the cassette portion.

According to the resist processing method of the present invention, even if a resist solution, a developer, a particle, or the like adheres to the substrate during transport or processing of the substrate, the substrate is finally cleaned, so that the substrate is stored in a cassette in a clean state.

In addition, since the chemical filter is not needed in the final washing unit, the amount of the chemical filter used as a whole is reduced.

In addition, the final washing | cleaning part may be equipped with the single washing | cleaning processing apparatus, and may be equipped with the some washing | cleaning apparatus integrated. By providing a plurality of cleaning processing apparatuses in which the final cleaning unit is concentrated, a plurality of substrates can be processed in parallel at the same time, thereby improving throughput.

In addition, the feed placement table can also be used as a temporary stand-by place for the processing standby substrate, so that the series of processing becomes flexible and throughput is improved. By arranging such a plunging placing table in parallel or vertically, it becomes easy to process more and more boards simultaneously.

The arm mechanism (the third sub-arm mechanism) for handing over can be made simpler than the main arm mechanism of the process section, so the amount of oscillation (particle generation amount) is small.

Here, "directly or indirectly flipping the substrate" means that the substrate is directly transferred from one arm mechanism to the other arm mechanism, and that the other side is passed through the arm mounting platform. Indirect delivery of the substrate to the arm mechanism.

Embodiment

EMBODIMENT OF THE INVENTION Hereinafter, various preferable embodiment of this invention is described, referring an accompanying drawing. In this embodiment, the case where the present invention is used in a coating and developing processing system in which a chemically amplified resist is applied and developed on a semiconductor wafer is described.

As shown in FIG. 1 and FIG. 2, the coating and developing processing system 1 includes a cassette station 10, a process station 11, an interface unit 12,

The first and second subarm mechanisms 21 and 24 and the main arm mechanism 22 are provided in an air-conditioned clean room.

The cassette station 10 includes a cassette holder 20, and a plurality of cassettes CR are mounted on the cassette holder 20. Inside the cassette CR, one lot of wafers W are stored. One lot is 25 or 13 pieces. The wafer W is taken out of the cassette CR by the first subarm mechanism 21 and carried into the process station 11.

First as shown in Figure 1, process station 11 is provided with the five processing unit groups (G ₁ ~G _5). The processing units of the groups G _{1 to} G ₅ are arranged in the upper and lower ends, and the wafers W are loaded and unloaded one by one by the main arm mechanism 22. The interface unit 12 is provided between the process station 11 and an exposure apparatus (not shown). The wafer W is carried in and out of the exposure apparatus by the subarm 24.

Four projections 20a are formed on the cassette mounting table 20, and the cassette CR is positioned on the mounting table 20 by the projections 20a. The cover 44 is attached to the cassette CR carried into the cassette station 10. The cassette CR is placed on the mounting table 20 toward the process station 11 toward the cover 44.

The process station 11 is provided with five processing unit groups G ₁ , G ₂ , G ₃ , G ₄ , and G ₅ . The first and second processing unit groups G ₁ and G ₂ are arranged on the front side of the system, the third processing unit group G ₃ is disposed adjacent to the cassette station 10, and the fourth processing unit group G ₄ ) is disposed adjacent to the interface unit 12, and the fifth processing unit group G ₅ is disposed on the rear side.

As shown in FIG. 2, in the first processing unit group G ₁ , two spinner-type processing units, for example, a resist coating unit, in which a predetermined process is performed by placing the wafer W on the spin chuck in the cup CP. (COT) and developing unit (DEV) are stacked in two stages sequentially from the bottom. Also in the second processing unit group G ₂ , two spinner-type processing units, that is, a resist coating unit COT and a developing unit DEV, are sequentially stacked in two stages from below. It is preferable to arrange these resist coating units COT at the lower end so that waste liquid may be easily discharged.

Agents include, as shown in FIG. 3, the third processing unit group (G _3), for example, turned extension unit (EXT), the cooling unit (COL), a hot unit (HOT) is raised superimposed in this order from the bottom. In the fourth processing unit group G ₄ , for example, a cooling unit (COL), an extension / cooling unit (EXTCOL), an extension unit (EXT), a cooling unit (COL), a pre-baking unit (PREBAKE), and a post-baking unit (POBAKE) and ADHION UNI (AD) are stacked in order from the bottom.

In this way, the cooling unit (COL) and the extension cooling unit (EXTCOL) with low processing temperature are placed on the lower side, and the hot unit (HOT), pre-baking unit (PREBAKE), post-baking unit (POBAKE) By arranging the ADH Unit (AD) on the upper side, thermal interference between processing units is reduced.

When the main arm mechanism 22 receives the wafer W from the first subarm mechanism 21, the alignment unit ALIM and the extension unit belonging to the third processing unit group G ₃ in the process station 11 The wafer W is conveyed by EXT).

The interface 12 has a size in the X-axis direction approximately equal to that of the process station 11, but a size in the Y-axis direction is smaller than the process station 11. A portable pick-up cassette CR and a stationary buffer cassette BR are arranged in two stages on the front portion of the interface portion 12, and the peripheral exposure apparatus ( 23) is arrange | positioned, and the 2nd sub-arm mechanism 24 is provided in the center part. The second subarm mechanism 24 is of the same X configuration as the first subarm mechanism 21, and extends to the extension unit EXT belonging to the fourth processing unit group G ₄ , and further to the adjacent exposure apparatus side. It is also possible to access the wafer pick up stand (not shown).

In addition, in the coating and developing processing system 1, the fifth processing unit group G ₅ can be arranged on the rear surface of the main wafer transport mechanism 22. The fifth processing unit group G ₅ is movable along the guide rail 25 in the Y-axis direction. By moving the fifth processing unit group G ₅ , a space for performing the maintenance inspection work from the rear of the main arm mechanism 22 is secured.

Next, the main arm mechanism 22 will be described with reference to FIG.

The main arm mechanism 22 connects the holder moving part 34 in the Z-axis direction to the inside of the cylindrical support body 33 formed as a pair of vertical wall parts 31 and 32 which are connected to and opposed to each other at the upper end and the lower end. It is mounted so that lifting is free. Since the cylindrical support 33 is connected to the rotational axis of the motor 35, the cylindrical support 33 and the holder moving part 34 are integrally rotated, so that the holder moving part 34 rotates around the Z axis. It is supposed to rotate.

The holder moving part 34 is provided with the carrier base 40 and the three holders 41, 42, 43 of several upper and lower stages. Three holders 41, 42, 43 are provided on the carrier base 40. Each of the holders 41, 42, and 43 has a form and size in which both side openings 36 between the vertical wall portions 31 and 32 of the cylindrical support 33 are free to pass, and the carrier base 40 The drive motor (not shown) and the belt (not shown) built in each of the two are independently advanced or retracted.

In the up-and-down arrangement intervals of the holders 41, 42, and 43, the interval between the uppermost holder 41 and the second-stage holder 42 is equal to the second-stage holder 42 and the lowermost holder. It is larger than the space | interval between 43. This is to prevent the adverse effect on the processing by the mutual interference of the wafers W held by the uppermost holder 41 and the second-stage holder 42, respectively. Therefore, the uppermost holder 41 is usually used when performing a resist coating step from the cooling step, and the holder 42 of the second stage is used for conveying the wafer W without fear of adverse effects due to such thermal interference. The lowermost holder 43 is used. In order to further enhance the effect of preventing thermal interference, for example, a heat insulating plate (not shown) may be arranged between the uppermost holder 41 and the second-stage holder 42.

In the vicinity of the end of the conveying path 21a of the first sub-arm mechanism 21, a pawl mounting stand 51 is provided. The plunging placing table 51 is provided in a space different from the space in which the first to fifth processing device groups G _{1 to} G ₅ and the main arm mechanism 22 are arranged. In other words, as shown in FIG. 1, the catching table 51 is surrounded by the casing body 70a of the cleaning unit 70. The final washing | cleaning apparatus 71 is also provided in this casing body 70a. As shown in FIG. 5, an air conditioner 81A is mounted on the upper part of the final cleaning device 71. As shown in FIG. This air conditioning apparatus 81A is equipped with a ULPA filter and a fan. The UAPA filter has a physical filtration function to capture and remove ultrafine particles.

The take over base 51 is provided with three support pins 53 which protrude freely from the upper surface member 52. The wafer is free to be placed on the protruding support pins 53, and the first subarm mechanism 21 mounts the wafer with respect to the protruding support pins 53 or vice versa. It is free to accept the wafer on).

On the back side of the plunger 51, that is, the extension line along the X-axis direction, a third subarm mechanism 61 constituting the other conveying means of the present invention is provided. The third subarm mechanism 61 has two holders 62 and 63 holding the wafer W directly above and below, and each of these holders 62 and 63 is free to move forward and backward independently. The third sub-arm mechanism 61 is movable in the Z-axis direction by the elevating drive mechanism (not shown), and can be rotated θ around the Z axis by the θ rotation drive mechanism (not shown). Thus, each holder 62,63 of the 3rd subarm mechanism 61 mounts the wafer W with respect to the support pin 53 of the plunger 51, or on the support pin 53 It is free to accept the wafer W.

The final cleaning apparatus 71 has a rotating mechanism (not shown) for spin-rotating the wafer W and a nozzle (not shown) for spraying high pressure jet water toward the wafer W. A carrying-out inlet 72 is formed on the front side of the washing processing apparatus 71, and the wafer W is driven by the third sub-arm mechanism 61 through the carrying-out inlet 72. 71) bringing in and out.

2, as shown in Fig., A cassette mounting table 20, the first sub conveyed to (21a), first to fifth processing unit group (G _1, G _2, G of the arm mechanism (21) _3, G ₄ G ₅ ) and the filter device 81 are provided above the interface unit 12, respectively. The filter device 81 is provided above each of the first area (cassette station 10), the second area (process station 11), and the third area (interface part 12). Each filter device 81 is provided with either or both of a chemical filter element and a ULPA filter element. In addition, the filter device 81 is provided with a fan (not shown). These filter devices 81 supply clean air to the parts 10, 11 and 12 from the upper side so that down flows are formed separately. Moreover, for the resist liquid coating apparatus COT or the developing apparatus DEV which generate | occur | produce an organic component in a process unit, the downflow of clean air is formed in each inside separately.

Next, the resist processing method of the wafer W is demonstrated with reference to the flowchart shown in FIG.

The cassette C is placed on the cassette holder 20. In the cassette C, a plurality of wafers W before processing are accommodated. The first subarm mechanism 21 accesses the cassette C, and takes out one wafer W from the cassette C (step S1).

Subsequently, the first subarm mechanism 21 moves to the alignment device ALM of the third processing device group G ₃ , and moves the wafer W into the alignment device ALM. In the alignment device ALM, the orientation plates of the wafer W are arranged in the desired direction, and the wafer W is centered. Thereby, the wafer W is aligned with respect to the process part 11 and the cleaning part 70 (step S2). After alignment of the wafer W, the controller 90 determines whether or not to preclean the wafer W based on the predetermined process input data (step S3).

When the determination result of step S3 is YES, the 1st subarm mechanism 21 conveys the wafer W from the alignment apparatus ALM to the washing | cleaning part 70, and is demonstrated later (S18). The wafer W is preliminarily cleaned from step S22 to step S22. That is, the 1st sub-arm mechanism 21 conveys the wafer W from the alignment apparatus AIM to the take-up base 51, and mounts it on the take-up base 51 (step S18). Subsequently, the third sub-arm 61 passes the wafer W into the cleaning processing unit 71 from the mounting table 51 (step S19), and preliminarily cleans the wafer W from the cleaning processing unit 71. do. In this preliminary cleaning process, high-pressure jet water is sprayed on both sides of the wafer W to clean both sides (step S20). After the preliminary cleaning process, the third subarm 61 is carried out of the wafer W from the cleaning process unit 71 (step S21), and placed on the plunger 51 (step S22). In addition, the controller 90 determines that the processing of the wafer has not been completed (step G23), whereby the first subarm 21 passes the wafer W to the main arm mechanism 22. Note arm mechanism 22 is a resist process for the wafer _(W), according to the process from step S4 to S17 described later conveyed sequentially, and each processing unit in the wafer (W) process (11).

On the other hand, when the determination result of step S3 is NO, the main arm mechanism 22 accesses the alignment device ALM, removes the wafer W from the alignment device ALM, and enters the ad-histor device AD. The wafer W is conveyed. In the addiction apparatus AD, the wafer W is subjected to an addiction process (step S4). The wafer W is heated in this adhigenation process.

Then, the main arm mechanism 22 carrying the wafer (W) to the cooling unit (COL) belonging to one of the third processing apparatus group (G ₃₎ or the fourth processing unit group (G _4). In the cooling device COL, the wafer W is cooled to a set temperature (23 ° C) (step S5). Further, the main arm mechanism 22 carries the wafer W out of the cooling device COL by the upper holder 41, and at the same time, the next wafer W (the other wafer W) by the intermediate holder 42. Into the cooling system (COL).

Subsequently, the main arm mechanism 22 carries the wafer W into the resist coating device COT belonging to one of the first processing device group G ₁ or the second processing device group G ₂ . In the resist coating apparatus COT, a resist solution is applied to one side of the wafer W (step S6).

Subsequently, the main arm mechanism 22 conveys the wafer W from the resist liquid application apparatus COT to the prebaking apparatus PREBAKE. In the prebaking apparatus PREBAKE, the wafer W is heated to a temperature of about 100 ° C. for a predetermined time (step S7).

Subsequently, the main arm mechanism 22 conveys the wafer W from the prebaking apparatus PREBAKE to the extension cooling apparatus EXTCOL belonging to the fourth processing apparatus group G ₄ . In the extension cooling device EXTCOL, the wafer W is cooled to about 24 ° C (step S8). The target temperature in this cooling process S8 employ | adopts the temperature suitable for the process of the peripheral exposure apparatus of the next process S9. In addition, the main arm mechanism 22 transfers the wafer W from the extension cooling device EXTCOL to the extension device EXT, and mounts the wafer W on a mounting table (not shown) in the extension device EXT. do.

Subsequently, the second subarm mechanism 24 accesses the extension device EXT to carry the wafer W into the interface unit 12. The second subarm mechanism 24 carries the wafer W into the peripheral exposure apparatus 23. In the peripheral exposure apparatus 23, the peripheral edge part of the wafer W is exposed (process S9).

Subsequently, the second subarm mechanism 24 transfers the wafer W from the peripheral exposure apparatus 23 to the wafer holder (not shown) of the exposure apparatus (not shown). When the exposure apparatus cannot receive the wafer W, the controller 90 issues a standby command to the second subarm mechanism 24, and accordingly, the second subarm mechanism 24 causes the wafer W to run. ) Is temporarily stored in the buffer cassette BR (step S10). In the exposure apparatus (not shown), the wafer W is subjected to the entire surface exposure process (step S11). When the wafer W is returned to the wafer holder (not shown), the second subarm mechanism 24 moves from the holder to the extension apparatus EXT belonging to the fourth processing apparatus group G ₄ . Return. When the developing device DEV cannot accept the wafer W, the controller 90 generates a standby command to the second subarm mechanism 24, and accordingly, the second subarm mechanism 24. Temporarily stores the wafer W in the buffer cassette BR (step S12).

When the wafer W is loaded into the extension device EXT, the main arm mechanism 22 accesses the wafer W and takes the wafer W out of the extension device EXT. Subsequently, the main arm mechanism 22 carries the wafer W into the developing apparatus DEV belonging to either the first processing apparatus group G ₁ or the second processing apparatus group G ₂ . In the developing apparatus DEV, a developing solution is sprayed onto the coating resist of the wafer to develop the coating resist (step S13). Subsequently, pure water is sprayed on the wafer surface to rinse the developer for washing the developer (step S14).

Subsequently, the main arm mechanism 22 transfers the wafer W into one of the third processing apparatus group G ₃ and the fourth processing apparatus group G ₄ from the developing apparatus DEV. POBAKE). In the post-baking apparatus POBAKE, the wafer W is heated at a temperature of about 100 ° C. for a predetermined time (step S15).

Subsequently, the main arm mechanism 22 conveys the wafer W from the post-baking apparatus POBAKE to the cooling apparatus COL. In the cooling device COL, the wafer W is cooled to about 23 ° C (step S16). Subsequently, the main arm mechanism 22 conveys the wafer W from the cooling device COL to the extension device EXT belonging to the third processing device group G ₃ (step S17).

Subsequently, the first subarm mechanism 21 accesses the extension device EXT and takes out the wafer W therefrom. The first subarm mechanism 21 moves in the X-axis direction while rotating θ, and transfers the wafer W to the placement table 51 (step S18). Subsequently, the wafer W is taken out of the plunger 51 by the lower holder 63 of the third subarm mechanism 61, and the wafer W is taken into the cleaning processing apparatus 71 through the loading / unloading port 72 (process). S19). In the cleaning processing apparatus 71, the high pressure jet water is injected toward the back surface of the wafer W. As shown in FIG. Thereby, the foreign matter adhering to the back surface of the wafer W is removed, and the back surface of the wafer W is finally cleaned (step S20). Subsequently, the wafer W is taken out of the cleaning processing apparatus 71 by the upper holder 62 of the third subarm mechanism 61 (step S21), and the next wafer W is carried out by the lower holder 63. Into the cleaning processing apparatus 71.

When the third sub-arm mechanism 61 transfers the final cleaned wafer W to the delivery platform 51, the first sub-arm mechanism 21 accesses the delivery platform 51 to provide the delivery platform. The wafer W is taken out of the table 51 (step S22). The controller 90 determines whether or not the processing of the wafer W is finished (step S23). In step S23, if it is determined as NO, a series of resist processes from step S4 to step S17 are executed. On the other hand, when it determines with yes (YES) in step S23, the 1st subarm mechanism 21 accommodates the wafer W in the cassette C on the mounting table 20 (step S24). When the cassette C becomes full with the processed wafer W, the wafer W is taken out of the system together with the cassette C. Moreover, the wafer W is used for the next process, such as an etching process, in a clean state.

According to this embodiment, the cleaning process apparatus 71 is than placed in a separate other spaces main arm mechanism 22 and the liquid processing unit group (G _1, G _2), In addition, the third sub-arm mechanism 61 Since the drive system has a simpler structure than that of the main arm mechanism 22, there is little possibility that foreign matter such as particles or organic components adheres to the wafer W after the final cleaning.

In addition, since the chemical filter is unnecessary in the cleaning unit 70, the amount of the chemical filter used as a whole of the system is reduced.

In addition, since the wafer W may be temporarily held in the delivery part 51, the operation rate of the whole system is improved.

In addition, in the said embodiment, although one washing | cleaning processing apparatus 71 was provided, you may provide the washing processing apparatus of several same types or a different type. Moreover, you may laminate | stack a several washing process apparatus in the upper and lower stages. Moreover, you may arrange | position several plunging part 51 in parallel or up and down.

In addition, a BARC treatment apparatus for performing a back face anti reflection coating may be provided in the cleaning treatment apparatus 71.

In addition to the semiconductor wafer, the substrate to be processed includes an LCD substrate, a CD substrate, a photomask, various kinds of printed substrates, ceramic substrates, and the like.

According to this invention, since the board | substrate which has the clean back surface which was finally cleaned is stored in a cassette, and this is conveyed to the next process, it does not adversely affect the next process, and the yield of a product improves. Moreover, as a whole system, the usage-amount of a chemical filter can be reduced. In addition, since the feed table can be used as a temporary stand-by place for the substrate, a series of resist processes can be made flexible, resulting in improved throughput.

1 is a perspective plan view showing an outline of a resist processing apparatus according to an embodiment of the present invention;

2 is a front view of a resist processing system,

3 is a back view of a resist processing system,

4 is a perspective view showing a part of the main arm mechanism cut out;

5 is a perspective view showing a catch portion, a third sub-arm mechanism and a cleaning treatment apparatus mounted on the side of the system main body,

6 is a flowchart showing a resist processing method according to the embodiment of the present invention;

<Description of the code | symbol about the principal part of drawing>

1: coating and developing processing system 10: cassette station

11 process station 12 interface unit

20: cassette mounting table 21, 24: sub arm mechanism

20A: projection 21A: conveying path

22: main arm mechanism 23: exposure apparatus

31,32: vertical wall portion 33: cylindrical support

34: holder moving part 35: motor

36: both sides opening 40: carrier base invitation

41 to 43, 62, 63 holder 44 cover

51: handing over table 52: upper surface member

53: support pin 61: third subarm mechanism

70 cleaning unit 70a casing body

71: cleaning processing unit 72: carrying in and out

81: filter device 81A: air conditioning device

90: controller

Claims (19)

(a) a process station for processing a substrate, a cleaning unit provided independently from the process station, a main arm mechanism for sequentially transporting the substrate within the process station, and a substrate flipping over substrate to the cleaning unit Means and a sub-arm mechanism for removing the substrate from the cassette and handing it over to the main arm mechanism or the substrate flipping means, and storing the substrate cleaned in the cleaning portion into a cassette; (b) removing the substrate from the cassette by the subarm mechanism, (c) conveying the removed substrate to the process station by the main arm mechanism; (d) the process station includes a process of developing at least a coating resist applied to the surface of the substrate, (e) at least after the development treatment step, the substrate is taken out from the process station by the main arm mechanism, and the substrate is delivered to the cleaning portion by the substrate flipping means; (f) In the cleaning section, at least the back surface of the substrate is sprayed with a cleaning liquid to finally clean the back surface of the substrate, (g) The resist cleaning method comprising storing the final cleaned substrate in a cassette by the subarm mechanism. The processing method according to claim 1, wherein in the step (f), pure water is jetted onto the back surface of the substrate to clean only the back surface of the substrate. The treatment method according to claim 1, wherein in the step (f), both surfaces of the substrate are cleaned by spraying pure water on both surfaces of the substrate. The resist processing method according to claim 1, further comprising a step of determining whether or not the substrate is cleaned before the step (c). 5. The resist processing method according to claim 4, wherein when it is determined that cleaning is required before the step (c), the substrate is delivered to the cleaning section and prewashed. The method of claim 5, wherein the preliminary cleaning step comprises spraying pure water on both surfaces of the substrate to clean both surfaces of the substrate. The resist processing method according to claim 1, wherein the step (d) further comprises a step of applying a resist to the substrate and a heat treatment step of heating and cooling the resist applied to the substrate. The process according to claim 1, wherein the step (d) adsorbs and cools the substrate, prebakes and cools the coating resist, peripherally exposes the coating resist, and exposes the entire surface of the coating resist. And a step of post-baking to cool later. A cassette unit through which a cassette containing a plurality of substrates enters and exits, A process station including at least developing means for developing a coating resist applied to a surface of the substrate; A first air-conditioning means having a chemical filter for removing organic components, the first air-conditioning means for forming a downward flow of clean air in the process station; A main arm mechanism for sequentially conveying the substrate in the process station; A sub-arm mechanism which takes out the boards one by one from the cassette of the cassette section and turns over the boards directly or indirectly to the main arm mechanism; A final washing unit installed in a separate place from the process station and spraying a cleaning solution on the substrate to clean the substrate, wherein the substrate is not returned to the final washing unit by the main arm mechanism; A second air conditioning means having a filter for removing particles, the second air conditioning means for forming a downstream of clean air separate from the down stream of clean air formed by the first air conditioning means in the final cleaning unit; A substrate feeding means for receiving the substrate directly or indirectly between the final cleaning portion and the sub-arm mechanism, Before storing the substrate which has been processed at the process station into the cassette of the cassette part, the substrate flipping means passes the substrate to the final cleaning part, and at least a rear surface of the substrate is sprayed with a cleaning liquid to clean it. And thereafter storing the cleaned substrate in a cassette of the cassette portion. 10. The substrate holding means according to claim 9, wherein the substrate dispensing means is provided between the final cleaning portion and the cassette portion, and the substrate placing means on which the substrate is placed by the sub-arm mechanism and the substrate placing means is lifted from the substrate placing means. And a transfer arm mechanism for lifting the substrate to the final washing unit. The resist processing apparatus according to claim 10, wherein the conveying arm mechanism is provided between the final cleaning portion and the drop placement table. 11. The resist processing apparatus according to claim 10, wherein the transfer arm mechanism has a plurality of holder members for holding a substrate, respectively. 13. The carrier arm mechanism according to claim 12, wherein the conveyance arm mechanism comprises: X-axis driving means for moving the holder member in the X-axis direction, Z-axis driving means for moving the holder member in the Z-axis direction; A resist processing apparatus having θ rotation driving means for rotating. 11. The resist processing apparatus according to claim 10, wherein the plunger is placed near the end of the passage where the subarm mechanism moves. 10. The resist processing apparatus according to claim 9, wherein the process station further includes resist applying means for applying resist to a substrate, and heat treatment means for heating and cooling the substrate. A process station equipped with a main arm mechanism, A plurality of processing units disposed in a peripheral area of the process station so as to surround the main arm mechanism, the plurality of processing units including at least a resist coating unit, a developing unit, and a heat treatment unit for processing a substrate conveyed by the main arm mechanism; A cassette station provided adjacent to the process station, and having a plurality of cassettes for storing a plurality of substrates, and having a sub-arm mechanism for loading a substrate into the cassette and further removing the substrate from the cassette; An interface unit provided adjacent to the process station, A cleaning processing apparatus which is provided at a place separate from the process station, sprays a cleaning liquid onto the substrate and cleans it, and does not convey the substrate by the main arm mechanism; A first throwing mechanism provided near one end of a conveying path of the sub-arm mechanism of the cassette station to enter and exit the substrate into the cleaning processing apparatus, and for flipping the substrate between the sub-arm mechanism; And a second flipping mechanism provided in the interface portion to pass the substrate through the exposure processing apparatus, and for flipping the substrate between the main arm mechanism. 17. The resist processing apparatus according to claim 16, wherein the first flipping mechanism includes a lifting mechanism for raising or lowering the substrate so as to flip over the substrate with respect to the transfer mechanism provided on the cleaning processing apparatus side. 18. The method according to claim 17, wherein it is determined whether or not the substrate is to be cleaned in advance, and when the determination result is YES, the substrate is flipped from the subarm mechanism to the first droop mechanism, and the first flip is performed. The substrate is transferred from the mechanism to the conveying mechanism, the substrate is conveyed by the conveying mechanism to the cleaning treatment apparatus, and the substrate is pre-cleaned by the cleaning treatment apparatus, and then the substrate is transferred from the conveying mechanism to the first flipping mechanism. The substrate is flipped over, the substrate is flipped off from the first flipping mechanism to the subarm mechanism, the substrate is flipped off from the subarm mechanism to the main arm mechanism, and the substrate is transferred to each processing unit in the process station by the main arm mechanism. Conveying the substrate, the substrate is flipped over from the main arm mechanism to the second flipping mechanism, and the second flipping over A control for controlling the sub-arm mechanism, the main arm mechanism, the first throw mechanism, the transfer mechanism and the second throw mechanism respectively so that a substrate is transferred from the interface portion to the exposure processing apparatus by a sphere. A resist processing apparatus further comprising means. The process according to claim 17, wherein it is determined whether or not to preclean the substrate, and when the determination result is NO, the substrate is handed over from the sub-arm mechanism to the main arm mechanism, and the process is performed by the main arm mechanism. Conveying the substrate to each processing unit in the station, passing the substrate from the main arm mechanism to the second droop mechanism, and conveying the substrate from the interface unit to the exposure processing apparatus by the second droop mechanism; The substrate subjected to the exposure treatment is passed from the second flipping mechanism to the main arm mechanism, and the main arm mechanism transfers the substrate to each processing unit in the process station, and receives the substrate from the main arm mechanism to the sub arm mechanism. Turn over the substrate from the sub-arm mechanism to the first turn over mechanism; 1 The substrate is transferred from the return mechanism to the conveyance mechanism, the substrate is conveyed to the cleaning treatment apparatus by the conveying mechanism, and the substrate is finally cleaned by the cleaning treatment apparatus, and the first return from the conveying mechanism is carried out. The sub-arm mechanism, the main arm mechanism, the first to pass the substrate to the mechanism, to flip the substrate from the first flip mechanism to the sub-arm mechanism, and to receive the substrate into the cassette by the sub-arm mechanism. 1. A resist processing apparatus further comprising control means for respectively controlling a take-up mechanism, said transfer mechanism, and said second take-up mechanism.

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