JPS58123517A - Manufacture of liquid crystal panel - Google Patents

Abstract

PURPOSE:To manufacture liq. crystal panels each provided with a nonlinear resistance element in large quantities at a low cost by coating terminal parts requiring no insulating oxide film with org. thin films, carrying out anodic oxidation, and stripping the thin films off. CONSTITUTION:Panel patterns 12 are continuously formed on a glass substrate 1, and ''OFPR '' of TOKYO OKA KOGYO KK which is not dissolved in a soln. of citric acid or phosphoric acid is stuck by a photolithographic method as org. thin films 10 coating the terminal parts 4. An arbitrary position of an electrode pattern 11 is connected to a power source for applying voltage, anodic oxidation is carried out to form an oxide film with high reliability on the patterns 12 except the parts of the films 10, and the films 10 are stripped off with acetone. The specific resistance of the terminal parts 4 is not changed by the anodic oxidation, no trouble is caused with respect to the electric conductivity, and the parts 4 are favorably used as terminals. After fixing up counter electrodes, the substrate 1 is cut to obtain a number of stable liq. crystal panels at once.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a liquid crystal panel having a non-linear resistance element, that is, a three-layer structure of metal, insulator, and metal. The object of the present invention is to provide a method for mass-producing liquid crystal panels with stable quality at a low cost while increasing the yield in manufacturing liquid crystal panels.

Liquid crystal display devices (AL) have become extremely popular in recent years as display devices for calculators, city cards, and electronic devices due to their low power consumption, small size, and light weight. Furthermore, the idea of using it as display equipment for small personal computers and the like is emerging. On the other hand, when a liquid crystal panel is used as a display element, @VC has the disadvantage that the amount of displayed information is generally small. This disadvantage is due to the poor contrast characteristics of the pressure applied to the liquid crystal, which makes it difficult for multiplex drive.
This is due to the fact that they are not suitable for At present, it is believed that the limit value V for multiplex driving of liquid crystals is about 120 to 30 digits. Several methods have been devised to improve this multiplexing characteristic and increase the amount of displayed information.One method is to use transistors, diodes, and other omitted elements. There is a method of correcting the multiplex characteristics of the liquid crystal by combining it with a liquid crystal to enable multi-digit multiplex driving of several hundred digits or more. Among them, there are three layers: gold envy, insulator, and gold envelopment! The liquid crystal display device using the M construction made of S construction is capable of multi-digit multiplex drive with several hundred digits, and the VC structure is relatively simple and easy to manufacture. It's one of the things that I do.

Now, a conventional example of a method for manufacturing an MIM portion in a liquid crystal panel using MXM is as follows. Fig. 1 shows an example of how a signal pole 2, an M component part 3, and a terminal part 4 are formed by completely forming a metal thin film on a glass substrate 1-A and patterning the metal. There is. Generally glass-1 on the base plate! , using a quartz glass substrate. Further, examples of the material of the metal thin film include tantalum, tantalum nitride, aluminum, etc., but basically any gold striped material that can form an oxide insulating film may be used.

Examples of methods for forming metal sheets include sputtering and steaming methods. Next, the surface of the metal mold tank except for the terminal portion 4 is oxidized by an electrochemical method. In terms of quality, the IL is used to oxidize only the surface of the M-damage forming part 3, but it does not oxidize the surface 75 of the signal electrical connection 2. SonV
The terminal part 4 is electrically connected to the outside if? , so oxidation of its surface is not allowed.

FIG. 2 shows an example in which the anodic oxidation method is used as the vapor chemical method. In Figure 2, the incorrect circuit thread is 'M
It consists of a pressing source 5, a glass substrate 1, an anodizing solution 6, and a metal plate 7vc. In this case, the voltage is applied so that the γL'fr metal thin film formed on the glass substrate 1 is positive and the metal@7 is negative.

Since each metal thin film must be anodized to form the glass substrate 1vC, each of the terminal parts 4 is fixed one by one by an appropriate method and the pressure source 5 is It is necessary to connect to the construction side.

Note that examples of the anodic oxidation solution 6 include citric acid and phosphoric acid aqueous solutions. An example of the metal plate 7 is a platinum plate. In the manner described above, a metal thin film is formed on the glass substrate 1, after which an oxide insulating film is formed, and a thin metal layer is once again formed and patterned to complete the M process M. Figure 3 shows one completed M■
The external appearance of the M is shown, and the M construction M component 6 is first formed using hot metal, and the metal quadrupole 8, which is later formed, is placed in front of it.

After this, Gamurasaki City 4Ij! 9 is formed so as to be electrically connected to metal electrode #8, and then assembled in the same manner as a normal liquid crystal panel.

The above is an outline of the conventional manufacturing method of the MIM portion in a liquid crystal panel that entirely uses MIM. One problem with this manufacturing method is that rLk is initially formed on an insulating substrate.
When oxidizing by an electrochemical method such as gold film thin film polar oxidation method, conventionally 1.
F! ! This is because terminal II 4 in Figure 1 is for electrical connection with the outside, and its surface cannot be oxidized.
Although it is possible with laboratory manufacturing methods because there is no mass production 6
− This is a method that does not lead to

The present invention eliminates these drawbacks and provides a panel that is mass-producible, inexpensive, and of stable quality.

Embodiments of the present invention will be described below using all the drawings.

FIG. 4 shows the patterning shape of an n-shaped metal cylinder 4 initially formed on a glass substrate 1 in an embodiment of the present invention. In the patterning shape of FIG. 4, a dotted panel pattern 12, which is different from the patterning of FIG. 1, is continuously provided. The method for applying an organic thin film on the terminal portion 4 of this electrode is to apply 0FPR'ii on the entire surface using the t1 photolithography method → pre-bake at 80°C for 20 minutes → exposure → development → post-bake at 120°C, 2
This figure shows the failure of the organic thin film 10 covering the terminal portion 4 after 0 minutes of testing. FIG. 5 shows a continuous pattern of +9t! in an embodiment of the present invention. It shows the oxidation state.
When an arbitrary part of the electrode pattern 11 was connected to the voltage power source 5 and anodized, the organic thin film 10 part so-called end-
A highly reliable oxide film was formed except for the f section 4. Thereafter, the organic thin film was peeled off with acetone, and the resistivity neck of the terminal part 4 was found to be good as the terminal part 4 without any problem in conduction, which was different before and after the positive oxidation.

FIG. 6 shows the location of the cutting portion after the panels are assembled in the embodiment of the present invention, and 12 is the cutting portion in the south and middle. Cutting method After assembling the opposite poles and cutting using a tire scribing method, we were able to make many stable LCD panels at once.

As stated above, as shown in page 7r, in the present invention, it is possible to produce 1U at a low price by using high-quality 51mm in KrL, and it is possible to make a VC, and the special V (display information) has a strong positive effect on MIM. If the invention is applied to the manufacture of calculators with a large number of metal electrodes, the results are very good.

[Brief explanation of the drawing]

FIG. 1 is a diagram showing the shape of a conventional lower gold W4 electrode. Figure 2 shows the lower boi Kanetsuna City Keyaki @! FIG. FIG. 3 is a diagram showing MIM metal formation. FIG. 4 shows the lower part '1' in the embodiment of the present invention! A diagram showing a location where the electrode terminal portion is coated with an organic thin film. FIG. 5 is a diagram showing how the lower left electrode is continuously anodized in a sister example of the present invention. FIG. 6 shows the lower electrode a! according to the embodiment of the present invention. Diagram showing the cutting locations after anodizing and assembly. Above 9-

Claims (1)

[Scope of Claims] (1) A metal electrode is formed on the surface of at least one of the two insulating substrates supporting the liquid crystal layer on the side that is in contact with the liquid crystal layer, and at least a portion of the metal is It is formed by anodic oxidation so as to overlap with the insulating film. A nonlinear resistance element consisting of a three-layer structure of metal, insulating film, and metal (hereinafter referred to as Metal-InElulatOr-Met)
In the liquid crystal panel manufacturing method having the initial letter t- of al and abbreviated as "M", among the metal electrodes formed first, electrodes that do not require the formation of an oxide insulating film are also included. All electrodes are connected continuously and oxidized p
A patented product panel in which LTa is polarized in one place and the front wall thin film is then peeled off. manufacturing method. (21 OMR-83, OMR-83, which does not dissolve in citric acid or phosphoric acid solution in areas that do not require the oxide insulation III)
Production of a liquid crystal display panel according to claim 1, which is one selected from FPR (Tokyo Ohka Kogyo registered trademark), AZ1350J (Spree Company registered trademark 43J), and ET CB resist (Sunf Chemical Industry registered trademark). Method. (3) The liquid crystal panel according to claim 1, wherein the organic thin Hω is coated on the portions not requiring the oxide insulating film by photolithography, screen printing, or offset printing. Production method. (4) Previous Mi? 2. The method of manufacturing a liquid crystal display panel according to claim 1, wherein a large number of liquid crystal panels are assembled and divided at one time by combining patterned electrodes continuously formed on a substrate and a counter substrate type @.