JPS58118124A - Wafer loading method - Google Patents
Wafer loading methodInfo
- Publication number
- JPS58118124A JPS58118124A JP27982A JP27982A JPS58118124A JP S58118124 A JPS58118124 A JP S58118124A JP 27982 A JP27982 A JP 27982A JP 27982 A JP27982 A JP 27982A JP S58118124 A JPS58118124 A JP S58118124A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- ring
- wafers
- seat
- sub
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は、ウェーハローディング法に係・ハ特に、エツ
チング装WIISOVD装置等の半導体製造装Wの処理
室で処理されるウェーハの均一化リング内への搬入並び
に均一化リング外への搬出及び所定の場所への搬送に好
適なウェーハローディング法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a wafer loading method, and in particular, to a method for loading a wafer into a uniformizing ring to be processed in a processing chamber of a semiconductor manufacturing system W such as an etching system WIISOVD system, and for loading a wafer into a uniformizing ring. The present invention relates to a wafer loading method suitable for transporting outside and transporting to a predetermined location.
従来、半導体製造装置の処理室に具設された副部
真空室に外gより供給されたウェーハは、メカニカルチ
ャック、真空チャック等のチャック爪(以下、爪と略)
で直接掴み保持されて副真空室から処理室へ搬送され、
処理室に搬送されてきたウェーハは処理室に内股された
、ウェーハの処理を均一化する均一化リング内暑こ、爪
で掴まれて搬入される。処理室でのウェーハの処理完了
後は、再び爪でウェーハが掴まれて均一化リング外へ搬
出された後に、この状態のまま処理室から副真空室へ再
び搬送される。副真空室に搬送されてきたウェーハは、
別手段により外部へ収納される。Conventionally, wafers supplied from the outside to a sub-vacuum chamber installed in a processing chamber of a semiconductor manufacturing device are chucked using chuck jaws (hereinafter abbreviated as jaws) of a mechanical chuck, a vacuum chuck, etc.
is directly grasped and held and transported from the sub-vacuum chamber to the processing chamber.
The wafers transported to the processing chamber are held inside the equalizing ring, which equalizes the processing of the wafers, and are gripped by claws. After the wafer has been processed in the processing chamber, the wafer is gripped again by the claws and carried out of the equalization ring, and then transported in this state from the processing chamber to the sub-vacuum chamber again. The wafer transferred to the sub-vacuum chamber is
It is stored externally by other means.
このようなウェーハローディング法では、次のような欠
点があった。This wafer loading method has the following drawbacks.
(1) 均一化リングに爪の案内溝を設ける必要があ
るが、案内溝の幅がlsm以上では、ウェーハ処理時に
電界が案内溝に集中し案内溝近辺のつ。(1) It is necessary to provide a guide groove for the pawl on the equalization ring, but if the width of the guide groove is more than lsm, the electric field will concentrate on the guide groove during wafer processing, causing damage to the area near the guide groove.
−ハ処理が良好に行えないため、つ、−ハ処理が不均一
となり、又、案内溝の幅が】謔以下では、ウェーハ処理
の不均一は防止できるが、しかし、爪の案内溝への動作
をスムーズ化するには爪並びに均一化リングの位置制御
を高精度6二行う必要があり、従って、均一化リング内
へのウェーへの搬入並びに均一化リング外への搬出操作
が難しくなる。- Wafer processing cannot be performed well, resulting in non-uniform wafer processing.Also, if the width of the guide groove is less than 100%, uneven wafer processing can be prevented; In order to make the operation smooth, it is necessary to control the positions of the claws and the equalizing ring with high precision, which makes it difficult to carry the wafer into the equalizing ring and to take it out of the equalizing ring.
(2) ウェーハを直接爪で掴むため、爪の掴みカー
こより搬送中のウェーハが損傷する危険性がある。(2) Since the wafer is directly gripped by the claws, there is a risk that the wafers being transported may be damaged by the grip of the claws.
本発明は、上記欠点の除去を目的としたもので、ウェー
ハの処理を均一化する均一化リング内へのウェーハの搬
入並びに均一化リング外への搬出を。The present invention is aimed at eliminating the above-mentioned drawbacks, and includes a method for carrying wafers into a uniforming ring that uniformizes wafer processing, and for transporting wafers out of the uniforming ring.
ウェーハのすくい上げ並びに昇降により行うと共に、ウ
ェーハが搬入された均一化リングを、均一化リングに搬
入されたウエーノ)を処理する半導体製造装置の処理室
と該処理室に集設された副真空室との間で搬送すること
を特徴とし、つ、−71の処理が均一化でき、かつ、均
一化リング内へのウェーハの搬入並びに搬出操作を容易
化できる共−二、搬送中のつ、−ハの損傷が防止できる
ウェー7)ローディング法を提供するものである。A processing chamber of semiconductor manufacturing equipment that processes wafers by scooping up and raising and lowering them, and also processes wafers carried into the equalization ring (wafers carried into the equalization ring) and a sub-vacuum chamber assembled in the processing chamber. The wafers are transported between the wafers and the wafers during transport, and can uniformize the processing of the wafers. 7) A loading method that can prevent damage to the wafer.
本発明の一実施例を第1図、42図により説明する。An embodiment of the present invention will be described with reference to FIGS. 1 and 42.
第1図は、本発明を実施したウェーハローディングti
wの構成図で、半導体製造装置の処理室IOに集設され
た副真空室加には、先端部に爪4を有し部分的に回動す
るアームnと、つ、−ハ押上げ座23mを昇降可能に内
設し、かつ、上端面に均一化リング(資)を載置する均
一化リング座冴と、外部から副真空室加ヘウェーハ40
を供給するベルト5並びに副真空室加から外部ヘウ、−
ハ40を収納するベルト加のそれぞれの一端に設けられ
た昇降可能なウェーハ押上げ座23b、23cと、つ、
−ハ胛上げ座23bからウェーハ40をすくい上げ、回
動することで均一化リング座冴のウェーハ押上げ座幻麿
へ搬送し、又、均一化リング座スのウェーハ押上げ座2
3mからウェーハ40をすくい上げ、回動することでウ
ェーハ押上げ座23cへ搬送するフォークnとで構成さ
れたウェーハローディング!IWが内設されている。尚
、均一化リング座冴、ウェーハ押上げ塵23 mの中心
は、アームηの爪ガの中心点の回動軌跡上に、又、均一
化リング座、ウェーハ押上げ座23a〜Z(cの中心は
、フォーク谷のすくい上げ部分の中心点の回動軌跡上に
それぞれ位置するようになっている。FIG. 1 shows a wafer loading process according to the present invention.
In the configuration diagram of w, the sub-vacuum chamber assembled in the processing chamber IO of the semiconductor manufacturing equipment includes an arm n which has a claw 4 at its tip and partially rotates, and a push-up seat. A homogenizing ring holder, which has a height of 23 m that can be raised and lowered internally and has a homogenizing ring (material) placed on its upper end surface, and a wafer 40 that is connected to a sub-vacuum chamber from the outside.
from the belt 5 that supplies and the sub-vacuum chamber to the external
Wafer pushing seats 23b and 23c that can be raised and lowered are provided at one end of each of the belt supports for storing the wafer 40;
- The wafer 40 is scooped up from the lifting seat 23b and transferred to the wafer pushing seat 2 of the equalizing ring seat by rotating, and the wafer 40 is transferred to the wafer pushing seat 2 of the equalizing ring seat.
Wafer loading consists of a fork n that scoops up the wafer 40 from 3 m and rotates to transport it to the wafer push-up seat 23c! IW is installed internally. The center of the equalizing ring seat and the wafer pushing dust 23m is on the rotation locus of the center point of the pawl of the arm η, and the center of the equalizing ring seat and the wafer pushing seat 23a to Z (c) The centers are located on the rotation locus of the center point of the scooped-up portion of the fork valley.
外部から副真空室加へベルト5により供給されてきたウ
ェーハ40はウェーハ押上げ座23b4こ至り。The wafer 40 supplied from the outside to the sub-vacuum chamber by the belt 5 reaches the wafer push-up seat 23b4.
その後、ウェーハ荀はウェーハ押上げ座23bにより押
上げられフォーク4が第1図のA点からB点Iで回動し
ウェーハ押上げ座23bが下降することでフォークηに
すくい上げられる。ウェーハ40をすくい上げたフォー
クnは、更にB点からC点!で回動し、ウェーハ押上げ
座23mがウェーハ40をる。次に、ウェーハ押上げ座
23mが下降することで、第2図に示すように均一化リ
ング(資)内につ。Thereafter, the wafer hoist is pushed up by the wafer push-up seat 23b, the fork 4 rotates from point A to point B I in FIG. 1, and the wafer push-up seat 23b is lowered to be scooped up by the fork η. Fork n, which scooped up wafer 40, moves from point B to point C! The wafer push-up seat 23m lifts the wafer 40. Next, the wafer push-up seat 23m is lowered, so that the wafer is placed in the equalization ring as shown in FIG.
−八40が搬入される。ウェーハ40が搬入された均一
化リング(資)は、第2図に示すように爪♂で掴まれア
ームηの回動により副真空室圓から処理室10へ搬送さ
れる。処理室lOでのウェーハ荀の処理が完了すれば、
均一化リング(資)は爪乙に掴まれアームρの回動によ
り処理室10から副真空室Iへ搬送され、第2図に示す
ように均一化リング座ηの上端面に載置され、アームn
は更に回動し再び元の位置に戻る。その後、つ、−ハ押
上げ座23mを上E点から0点へ回動しウェーハ押上げ
座23mを再び下降することでフォークかにすくい上げ
られる。-840 is brought in. As shown in FIG. 2, the equalization ring (material) into which the wafer 40 has been carried is held by the claw ♂ and transported from the sub-vacuum chamber to the processing chamber 10 by the rotation of the arm η. Once the processing of the wafer in the processing chamber IO is completed,
The equalizing ring (material) is gripped by the claw O and transported from the processing chamber 10 to the sub-vacuum chamber I by the rotation of the arm ρ, and is placed on the upper end surface of the equalizing ring seat η as shown in FIG. arm n
rotates further and returns to its original position. Thereafter, the wafer pushing seat 23m is rotated from the upper point E to the 0 point, and the wafer pushing seat 23m is lowered again, so that the wafer is scooped up by the fork.
次に、つ、−ハ40をすくい上げたフォークかを0点か
らD点まで回動させウェーハ押上げ塵230を上昇させ
ることでウェーハ40はつ、−ハ押上げ座230に受取
られ、ウェーハ40を取除かれたフォークnは更に回動
しD点からE点に再び戻る。その後、ウェーハ押上げ座
Z3cを下降することでつ。Next, the fork that scooped up the wafer 40 is rotated from point 0 to point D to lift up the wafer and lift the dust 230, so that the wafer 40 is received by the wafer 40 and lifted up by the wafer 40. The removed fork n rotates further and returns from point D to point E again. After that, the wafer push-up seat Z3c is lowered.
−ハ40はベルト%に載置され、ベルトかにより副真空
室加から外部へ収納される。- The 40 is placed on the belt and is stored outside from the sub-vacuum chamber by the belt.
本実施例のようなつ、−ハローディング法では、フォー
クのすくい上げ並びにウェーハ押上げ塵の昇降によりウ
ェーハを均一化リング内へ搬入並びに均一化リング外へ
搬出できるので、均一化リングに爪の案内溝を設ける必
要がなく、又、ウェーハをフォークですくい上げ搬送で
きると共に、均一化リング内に搬入された状態で処理室
と副真空室との間を搬送できるので、ウェーハを爪で直
接掴むことなく所定の場所へ搬送することができる。In the halo loading method as in this embodiment, the wafer can be carried into and out of the equalizing ring by scooping up the fork and lifting the wafer and lifting the dust, so the equalizing ring has a guide groove for the pawl. In addition, the wafer can be scooped up and transported with a fork, and the wafer can be transported between the processing chamber and the sub-vacuum chamber while being carried into the equalization ring, so the wafer can be moved to a specified position without having to directly grasp it with claws. can be transported to the location.
本発明は、以上説明したように、つ、−ハの均一化リン
グ内への搬入並びに均一化リング外への搬出を、ウェー
ハのす(い上げ並びに昇降により行うと共に、ウェーハ
が搬入された均一化リングを、処理室と副真空室との間
で搬送するということで、均一化リングに爪の案内溝を
設ける必要がないので、ウェーハ処理が均一化でき、か
つ、均一化リング内へのウェーハの搬入並びに均一化リ
ング外への搬出操作を容易化できると共に、ウェーハを
爪で直接掴むことなく所定の場所へ搬送することができ
るので、搬送中のウェーハの損傷を防止できる効果があ
る。As explained above, the present invention carries the wafer into the equalizing ring and takes it out of the equalizing ring by raising and lowering the wafer, and the wafer is uniformly Since the equalizing ring is transported between the processing chamber and the sub-vacuum chamber, there is no need to provide guide grooves for the claws on the equalizing ring, so wafer processing can be made uniform and there is no need to provide a guide groove for the claws in the equalizing ring. This makes it easier to carry the wafer in and take it out of the equalization ring, and it also allows the wafer to be transported to a predetermined location without having to directly grip it with claws, which has the effect of preventing damage to the wafer during transport.
第1図、第2図は、本発明の一実施例を説明するもので
、第1図は1本発明を実施したウェー/10−ディング
装置の構成図、!J2図は、第1図のイーイ視断面図で
ある。
lO・・・・・・処理室、20・・・・・・副真空室、
4・・・・・・爪、n・・・・・・アーム、23aから
23c・・・・・・つ、 −7%押上げ座、必・・・・
・・均一化リング座、n・・・・・・フォーク、(9)
・・・・・・均一化リング、40・・・・・・つ、−ハ
代理人 弁理士 薄 1)利 幸
崖1図
]
」
供給 収納
zQJ
゛23a1 and 2 illustrate one embodiment of the present invention, and FIG. 1 is a block diagram of a wading/10-ding device in which the present invention is implemented. Figure J2 is a cross-sectional view from E in Figure 1. lO...Processing chamber, 20...Sub-vacuum chamber,
4...Claw, n...Arm, 23a to 23c...2, -7% push-up seat, required...
... Equalizing ring seat, n...Fork, (9)
... Equalization ring, 40...tsu, -ha agent patent attorney Usui 1) Li Kougai 1] Supply Storage zQJ ゛23a
Claims (1)
ェーハの般式並びに均一化リング外への搬出及び該均一
化リングに搬入された前記ウェーハを処理する半導体製
造装置の処理室と該処理室に^設された副真空室との間
で前記ウェーハを搬送するウェーハローディング法にお
いて。 前記ウェーハの前記均一化リング内への搬入並びに均一
化リング外への搬出を、ウェー/1のすくい上げ並びに
昇降により行うと共に、ウェーハが搬入された均一化リ
ングを、前記処理室と前記副真空室との間で搬送するこ
とを特徴とするウェーハローディング法。[Scope of Claims] 1 General formula for wafers into an equalization ring that uniformizes wafer processing, transport out of the equalization ring, and semiconductor manufacturing equipment that processes the wafers carried into the equalization ring. In a wafer loading method in which the wafer is transferred between a processing chamber and a sub-vacuum chamber provided in the processing chamber. The wafer is carried into the equalization ring and taken out of the equalization ring by scooping up and raising/lowering wafer/1, and the equalization ring into which the wafer has been carried is transferred to the processing chamber and the sub-vacuum chamber. A wafer loading method characterized by transporting between.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27982A JPS58118124A (en) | 1982-01-06 | 1982-01-06 | Wafer loading method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27982A JPS58118124A (en) | 1982-01-06 | 1982-01-06 | Wafer loading method |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS58118124A true JPS58118124A (en) | 1983-07-14 |
Family
ID=11469460
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP27982A Pending JPS58118124A (en) | 1982-01-06 | 1982-01-06 | Wafer loading method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58118124A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61131542A (en) * | 1984-11-30 | 1986-06-19 | Nippon Sanso Kk | Wafer transfering device |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5457867A (en) * | 1977-10-17 | 1979-05-10 | Nichiden Varian Kk | Vacuum processor with automatic wafer feeder |
JPS564244A (en) * | 1979-06-25 | 1981-01-17 | Hitachi Ltd | Continuous vacuum treatment device for wafer |
-
1982
- 1982-01-06 JP JP27982A patent/JPS58118124A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5457867A (en) * | 1977-10-17 | 1979-05-10 | Nichiden Varian Kk | Vacuum processor with automatic wafer feeder |
JPS564244A (en) * | 1979-06-25 | 1981-01-17 | Hitachi Ltd | Continuous vacuum treatment device for wafer |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61131542A (en) * | 1984-11-30 | 1986-06-19 | Nippon Sanso Kk | Wafer transfering device |
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