KR20160061063A - Apparatus for Manufacturing Adhesive-Pad for EMI shielding of Semiconductor Packages and Method for Manufacturing Adhesive-Pad Using the Same - Google Patents

Apparatus for Manufacturing Adhesive-Pad for EMI shielding of Semiconductor Packages and Method for Manufacturing Adhesive-Pad Using the Same Download PDF

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Publication number
KR20160061063A
KR20160061063A KR1020140163503A KR20140163503A KR20160061063A KR 20160061063 A KR20160061063 A KR 20160061063A KR 1020140163503 A KR1020140163503 A KR 1020140163503A KR 20140163503 A KR20140163503 A KR 20140163503A KR 20160061063 A KR20160061063 A KR 20160061063A
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South Korea
Prior art keywords
tray
adhesive
pad
sensitive adhesive
liquid
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KR1020140163503A
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Korean (ko)
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KR101666786B1 (en
Inventor
김창수
이민진
김종운
김봉석
김태형
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(주) 씨앤아이테크놀로지
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Priority to KR1020140163503A priority Critical patent/KR101666786B1/en
Priority to PCT/KR2015/006048 priority patent/WO2016080615A1/en
Publication of KR20160061063A publication Critical patent/KR20160061063A/en
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Publication of KR101666786B1 publication Critical patent/KR101666786B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/922—Static electricity metal bleed-off metallic stock

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coating Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The present invention relates to an adhesive-pad manufacturing apparatus for forming electromagnetic wave interference shielding film of a semiconductor package, and a manufacturing method for an adhesive-pad using the same. The adhesive-pad manufacturing apparatus of the present invention has a cluster structure centered on a robot unit which moves a tray. The apparatus comprises: a docking station which is supplied a tray from the outside; a liquid adhesive applying unit which moves the tray of the docking station to the robot unit and applies a liquid adhesive on an upper surface of the tray to detach the semiconductor package; a curing which heats in order to harden the liquid adhesive applied on the upper surface of the tray; and a cooler which cools the tray wherein the liquid adhesive is hardened. The apparatus manufactures an adhesive-pad by using a liquid adhesive on the tray such that the adhesive-pad can be evenly attached when the semiconductor package is loaded. The apparatus facilitates the unloading of the semiconductor package, thereby reducing the loss of the semiconductor package. In addition, due to the cluster system, the apparatus reduces the entire size of the equipment, and facilitates additional expansion and reduction of the equipment. The all process can be automated.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an adhesive pad manufacturing apparatus for forming an electromagnetic wave shielding film in a semiconductor package, and a method of manufacturing the adhesive pad using the adhesive pad.

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an adhesive pad manufacturing apparatus for forming an electromagnetic wave shielding film in a semiconductor package and a method of manufacturing the adhesive pad using the adhesive pad. More particularly, The semiconductor package can be easily unloaded, and damage of the semiconductor package can be reduced, the used adhesive pad can be easily removed from the tray, the size of the entire equipment can be reduced by the cluster system, To an adhesive pad manufacturing apparatus for forming an electromagnetic wave shielding film of a semiconductor package which can be easily reduced in accordance with the use of additional expansion and use and can be automated by a whole process, and a method of manufacturing a pressure pad using the same.

Generally, in a thin film deposition process for forming an electromagnetic wave shielding film of a semiconductor package, an adhesive tape is used to fix a semiconductor package on a tray. That is, in the conventional technique, the semiconductor package loading and unloading unit includes a tape loading module for loading an adhesive tape for fixing a semiconductor package on a tray, a loading module for loading a semiconductor package in a tray on which the tape is loaded, A transport module for transporting the loaded semiconductor package, an unloading module for unloading the semiconductor package having the shielding film formed thereon from the tray, and a tape removing module for removing the used tape.

In this conventional technique, in order to mount the adhesive tape on the tray, the tape loading module sequentially attaches adhesive tapes of a certain width to the tray in a line, and the loading module loads the semiconductor package onto the tape, Because it was difficult to automate and to attach all the packages to the tray in a flat and flat manner.

In the prior art, since the tape used in the tape removing module has to be manually removed one by one in order to remove the tape from the tray, the operation efficiency is low and it is difficult to use the automatic apparatus.

As a conventional technique related thereto, Korean Patent Registration No. 10-0441128 discloses a technique for attaching a wafer, which is a raw material for manufacturing a semiconductor package, using a tape when sowing.

In the prior art, when the wafer is bonded with the tape, the bonding surface of the tape is not uniform and bubbles are generated, and the adhesive state of the tape is not good, so the problems of the prior art described above are retained.

Korean Patent No. 10-0441128.

SUMMARY OF THE INVENTION The present invention has been made in order to solve the above-mentioned problems, and it is an object of the present invention to solve the problem that it is difficult to attach the adhesive tape to the tray evenly and uniformly, and automation is difficult.

Further, there is a problem that occurs when the semiconductor package fixed to the adhesive tape is automatically unloaded, that the adhesive tape used is difficult to remove, and that when the semiconductor package is detached using the automatic apparatus, the semiconductor package is damaged, In order to solve the problem of degradation.

In order to achieve the above object, according to the present invention, there is provided a cluster structure centered on a robot unit for transporting a tray, comprising: a docking station for receiving a tray from the outside; a tray for transferring the tray of the docking station to the robot unit, A liquid curable pressure sensitive adhesive coating device for applying a liquid curable pressure sensitive adhesive for releasing a semiconductor package on an upper surface of the tray, a curing device for heating the cured liquid curable pressure sensitive adhesive on the upper surface of the tray, An adhesive layer formed on a surface of the adhesive layer;

In the present invention, a cassette docking module for transferring a cassette having a plurality of shelves to stack the plurality of trays from the outside and docking the cassettes to the docking station may be further included.

Here, the cassette docking module may include a seating plate on which the cassette is seated, and an up / down cylinder for lifting the seating plate for docking the cassette.

On the other hand, the liquid-based pressure-sensitive adhesive applicator includes a dispenser for applying a liquid pressure-sensitive adhesive to the tray, moving means for moving the dispenser in the X direction, Y direction or Z direction in accordance with an input program, And a rotating means for rotating the rotating shaft.

Wherein the liquid-state adhesive is formed by mixing silicon and a curing agent in a predetermined ratio, the dispenser comprising: a first storage container for storing silicon; a second storage container for storing a curing agent; And a discharging portion for discharging a mixture of the silicon and the curing agent.

The first storage container and the second storage container may be fabricated by coating fluorine-based Teflon on the inner wall to prevent chemical reaction with the metal without sticking to the liquid pressure-sensitive adhesive material, and the first storage container and the second storage container A clean pump air system for discharging the liquid pressure-sensitive adhesive material from the first storage container and the second storage container; A screw type rotor and a stator set for controlling the discharge amount of the liquid pressure-sensitive adhesive raw material supplied from the storage container and the second storage container, and a steric mix of a laminated step structure in which the liquid pressure- and a static mixer.

Meanwhile, in the present invention, the robot unit is composed of a three-axis conveying robot having degrees of freedom in the Z,?, And R directions, and includes a multi-joint arm provided on a robot stand in the Z-axis direction, Can be combined with robot-and-effects.

In some of the shelves of the cassette, a tray on which the application of the liquid pressure-sensitive adhesive is completed may be made of a shelf for self-leveling for planarization.

In the present invention, the curing unit includes a plurality of heater modules, wherein the heater module includes a heater fixing plate having a helical heater and a tray heating plate spaced apart from the heater fixing plate, The tray heating plate may be configured to be inflated only in the lateral direction even if the heater fixing plate is deformed by heat.

Further, a lift pin for lifting up the tray and a driving means for moving the lift pin up or down may be provided.

The curing unit may further include a separate ramping heater for heating the tray on which the liquid-phase adhesive is applied.

In the present invention, the adhesive pad remover for removing the adhesive pad on the upper surface of the tray after unloading the semiconductor package on which the electromagnetic wave shielding film is deposited may be further included.

The pressure-sensitive adhesive pad remover includes a tray holder for seating the transported tray, a knife as a means for removing the used pressure-sensitive adhesive pad, a waste pressure pad storage box for discarding the removed pressure-sensitive adhesive pad, And a tray driving device for rotating the tray to remove the adhesive pad.

In addition, the adhesive pad remover may be included in the adhesive pad manufacturing apparatus or independently configured to operate independently of the adhesive pad manufacturing apparatus.

According to another aspect of the present invention, there is provided a method of manufacturing a cassette, comprising the steps of: positioning a cassette in a docking station using a cassette docking module; and pressing a start button, the robot unit transfers the stacked cassettes to a dispenser chamber A step of applying a liquid pressure-sensitive adhesive to the tray by a liquid-type adhesive applicator provided in the dispenser chamber; a step of moving the coated tray to a self-leveling position for a planarizing operation; Transferring the coated pressure sensitive adhesive to a cassette, heating and curing the applied liquid pressure sensitive adhesive when the applied pressure is flat, cooling the cured liquid pressure sensitive adhesive, and transferring the pressure sensitive adhesive pad to the cassette, A method of manufacturing a pad is provided.

In the present invention, the step of removing bubbles by blowing the bubbles generated on the surface of the liquid-type adhesive at the time of transferring to the curing machine may be further included.

The step of transferring the tray to a curing unit and heating and curing the curable liquid may include heating the tray coated with the liquid curable adhesive with a separate ramping heater and moving the curable liquid to a heater module for curing the liquid curable adhesive.

In the present invention, the step of removing the adhesive pad may further include the steps of: placing the tray unloaded from the package in the tray holder of the robot unit or manually removing the adhesive pad; Removing the adhesive pad with a knife while moving the adhesive pad inward from the edge while the tray is rotated by the tray driving device, removing the adhesive pad from the edge of the tray, Moving the pads to the waste stick pad holder and discarding them; transferring the tray from which the adhesive pads have been removed to the cassette from the robot unit or manually from the tray holder; and placing the new tray in the tray holder .

As described above, according to the present invention, the semiconductor package can be easily detached, and the semiconductor package can be automatically loaded or unloaded, thereby improving productivity and yield, The uniformity can be improved and the defect rate can be reduced. In addition, the adhesive pad used can be easily removed to reuse the tray that is not contaminated with foreign matter, and when the semiconductor package automatic apparatus is unloaded, the semiconductor package can be prevented from being damaged by force.

1 is a perspective view illustrating an apparatus for manufacturing an adhesive pad for forming an electromagnetic wave shielding film of a semiconductor package according to an embodiment of the present invention.
Fig. 2 is a perspective view showing the robot unit in Fig. 1. Fig.
3 is a perspective view showing the cassette docking module of the present invention.
4 is a front view of Fig.
5 is a perspective view showing the liquid-based pressure-sensitive adhesive applicator of the present invention.
6 is a front view of Fig. 5. Fig.
7 is a front view showing the curing station of the present invention.
8 is a view showing a main part of the heater module of the present invention.
9 is a longitudinal sectional view showing the heater module of the present invention.
10 is a view showing a cooler of the present invention.
11 is a flowchart showing a method of manufacturing a pressure-sensitive adhesive pad according to the present invention.
12 is a view showing the adhesive pad remover of the present invention.
13 is a flowchart showing a method of removing the adhesive pad of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the drawings, the same reference numerals are used to designate the same or similar components throughout the drawings. The structure and operation of the present invention shown in the drawings and described by the drawings are described as at least one embodiment, and the technical ideas and the core structure and operation of the present invention are not limited thereby.

FIG. 1 is a perspective view illustrating an adhesive pad manufacturing apparatus for forming an electromagnetic wave shielding film of a semiconductor package according to an embodiment of the present invention, and FIG. 2 is a perspective view illustrating the robot unit of FIG.

1, the adhesive pad manufacturing apparatus 100 according to the present invention is formed into a cluster structure with a robot unit 110 as a center, and applies a liquid pressure-sensitive adhesive on the upper surface of the tray and performs a self-leveling process And then cooling it.

The apparatus 100 for manufacturing a pad according to the present invention is a cluster system having a robot unit 110 at the center. The system includes a docking station 10 for receiving a tray from the outside, a liquid adhesive And a curing station 30 for curing the liquid pressure-sensitive adhesive applied to the tray.

The docking station 10, the dispenser chamber 20, and the curing station 30 are provided in each of the two embodiments of the present invention. However, the present invention is not limited thereto, Of course, can be expanded and reduced. For example, the docking station 10, the dispenser chamber 20, and the curing station 30 may be configured to be plural or single, and the additional configuration may be expanded or reduced as necessary. In an additional configuration, for example, a pressure-sensitive adhesive pad removing chamber for removing the used pressure-sensitive adhesive pad (to be described later) attached to the tray may be provided. In addition, the adhesive pad manufacturing apparatus may include a loading module (not shown) for automatically loading the semiconductor packages on the tray and an unloading module (not shown) for automatically unloading the deposited semiconductor packages, And may be operated independently of the above-described adhesive pad manufacturing apparatus.

In the present invention, a dummy station 40 is provided so that the tray can be temporarily stored, and the dummy station 40 can be installed between the two docking stations 10.

Since the present invention is constituted by a cluster system, it is possible to reduce the size of the entire equipment and to easily expand the apparatus further, and the entire process can be automated. In addition, the present invention is not limited to a cluster structure, but may be constructed in an inline form.

Meanwhile, in the present invention, the robot unit 110 is constituted by a three-axis transportation robot having degrees of freedom in Z,?, And R directions. More specifically, the robot stand 112 in the Z-axis direction includes a plurality of articulated arms 114 and 116, and the articulated arms 114 and 116 are provided with a robot end effect effector 118 are combined.

The robot end effector 118 is provided with a tray seating groove 108a corresponding to a tray shape so that the tray can be placed thereon so that the docking station 10, the dispenser chamber 20, or the curing station 30 So that the tray can be transported to the correct position without shaking.

The robot unit 110 monitors the operation progress of the docking station 10, the dispenser chamber 20 and the curing station 30 in real time to optimize the supply and movement of the tray. .

In order to accurately mount the tray, the robot unit 110 extracts R and θ direction coordinate values with the center of the robot stand 112 as the origin, extracts the height value in the Z direction according to the position of the tray to be transferred Thereby accurately mounting the tray into the docking station 10, the dispenser chamber 20, or the curing station 30. The structure and operation method of the robot unit 110 may be a well-known structure, and a detailed description thereof will be omitted.

FIG. 3 is a perspective view of the cassette docking module of the present invention. FIG. 4 is a front view of FIG. 3. In the present invention, a cassette 50 having a plurality of shelves 52 is stacked And a cassette docking module 120 for transferring the docking station 10 from the docking station 10 to the docking station 10.

As is well known, the cassette 50 is provided with a plurality of openings through which a tray can be inserted and ejected, a plurality of shelves 52 are provided at both sides of the openings at predetermined intervals, and a tray is stacked on the shelves 52 one by one Structure.

Some of the shelves 52 of the cassette 50 may be made of a shelf 54 for self-leveling for flattening the tray on which the application of the liquid pressure-sensitive adhesive is completed.

For example, if the shelf 52 of the cassette 50 is composed of 12, the two shelves 54 provided at the top of the shelf 52 are self-leveling the flattened tray for the flattening operation, And the remaining ten shelves 52 are used as a shelf for loading trays.

The cassette 50 is docked to the adhesive pad manufacturing apparatus of the present invention through the cassette docking module 120 and the cassette docking module 120 is provided at the entrance of the docking station 10.

The cassette docking module 120 includes a seating plate 122 on which the cassette 50 is seated and an up / down cylinder 124 for lifting the seating plate 122 for docking the cassette 50 can do. Such a cassette docking module 120 can raise or lower the up / down cylinder 124 to dock the cassette 50 to the correct position if the cassette 50 is placed on the seating plate 122.

The dispenser chamber 20 is provided with a liquid adhesive applicator (not shown) for transferring the tray supplied to the docking station 10 to the robot unit 110 and applying a liquid pressure- 130 are installed.

5 is a perspective view of the liquid adhesive applicator of the present invention and FIG. 6 is a front view of FIG. 5, wherein the liquid adhesive applicator 130 includes a dispenser 135 for applying a liquid adhesive to the tray 2, A moving means for moving the dispenser 135 in the X direction, the Y direction or the Z direction according to an input program and a rotating means for rotating the tray 2 with the tray 2 mounted thereon.

The liquid pressure-sensitive adhesive is formed by mixing silicon and a curing agent in a certain ratio. It is preferable that silicon and the curing agent are mixed at a ratio of 2: 1 to 100: 1 in consideration of viscosity and adhesive force.

The dispenser 135 includes a first storage container 132 for storing silicon, a second storage container 134 for storing a curing agent, a mixing section 136 for mixing the silicon and the curing agent at a predetermined ratio, And a discharge portion 138 for discharging a mixture of silicon and a curing agent.

The first storage container 132 and the second storage container 134 are fabricated by coating fluorine-based Teflon on the inner wall of the first storage container 132 and the second storage container 134 to prevent chemical reaction with the metal without sticking to the liquid pressure- A vacuum pump (not shown) for removing residual gas and minute bubbles mixed with impurities in the first storage container 132 and the second storage container 134; A clean dryer air system for discharging the liquid pressure-sensitive adhesive material, a screw type rotor (not shown) for controlling the discharge amount of the liquid pressure-sensitive adhesive material supplied from the first storage container 132 and the second storage container 134 a static mixer in which a rotor, a stator set and a liquid pressure sensitive adhesive are mixed and agitated may be included.

The moving means for moving the dispenser 135 in the X direction, the Y direction, or the Z direction may be a conventional ball screw and an LM guide. The rotating means may rotate And a motor 139.

The liquid adhesive applicator 130 moves the dispenser 135 in the X direction, the Y direction, or the Z direction so that the discharging part 138 of the dispenser 135 is moved to the tray 2) is coated with a liquid pressure-sensitive adhesive.

In order to cure the liquid adhesive applied on the upper surface of the tray 2, a curing unit 140 is installed in the curing station 30 and a cured liquid adhesive is placed under the curing unit 140 A cooler 150 for cooling is installed.

FIG. 7 is a front view showing a curing station of the present invention, FIG. 8 is a view showing a main part of the heater module of the present invention, FIG. 9 is a longitudinal sectional view showing the heater module of the present invention, Fig. 2 is a view of a cooler of the invention.

In the present invention, the curing unit 140 is composed of a plurality of heater modules.

The heater module includes a heater fixing plate 144 on which a heater 142 is installed in a spiral shape and a tray heating plate 146 mounted on an upper portion of the heater fixing plate 144.

The heater fixing plate 144 and the tray heating plate 146 are preferably spaced apart from each other. According to the present invention having such a configuration, even if the heater fixing plate 144 is deformed by heat, the tray heating plate 146 is configured to be inflated only in the lateral direction, thereby minimizing the deformation of the tray heating plate 146 can do.

Meanwhile, the curing station 30 may be provided with a lift pin for lifting up the tray, and driving means for moving the lift pin up or down.

In addition, the curing apparatus may further include a separate ramping heater 160 for heating the tray on which the liquid pressure-sensitive adhesive is applied. The ramping heater 160 is installed to heat the tray, and the temperature at which the liquid pressure-sensitive adhesive is cured varies depending on the kind of the liquid pressure-sensitive adhesive, for example, the mixing ratio of silicon and the curing agent. May be used to heat the tray prior to the curing process of the liquid curable adhesive, if desired.

The cooling unit 150 includes a plurality of cooling modules, and each of the cooling modules has a cooling channel 152 for supplying a cooling liquid, so that the liquid adhesive can cool the hardened tray.

Fig. 12 is a view showing the adhesive pad remover. Fig.

In the present invention, the adhesive pad remover 170 capable of removing the used adhesive pad may be further included. The adhesive pad remover 170 includes a tray holder 171 for mounting and fixing the tray 2 carried thereon and a knife 172 as a means for removing the used adhesive pad, A waste stick pad storage box 174 for discarding the adhesive pad, and a tray driving device 173 for rotating the tray to remove the adhesive pad on the tray.

When the tray holder 171 is rotated by the tray driving device 173, the adhesive pad on the tray is moved in the direction of the arrow A, The knife 172 is moved from the edge toward the inside and removed.

In the present invention, the adhesive pad remover 170 may be included in the adhesive pad manufacturing apparatus or may be separately operated and operated independently, so that the present invention is not limited to the configuration.

A method of manufacturing a pressure-sensitive adhesive pad using the pressure-sensitive adhesive pad manufacturing apparatus of the present invention having the above-described structure will now be described.

First, the cassette 50 is placed in the docking station 10 using the cassette docking module 120 (S100).

When the start button is pressed, the robotic unit 110 sequentially transfers the clear trays without foreign objects stacked in the cassette 50 to the dispenser chamber 20 in a predetermined program sequence (S110).

Thereafter, the liquid adhesive applicator 130 provided in the dispenser chamber 20 applies a liquid adhesive to the tray at a predetermined interval (S120).

The coated tray is moved to a self leveling position for a flattening operation (S130).

In this case, in the present invention, self-leveling is performed using the shelf 54 provided in the cassette 50. And waits for the liquid pressure-sensitive adhesive applied for a predetermined time at the self-leveling position to spread evenly. The time required for self-leveling usually takes about 10 minutes.

When the liquid pressure-sensitive adhesive applied on the tray is flattened, the tray is transferred to the curing unit 140 and heated and cured at a predetermined temperature and time (S140).

In the present invention, the step of removing air bubbles by blowing air bubbles generated on the surface of the liquid-type pressure-sensitive adhesive onto a fan may be further included during the transfer to the curing unit 140.

When heating of the tray is separately required depending on the type of the liquid pressure-sensitive adhesive, the tray coated with the liquid-based pressure-sensitive adhesive is heated by a separate ramping heater 160 and then moved to the heater module 140 for curing the liquid- do.

Thereafter, the cured liquid pressure-sensitive adhesive is cooled (S150).

Finally, the pressure sensitive adhesive pad of the present invention is completed by moving the pressure sensitive adhesive pad that has been cooled to the cassette 50 (S160).

13 is a flowchart showing a step of removing the adhesive pad.

A method of removing the adhesive pad using the adhesive pad remover 170 of the present invention will be described as follows.

The tray 2 unloaded from the adhesive pad remover 170 is secured to the tray holder 171 of the robot unit 110 or the adhesive pad remover 170 to securely fix the tray 2 in operation S200. .

The knife 172 moves to the edge of the tray with the tray placed on the tray holder 171 (S210).

Next, when the tray is rotated by the tray driving device 173, the adhesive pad on the tray is removed while moving the knife 172 inward from the edge (S220).

The removed adhesive pad is transferred to the waste sticking pad storage box 174 by the moving means and discarded (S230).

Thereafter, the tray 2 from which the adhesive pad has been removed is transferred from the robot unit or manually from the tray holder 171 to the cassette 50 (S240).

Next, the new tray 2 unloaded from the package is secured to the robot unit 110 or the holder of the adhesive pad remover by manually fixing it (S250).

Thereafter, the removal of the adhesive pad is repeatedly performed by the above procedure.

The above description is only illustrative of the technical idea of the present invention, and various changes and modifications may be made by those skilled in the art without departing from the essential characteristics of the present invention. It should be noted that the embodiments disclosed in the present invention are not intended to limit the scope of the present invention and are not intended to limit the scope of the present invention. The scope of protection of the present invention should be construed according to the following claims, and all technical ideas within the scope of equivalents should be construed as falling within the scope of the present invention.

10: docking station 20: dispenser chamber
30: Curing station 50: Cassette
110: Robot unit 120: Cassette docking module
130: Liquid pressure-sensitive adhesive applicator 140: Curing machine
150: cooler 160: ramping heater
170: Adhesive pad remover

Claims (18)

A cluster structure centered on a robot unit for transporting a tray,
A docking station for receiving a tray from outside;
A liquid adhesive applicator for transferring a tray of the docking station to the robot unit to apply a liquid pressure sensitive adhesive to the top surface of the tray for detaching the semiconductor package;
A curing unit for heating the liquid adhesive applied on the upper surface of the tray to cure the liquid adhesive; And
A cooler for cooling the cured tray of the liquid pressure-sensitive adhesive;
And an adhesive layer formed on the adhesive layer. The method according to claim 1,
Further comprising a cassette docking module for transferring a cassette having a plurality of shelves thereon to stack the plurality of trays from the outside and docking the cassettes to the docking station. The method of claim 2,
Wherein the cassette docking module comprises a seating plate on which the cassette is seated,
And an up / down cylinder for raising and lowering the seating plate for docking the cassette. ≪ RTI ID = 0.0 > 8. < / RTI > The method according to claim 1,
Wherein the liquid adhesive applicator comprises: a dispenser for applying a liquid pressure sensitive adhesive to the tray;
Moving means for moving the dispenser in the X direction, the Y direction, or the Z direction in accordance with the input program; And
Rotating means for rotating the tray when the tray is seated;
And an adhesive layer formed on the adhesive layer. The method of claim 4,
The liquid pressure-sensitive adhesive is formed by mixing silicon and a curing agent at a predetermined ratio,
The dispenser includes a first storage vessel for storing silicon, a second storage vessel for storing a curing agent, a mixing unit for mixing the silicon and the curing agent at a predetermined ratio, and a discharge unit for discharging a mixture of the silicon and the curing agent Wherein the electromagnetic wave shielding film is formed on the substrate. The method of claim 5,
Wherein the first storage container and the second storage container are fabricated by coating fluorine-based Teflon on the inner wall to prevent chemical reaction with the metal without sticking to the liquid pressure-sensitive adhesive raw material, and impurities in the first storage container and the second storage container A vacuum cleaner for removing mixed residual gas and fine bubbles, a clean dryer air system for discharging the liquid pressure-sensitive adhesive material of the first storage container and the second storage container, A screw type rotor and a stator set for controlling the discharge amount of the liquid pressure sensitive adhesive supplied from the second storage container and a static mix of a laminated step structure in which the liquid pressure sensitive adhesive is mixed and stirred, mixer) for forming an electromagnetic wave shielding film in the semiconductor package. The method according to claim 1,
Wherein the robot unit is constituted by a three-axis conveying robot having degrees of freedom in Z, &thetas; and R directions,
A multi-joint arm provided on the robot stand in the Z-axis direction,
Wherein the robot arm and the robot arm are coupled to each other by a robot and an effect to which the tray is mounted. The method of claim 2,
Wherein a part of the shelf of the cassette is made of a shelf for self-leveling for flattening the tray on which the application of the liquid pressure-sensitive adhesive is completed. The method according to claim 1,
The curing machine has a plurality of heater modules,
The heater module includes a heater fixing plate on which a heater is installed in a spiral shape,
And a tray heating plate installed on the upper portion of the heater fixing plate so as to be spaced apart from each other,
Wherein the tray heating plate is configured to be inflated only in the lateral direction even if the heater fixing plate is deformed by heat. The method of claim 9,
A lift pin for lifting up the tray, and driving means for moving the lift pin up and down. The method according to claim 1,
Wherein the hardener further comprises a separate ramping heater for heating the tray coated with the liquid-phase adhesive. The method according to claim 1,
Further comprising an adhesive pad remover for removing the adhesive pad on the upper surface of the tray after unloading the semiconductor package having the electromagnetic shielding film deposited thereon. The method of claim 12,
The pressure-sensitive adhesive pad remover includes a tray holder for seating the transported tray, a knife as a means for removing the used pressure-sensitive adhesive pad, a waste pressure pad storage box for discarding the removed pressure-sensitive adhesive pad, And a tray driving device for rotating the tray to remove the adhesive pad. 14. The method of claim 13,
Wherein the adhesive pad remover is included in the adhesive pad manufacturing apparatus or can be independently operated from the adhesive pad manufacturing apparatus. Positioning the cassette in the docking station using a cassette docking module;
When the start button is pressed, sequentially transferring the trays stacked in the cassette to the dispenser chamber by the robot unit;
Applying a liquid pressure-sensitive adhesive to the tray, wherein the liquid pressure-sensitive adhesive applicator provided in the dispenser chamber applies liquid pressure-sensitive adhesive to the tray;
Moving the coated tray to a self leveling position for planarization;
When the liquid adhesive applied on the tray is flattened, transferring the tray to a curing machine, heating and curing the liquid adhesive;
Cooling the cured liquid pressure-sensitive adhesive; And
Moving the prepared adhesive pad to the cassette after cooling is completed;
Wherein the method comprises the steps of: 16. The method of claim 15,
Further comprising the step of removing bubbles by blowing bubbles generated on the surface of the liquid pressure-sensitive adhesive during the transfer to the hardening unit with a fan. 16. The method of claim 15, wherein transferring the tray to a curing machine,
And heating and heating the tray on which the liquid-type adhesive is applied by a separate ramping heater to a heater module for curing the liquid-type adhesive, and heating the tray. 16. The method of claim 15, further comprising removing the adhesive pad,
The step of removing the adhesive pad comprises the steps of: placing the tray unloading the package in the robot unit or manually in the tray holder of the adhesive pad remover;
Moving a knife for removing the adhesive pad to an edge of the tray;
Removing the adhesive pad with a knife while moving the adhesive pad inward from the edge while the tray is rotated by the tray driving device;
Moving the removed adhesive pad to a waste stick pad storage box and discarding it;
Transferring the tray from which the adhesive pad has been removed to the cassette from the robot unit or manually from the tray holder; And
Placing a new tray in the tray holder;
Wherein the method comprises the steps of:
KR1020140163503A 2014-11-21 2014-11-21 Apparatus for Manufacturing Adhesive-Pad for EMI shielding of Semiconductor Packages and Method for Manufacturing Adhesive-Pad Using the Same KR101666786B1 (en)

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PCT/KR2015/006048 WO2016080615A1 (en) 2014-11-21 2015-06-16 Adhesive pad manufacturing apparatus for forming electromagnetic wave shielding film of semiconductor package, and adhesive pad manufacturing method using same

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018143718A1 (en) * 2017-02-03 2018-08-09 (주)잉크테크 Method for forming coating that blocks electromagnetic waves
KR20180090953A (en) * 2017-02-03 2018-08-14 주식회사 잉크테크 electromagnetic wave shield coating method
US10702819B2 (en) 2017-11-27 2020-07-07 Samsung Electronics Co., Ltd. Air cleaner

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110280444A (en) * 2019-07-03 2019-09-27 东莞京川精密机械设备有限公司 Fingerprint glass automatic attaching equipment

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100249182B1 (en) * 1996-11-04 2000-03-15 김영환 Method for manufacturing semiconductor device
KR100441128B1 (en) 1996-11-28 2004-10-08 앰코 테크놀로지 코리아 주식회사 Wafer mounting method and apparatus for semiconductor package to cutting easily each of patterns of wafer
KR100493988B1 (en) * 1996-09-03 2005-09-12 동경 엘렉트론 주식회사 Resist processing method and resist processing apparatus
KR100623170B1 (en) * 1999-02-12 2006-09-18 엘피이 에스피에이 Device for handling substrates by means of a self-levelling vacuum system in epitaxial induction reactors with flat disk-shaped susceptor and method for operation thereof
JP2009021382A (en) * 2007-07-12 2009-01-29 Max Tec:Kk Hold elevator device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100493988B1 (en) * 1996-09-03 2005-09-12 동경 엘렉트론 주식회사 Resist processing method and resist processing apparatus
KR100249182B1 (en) * 1996-11-04 2000-03-15 김영환 Method for manufacturing semiconductor device
KR100441128B1 (en) 1996-11-28 2004-10-08 앰코 테크놀로지 코리아 주식회사 Wafer mounting method and apparatus for semiconductor package to cutting easily each of patterns of wafer
KR100623170B1 (en) * 1999-02-12 2006-09-18 엘피이 에스피에이 Device for handling substrates by means of a self-levelling vacuum system in epitaxial induction reactors with flat disk-shaped susceptor and method for operation thereof
JP2009021382A (en) * 2007-07-12 2009-01-29 Max Tec:Kk Hold elevator device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018143718A1 (en) * 2017-02-03 2018-08-09 (주)잉크테크 Method for forming coating that blocks electromagnetic waves
KR20180090953A (en) * 2017-02-03 2018-08-14 주식회사 잉크테크 electromagnetic wave shield coating method
US10702819B2 (en) 2017-11-27 2020-07-07 Samsung Electronics Co., Ltd. Air cleaner
US10967319B2 (en) 2017-11-27 2021-04-06 Samsung Electronics Co., Ltd. Air cleaner

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