JPS58118242A - Manufacture of metallic foil lined resin board - Google Patents
Manufacture of metallic foil lined resin boardInfo
- Publication number
- JPS58118242A JPS58118242A JP126482A JP126482A JPS58118242A JP S58118242 A JPS58118242 A JP S58118242A JP 126482 A JP126482 A JP 126482A JP 126482 A JP126482 A JP 126482A JP S58118242 A JPS58118242 A JP S58118242A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- metal foil
- resin board
- manufacture
- metallic foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Laminated Bodies (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明は産業機器用、電子機器用等の各種１県用に用い
られる金属箔張樹脂板に関するもので、その目的とする
ところは、無溶剤且つ乾燥工程不要で賃金、無公害、省
エネルギーで金属箔張樹脂板を得ることにある。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a metal foil-clad resin board used for industrial equipment, electronic equipment, etc., and its purpose is to be solvent-free and free from drying process. The objective is to obtain a metal foil-clad resin board that is pollution-free and energy-saving.
従来、各櫨工巣用に用いられる金属箔張り積層板はフェ
ノール樹脂、エポキシ樹脂等の熱硬化性樹脂ワニスを紙
、布等の基材曇ζ含浸、乾燥したプリプレグを所要枚数
重ねた上に金属箔を載置し積層成形して得られるもので
あるが樹脂ワニスには有機溶剤を大量に使用するので作
Ｊｌ＆環境の悪化、引火爆発の危険、乾燥工程での大量
の熱エネルギーの必要性等が問題になっていた。Conventionally, the metal foil-clad laminates used for each oak nest are made by layering the required number of sheets of prepreg that has been impregnated with a thermosetting resin varnish such as phenolic resin or epoxy resin and dried on a substrate such as paper or cloth. It is obtained by laminating and molding metal foils, but resin varnish uses a large amount of organic solvent, resulting in poor production and environmental degradation, the risk of ignition and explosion, and the need for a large amount of thermal energy in the drying process. etc. were a problem.
本発明は上記欠点を解決するもので、熱硬化性樹脂に硬
化剤、充填剤、安定剤、補ツ公剤、着色剤等の添加剤を
加え、混線一体化した未硬化シートと金属箔とを重ねて
加圧成形してなる金属箔張樹脂板のため無溶剤且つ乾燥
工程不要で安全、無公害、省エネルギーで金属箔張樹脂
板を得ることができたものである。The present invention solves the above-mentioned drawbacks by adding additives such as curing agents, fillers, stabilizers, supplementary agents, coloring agents, etc. to a thermosetting resin, and combining an uncured sheet and metal foil with cross-wire integration. Since the metal foil-clad resin plate is formed by stacking and press-forming the metal foil-clad resin plate, it is possible to obtain the metal foil-clad resin plate in a safe, pollution-free, and energy-saving manner without the need for a solvent or drying process.
以下本発明の詳細な説明する０本発明に用いる熱硬化性
樹脂は、フェノール樹脂、メラミン樹脂、アクリル樹脂
、不飽和ポリエステル樹脂、フラン樹脂、エポキシ樹脂
、シリコン樹脂、ポリイ叱ド、ポリアミドイミド等で、
各樹脂に進合する硬化剤、充填剤、安定剤、補ｌ叡剤、
着色剤、増粘剤、カップリング剤、界面活性剤、離裂剤
等の添加剤を加え、ニーダ−１押出機、ロール等の過当
な混合機で混線一体化した未硬化シートと銅、アルミニ
ウム、＾鋳、ニッケル、ステンレス鋼、鉄等の金属箔ｅ
４：重ねてプレス、ローラー、スチールベルト等で加圧
成形して金属ｗ１？ｊｌ＆積層板を得るものである。未
硬化シートと金属箔の組合せは未硬化シート１枚に対し
その上面又は必要に応じて上、下面に金属箔を重ねるこ
とが望ましいが、未硬化シー トを複数枚重ねてもよい
。又、金属箔の未硬化シート対向側には予じめ接着剤層
を設けてお（ことによって史に金属箔の接着派度を向上
せしめることもできるものである。The present invention will be described in detail below.The thermosetting resin used in the present invention may be phenol resin, melamine resin, acrylic resin, unsaturated polyester resin, furan resin, epoxy resin, silicone resin, polyimide, polyamideimide, etc. ,
Curing agents, fillers, stabilizers, and auxiliary agents that are added to each resin,
Additives such as colorants, thickeners, coupling agents, surfactants, and release agents are added to the uncured sheet, copper, and aluminum, which are mixed and integrated using a suitable mixer such as a kneader-1 extruder and rolls. ,^ Metal foils such as cast, nickel, stainless steel, iron, etc.
4: Overlap and pressurize with a press, roller, steel belt, etc. to form metal w1? jl & laminate is obtained. As for the combination of an uncured sheet and metal foil, it is preferable to overlap one uncured sheet with metal foil on its upper surface or on the upper or lower surface as necessary, but it is also possible to stack a plurality of uncured sheets. Furthermore, an adhesive layer may be provided in advance on the side of the metal foil facing the uncured sheet (thereby, the adhesion of the metal foil can be improved).
以下本発明を実施例にもとずいて説明する。The present invention will be explained below based on examples.
実施例
ノボラック型フェノール樹９１００重量部（以下単に部
と記す）に対しヘキサメチレンテトラミンシ部、ガラス
チップ４０部、炭酸カルシウムＷ部、木加部、ステアリ
ン酸亜鉛１ｓ、酸化亜鉛１部、着色剤０．５部を加えニ
ーダ−で恥分関混線してから２本ロールで混線、シート
化して厚さ１．６■（７） 未硬化フェノール樹脂シー
トを得、該シートの上面に接着剤層付厚さ０．０！５５
箇〇銅箔を接着剤層側をシート側に対向して重ねてから
金属プレートに挾み成形圧力１００驚、１６０℃で加分
間加圧成形して厚さ１．６■の銅張樹脂板を得た。Example: 9100 parts by weight of novolak type phenol tree (hereinafter simply referred to as parts), part hexamethylenetetramine, 40 parts glass chips, part W calcium carbonate, part wood, 1 s of zinc stearate, 1 part of zinc oxide, coloring agent. Add 0.5 part of phenolic resin and mix with a kneader, then mix with two rolls to form a sheet with a thickness of 1.6 cm (7), and apply an adhesive layer on the top surface of the sheet. Thickness 0.0!55
Copper foils are stacked with the adhesive layer side facing the sheet side, and then sandwiched between metal plates and press-formed at 160 degrees Celsius under a pressure of 100 degrees to form a copper-clad resin board with a thickness of 1.6 cm. I got it.
比較例
樹脂量５０重量哄のフェノール樹脂ワニスを厚さ０．２
５ｍ５のクラフト紙に含浸、乾燥した樹脂量５０重量−
のプリプレグ８枚を重ねた上に実施例と同じ銅箔を重ね
た積層体を金属プレートに挾み成形圧力１００驚、１６
０℃で６０分間積層成形して厚さ１．６■の鋼張積層板
を得た。Comparative Example: A phenolic resin varnish with a resin amount of 50 parts by weight and a thickness of 0.2
50 weight of resin impregnated and dried on 5 m5 of kraft paper -
A laminate consisting of 8 sheets of prepreg stacked on top of which the same copper foil as in the example was stacked was sandwiched between metal plates, and the molding pressure was 100 mm and 16 mm.
Lamination molding was carried out at 0° C. for 60 minutes to obtain a steel clad laminate having a thickness of 1.6 cm.
実施例と比較例の銅張樹脂板及び銅張積層板は各れも電
気部品として用いることができるが、本発明の銅張樹脂
板はその製造工程番ζおいて無溶剤且つ乾燥工程が不要
のため、作業環境の悪化、引火爆発の危険性がなく、省
エネルギーで生産することができ本発明の金属箔張樹脂
板の優れていることを確認した。The copper-clad resin boards and copper-clad laminates of Examples and Comparative Examples can each be used as electrical components, but the copper-clad resin board of the present invention is solvent-free and does not require a drying process in its manufacturing process number ζ. Therefore, it was confirmed that the metal foil-clad resin board of the present invention is superior because it can be produced with energy savings without deteriorating the working environment or the risk of ignition and explosion.
特許出願人 松下電工林式会社 代理人弁理士 竹 元 敏 丸 （ほか２名）patent applicant Matsushita Electric Forest Company Representative Patent Attorney Toshimaru Takemoto (2 others)
Claims (1)
剤等の添加剤を加え、混線一体化した未硬化シートと金
属箔とを重ねて加圧成形してなることを特徴とする金属
箔張樹脂板の製造方法。It is characterized by adding additives such as curing agent, filler, stabilizer, certifying agent, coloring agent, etc. to thermosetting resin, and pressing and forming an uncured sheet with integrated cross-wire and metal foil overlapping. A method for manufacturing a metal foil-clad resin board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP126482A JPS58118242A (en) | 1982-01-06 | 1982-01-06 | Manufacture of metallic foil lined resin board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP126482A JPS58118242A (en) | 1982-01-06 | 1982-01-06 | Manufacture of metallic foil lined resin board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58118242A true JPS58118242A (en) | 1983-07-14 |
Family
ID=11496590
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP126482A Pending JPS58118242A (en) | 1982-01-06 | 1982-01-06 | Manufacture of metallic foil lined resin board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58118242A (en) |
-
1982
- 1982-01-06 JP JP126482A patent/JPS58118242A/en active Pending
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