JP4647646B2 - Liquid processing apparatus and liquid processing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a liquid processing device which can enhance productivity by preventing return of unprocessed wafers and performing liquid processing for every lot. <P>SOLUTION: The liquid processing device comprises a carrier carry-in/out part 5 for carrying in/out carriers C in which a substrate W is stored, a carrier stock part 6 which can store a plurality of carriers C, a carrier conveying device 12 which conveys the carrier C, a substrate conveying part 3 which conveys the substrate W between an inspection/carry-in/out stage 15 and a processing part 7, a substrate inspection device 18 for inspecting the substrates W in the carriers C, and a controlling part 90. The controlling part 90 controls the device so that a carrier among a plurality of carriers C processed in a lump is conveyed to the substrate inspection device 18 and if it can be liquid-processed, it is returned to the carrier stock part 6, and if another carrier conveyed to the substrate inspection device 18 can be liquid-processed, a plurality of substrates W in these carriers are carried out of the inspection/carry-in/out stage 15. <P>COPYRIGHT: (C)2008,JPO&amp;INPIT

Description

  The present invention relates to a liquid processing apparatus and a liquid processing method for performing predetermined liquid processing on a substrate such as a semiconductor wafer, for example.

  In a semiconductor device manufacturing process, a semiconductor wafer (wafer) is processed with a processing solution such as a predetermined chemical solution or pure water to remove contamination such as particles, organic contaminants, and metal impurities from the wafer, or to perform etching. A liquid processing apparatus is used.

  Here, in recent years, with the fine integration and mass production of semiconductor devices, the wafer size is increasing from 200 mmφ (8 inches) to 300 mmφ (12 inches). As the weight of the carrier increases, the carrier (container) for storing the wafer becomes larger and its weight increases. For this reason, for example, storage and transfer of 300 mmφ wafers are handled using a carrier in which 25 wafers are stored horizontally at a predetermined interval. On the other hand, regarding the liquid processing of wafers, it is preferable to process as many wafers as possible at the same time in order to increase production efficiency. For example, a method of processing 50 wafers at a time is employed.

In order to liquid-treat 50 wafers of 300 mmφ, it is necessary to transport the wafers contained in two carriers into the liquid processing apparatus. The 25 wafers stored horizontally are unloaded using the wafer loading / unloading device, transferred to the attitude changing device in the liquid processing apparatus, and then the 25 wafers stored in another carrier are similarly loaded / unloaded. The device is transferred to the posture changing device, and the posture changing device collectively changes the posture of the 50 wafers from the horizontal state to the vertical state, and the 50 wafers held in the vertical state are transferred. There is a method in which the wafer is transferred to a wafer transfer device and transferred to a liquid processing unit, and the liquid processing unit performs predetermined liquid processing or drying processing on the wafer. Note that the wafers that have been subjected to the liquid processing are returned to each of two empty carriers by going through a procedure reverse to the procedure for carrying the wafer into the liquid processing section.
JP 11-290799 A CD-ROM of actual application No. 05-059288 (No. 07-030207) Japanese Patent Laid-Open No. 06-267919 Japanese Patent Laid-Open No. 09-181032

  However, when liquid processing was performed with two carriers as one lot, the wafers stored in the first carrier were transferred to the posture changing device without any problem, but a predetermined number of wafers were stored in the second carrier. If the wafer is not stored, the wafer transferred to the posture changing device is not subjected to liquid processing, but the wafer is returned to the carrier again from the posture changing device and processing is started for another lot. There has been a problem in that the situation that must be done occurs and the liquid processing time is lost.

  In addition, when the wafer is carried into and out of the carrier at one place, for example, after the empty carrier after the wafer is taken out is moved to a predetermined place, another carrier containing the wafer is moved to the wafer. There is a problem that the throughput is lowered because the carrier needs to be transported to the carry-in / out position and a predetermined time is required for transporting the carrier.

  Further, when the wafer is unloaded using a wafer loading / unloading device from the carrier in which the wafer is stored in a substantially horizontal state and transferred to the posture changing device, and further transferred to the wafer transfer device and transferred to the liquid processing unit, and When the wafer W is transferred in the opposite direction, the number of required mechanisms is increased, the layout area is increased, and the footprint of the apparatus is increased.

  The present invention has been made in view of such circumstances, and prevents the occurrence of an unprocessed wafer return operation and enables liquid processing for each lot to increase production efficiency. It is a first object to provide an apparatus and a liquid processing method.

  Another object of the present invention is to provide a liquid processing apparatus capable of improving throughput by efficiently transporting a carrier.

  Still another object of the present invention is to provide a liquid processing apparatus having a reduced footprint.

In order to achieve the first object, a liquid processing apparatus according to the first aspect of the present invention includes a processing unit that collectively performs a predetermined liquid processing on a plurality of substrates of a plurality of carriers, and the plurality of substrates. A carrier loading / unloading section for loading / unloading a stored carrier, a carrier stock section capable of storing a plurality of the carriers, and loading / unloading the carrier with respect to the carrier loading / unloading section. A carrier transport device that transports the substrate, an inspection / carry-in / out stage provided in the carrier stock unit, and a substrate carried into / out of the carrier transported to the inspection / carry-in / out stage, Board inspection for inspecting the number and / or storage state of the substrates in the carrier, which are conveyed to the inspection / carry-in / out stage. And one of the plurality of carriers to be collectively processed is transported to the substrate inspection apparatus, and if the result of the inspection is liquid processing, the one carrier is returned to the carrier stock unit, Among the plurality of carriers to be processed in a batch, the other carrier is transported to the substrate inspection apparatus. As a result of the inspection, if liquid processing is possible, the one carrier and the plurality of substrates in the other carrier are Another carrier to be processed in combination with the carrier determined to stop the liquid processing of the stored substrate is stored in the carrier stock section while being controlled so as to be unloaded from the inspection / loading / unloading stage. A control unit that controls the carrier transport device to return the another carrier to the carrier loading / unloading unit .

In order to achieve the first object, a liquid processing apparatus according to a second aspect of the present invention includes a processing unit that collectively performs a predetermined liquid processing on a plurality of substrates of a plurality of carriers, and the plurality of substrates. A carrier loading / unloading section for loading / unloading a stored carrier, a carrier stock section capable of storing a plurality of the carriers, and loading / unloading the carrier with respect to the carrier loading / unloading section. A carrier transport device that transports the substrate, an inspection / carry-in / out stage provided in the carrier stock unit, and a substrate carried into / out of the carrier transported to the inspection / carry-in / out stage, Board inspection for inspecting the number and / or storage state of the substrates in the carrier, which are conveyed to the inspection / carry-in / out stage. And if one of the plurality of carriers processed in batch is transported to the substrate inspection apparatus and liquid processing is impossible as a result of the inspection, the plurality of carriers processed in the batch If the processing on the substrate is stopped and liquid processing is possible, the one carrier is returned to the carrier stock unit, and the other carrier among the plurality of carriers to be processed at a time is transported to the substrate inspection apparatus. If the liquid processing is impossible as a result of the inspection, the processing for the substrates in the plurality of carriers to be collectively processed is stopped including the one carrier returned to the carrier stock unit, and the liquid processing is possible. if, determines a plurality of substrates in said one carrier and the other carrier, and controls so as to discharge from the test / unloading stage, and should be discontinued liquid processing housed substrate When the carrier and set since it another carrier to be processed which is already in the carrier stock section, for controlling the carrier transport system to return said further carrier to the carrier transfer portion And a control unit.

In order to achieve the first object, the liquid processing method according to the third aspect of the present invention is applied to a substrate in two carriers of a first carrier and a second carrier in which a plurality of substrates are housed. In the liquid processing method for performing the liquid processing, it is determined that the liquid processing can be performed by the first step of inspecting the number and / or storage state of the substrates in the first carrier and the inspection of the first step. In this case, the first carrier is stored in a carrier stock unit. On the other hand, when it is determined that the liquid processing should be stopped in the inspection in the first step, the liquid processing of the substrates in the two carriers is performed. A second step to be stopped, a third step of inspecting the number of substrates and / or a storage state of the second carrier when the first carrier is stored in the carrier stock section, and the third step. Liquid processing is possible by inspection at In the case of being cut off, the substrate in the second carrier is transported to the liquid processing unit, and then the substrate in the first carrier is transported to the liquid processing unit, or in the inspection in the third step. When it is determined that the liquid processing should be stopped, the fourth step of performing any one of the steps of stopping the liquid processing of the substrates in the two carriers and the liquid processing of the accommodated substrate should be stopped. And a fifth step of returning the other carrier to the carrier loading / unloading unit when another carrier to be processed in combination with the carrier determined to have been stored in the carrier stock unit. .

In order to achieve the first object, a liquid processing method according to a fourth aspect of the present invention is a liquid processing method for performing a predetermined liquid processing on a substrate, and a substrate in a carrier in which a plurality of substrates are stored. In the first step for inspecting the number and / or storage state, and in the inspection in the first step, the carrier that is determined to be capable of liquid processing is stored in the carrier stock section, and the carrier that is determined to stop liquid processing For the second step for stopping the liquid treatment, the third step for performing the first step and the second step on a predetermined number of carriers, and the carrier for which the liquid treatment is determined to be stopped by the inspection in the first step. A fourth step of unloading the other carrier from the carrier stock portion when another carrier to be processed in combination with the carrier stock portion is already stored in the carrier stock portion; Step 5 and, taken carriers and set determines to stop the liquid processing of the accommodated substrates that stored carriers to click section starts the liquid processing of the substrate for the carrier after a predetermined number And a sixth step of returning the other carrier to the carrier loading / unloading section when another carrier to be processed is already stored in the carrier stock section .

  According to the present invention, it is possible to provide a liquid processing apparatus and a liquid processing method capable of preventing a situation in which an unprocessed wafer is returned and performing liquid processing for each lot to increase production efficiency.

  In addition, according to the present invention, it is possible to provide a liquid processing apparatus capable of improving throughput by efficiently transporting carriers.

  Furthermore, according to the present invention, a liquid processing apparatus having a reduced footprint can be provided.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In this embodiment, a case will be described in which the present invention is applied to a liquid processing apparatus configured to perform batch loading of semiconductor wafers (wafers), liquid processing, drying, and unloading.

  FIG. 1 is a perspective view showing an embodiment of the liquid processing apparatus of the present invention, and FIG. 2 is a plan view thereof. As shown in FIGS. 1 and 2, the liquid processing apparatus 1 uses a predetermined chemical solution for the wafer W and a load / unload unit 2 that loads and unloads and stores the carrier C in which the wafer W is stored in a horizontal state. The liquid processing unit 4 that performs liquid processing and performs drying processing, and the interface unit 3 that transports the wafer W between the loading / unloading unit 2 and the liquid processing unit 4 are mainly configured.

  The loading / unloading unit 2 can store a predetermined number of, for example, 25 wafers W substantially horizontally at predetermined intervals, and one side surface of the loading / unloading unit 2 serves as a loading / unloading port for the wafer W. The loading / unloading port is opened and closed by a lid. A predetermined number of carrier loading / unloading portions 5 on which a stage 11 for placing a carrier C having a structure that can be formed and a carrier holding member 13 for holding the carrier C are disposed. It consists of a carrier stock section 6 that can be stored. The carrier C storing the wafer W before liquid processing placed on the stage 11 is carried into the carrier stock unit 6 by the carrier transfer device 12, while the carrier C storing the wafer W after liquid processing is stored. Then, it is carried out from the carrier stock unit 6 to the stage 11 using the carrier conveying device 12.

  A shutter 14 is provided between the carrier loading / unloading unit 5 and the carrier stock unit 6, and the shutter 14 is opened when the carrier C is transferred between the carrier loading / unloading unit 5 and the carrier stock unit 6. In other cases, the shutter 14 is closed in order to separate the atmosphere between the carrier carry-in / out unit 5 and the carrier stock unit 6.

  The carrier transport device 12 includes, for example, an arm 12a such as an articulated arm or a telescopic arm that is driven so that at least the carrier C can be moved in the X direction. To carry the carrier C. Further, the carrier transport device 12 can be driven in the Y direction and the Z direction (height direction) by a Y-axis drive mechanism and a Z-axis drive mechanism (not shown), whereby the carrier disposed at a predetermined position. The carrier C can be placed on the holding member 13.

  In FIG. 2, four carrier holding members 13 are provided in the vicinity of the wall surface forming the carrier stock portion 6 (one of which is an upper portion of the inspection / loading / unloading stage 15 described later). Are provided in a plurality of stages, for example, in four stages. The carrier stock unit 6 serves to temporarily store the carrier C in which the wafer W before liquid processing is stored, and to store the carrier C in which the inside from which the wafer W has been taken out is empty.

  A window portion 16 is formed at the boundary between the carrier stock portion 6 and the interface portion 3, and the carrier of the carrier C faces the window portion 16 on the carrier stock portion 6 side of the window portion 16. An inspection / carry-in / out stage 15 having the same structure as the carrier holding member 13 is disposed so that C can be placed. Note that the carrier conveyance device 12 may hold the carrier C for a predetermined time in a predetermined space facing the window portion 16 without providing the inspection / carry-in / out stage 15.

  A lid opening / closing mechanism 17 for opening / closing the lid of the carrier C placed on the inspection / carrying in / out stage 15 is provided on the carrier stock 6 side of the window 16. By opening the cover of C, the wafer W in the carrier C can be carried out to the interface unit 3 side. Conversely, the wafer is transferred from the interface unit 3 side to the empty carrier C. It is also possible to carry W in. The lid opening / closing mechanism 17 may be provided on the interface section 3 side of the window section 16.

  A wafer inspection apparatus 18 for measuring the number of wafers W in the carrier C is disposed on the interface section 3 side of the window section 16. For example, the wafer inspection apparatus 18 scans an infrared sensor head having a transmission unit and a reception unit in the Z direction in the vicinity of the X-direction end of the wafer W accommodated in the carrier C, and between the transmission unit and the reception unit. The number of wafers W is inspected by detecting a signal of infrared transmitted light or reflected light. Here, as the wafer inspection apparatus 18, in parallel with the inspection of the number of wafers W, whether or not the wafers W are accommodated, for example, whether the wafers W are arranged in parallel at a predetermined pitch in the carrier C. It is preferable to use a wafer having a function of detecting whether or not the wafer W is not stored obliquely with a step difference. Further, after confirming the storage state of the wafer W, the number of wafers W may be detected using the sensor.

  Note that a wafer inspection apparatus that inspects only the number of wafers W is used when, for example, almost no deviation in the level of the wafer W in the carrier C occurs from experience, and only the stored state of the wafers W is used. The wafer inspection apparatus for inspecting the above can be used, for example, when the number of stored wafers W is excessive or insufficient and is generated only a very small number of times based on experience.

  The operations of the carrier transfer device 12 and the wafer inspection device 18 are controlled by the carrier transfer device control unit 90. For example, the carrier transport device control unit 90 controls the carrier transport device 12 so that the carrier C is stored in the carrier stock unit 6 after the wafer inspection device 18 inspects the number of wafers W in the carrier C. The carrier transport device controller 90 controls the opening / closing of the shutter 14, the opening / closing of the window 16, and the operation of the lid opening / closing mechanism 17 in conjunction with the movement of the carrier transport device 12.

  The interface unit 3 is provided with a wafer carry-in / out device 19, a wafer transfer device 21, and a wafer transfer device 22, and the wafer transfer device 21 communicates the wafer W with the wafer carry-in / out device 19. It includes a posture changing mechanism 21a that transfers and changes the posture of the wafer W, and a wafer vertical holding mechanism 21b that transfers the wafer W between the posture changing mechanism 21a and the wafer transfer device 22.

  The wafer loading / unloading device 19 unloads the wafer W in the carrier C through the window 16 and delivers it to the posture changing mechanism 21a, and receives the wafer W after the liquid processing from the posture changing mechanism 21a and loads it into the carrier C. . The wafer carry-in / out device 19 has two arms, an arm 19a for carrying an unprocessed wafer W and an arm 19b for carrying a liquid-processed wafer W. The arms 19a and 19b are carrier C A predetermined number of wafers W are arranged in the Z direction at a predetermined interval so as to match the arrangement pitch of the wafers W in the carrier C so that the plurality of wafers W accommodated therein can be held collectively. In the state shown in FIG. 2, the arms 19a and 19b are movable (sliding) or extendable in the direction of arrow A, and can be moved up and down by a predetermined distance in the Z direction. Further, the entire wafer loading / unloading device 19 is configured to be rotatable in the θ direction, so that the arms 19a and 19b can be attached to either the carrier C mounted on the inspection / loading / unloading stage 15 or the posture changing mechanism 21a. Is also accessible.

  The driving mode of the wafer carry-in / out device 19 is, for example, as follows. First, in the state where the arm 19a is on the wafer transfer device 21 side and the arrow A direction coincides with the X direction, the arm 19a is moved (slid) or extended to be inserted below the wafer W, and the arm 19a is inserted. Is lifted by a predetermined distance to hold the wafer W on the arm 19a, and then the arm 19a is moved (slid) or contracted in the opposite direction, whereby the wafer W in the carrier C is unloaded. Next, the entire wafer loading / unloading device 19 is rotated 90 degrees (°) counterclockwise in FIG. 2 so that the arrow A direction coincides with the Y direction and the arm 19a is on the liquid processing unit 4 side. By moving (sliding) or extending / contracting 19a, the wafer W held on the arm 19a can be transferred to the posture changing mechanism 21a.

  On the other hand, with the arrow A direction coinciding with the Y direction and the arm 19b on the liquid processing unit 4 side, the arm 19b is moved (slid) or expanded / contracted to move the wafer W that has been subjected to the liquid processing from the posture changing mechanism 21a. After the removal, the entire wafer loading / unloading device 19 is rotated 90 ° clockwise in FIG. 2 so that the arrow A direction and the X direction coincide with each other, and the arm 19b is on the wafer transfer device 21 side. The wafer W held by the arm 19b can be carried into the empty carrier C by moving (sliding) or expanding / contracting 19b.

  The transfer of the wafer W using the wafer carry-in / out device 19 is performed with the wafer W in a substantially horizontal state. However, since the wafer W needs to be cleaned with the wafer W in a substantially vertical state, the posture changing mechanism 21a performs the wafer transfer. W posture conversion is performed. The posture changing mechanism 21a has, for example, a guide member in which a groove or the like for holding the wafer W is formed in accordance with the arrangement pitch of the wafer W in the wafer carry-in / out device 19, and a plurality of such guide members are provided. The plurality of wafers W are converted from a horizontal state to a vertical state by holding the wafer W and rotating it about 90 ° in a predetermined direction. The wafer W thus converted into the vertical state is once delivered to the wafer vertical holding mechanism 21b before being delivered to the wafer transfer device 22.

  The wafer vertical holding mechanism 21b has a structure in which grooves are formed so that the wafer W can be accommodated at an arrangement pitch that is half the wafer arrangement pitch in the carrier C (see FIG. 8 to be described later). A total of 50 wafers W stored in each carrier C can be stored. Thus, the wafers W accommodated in the two carriers C can be simultaneously subjected to liquid processing. The wafer vertical holding mechanism 21b is between a position where the wafer W can be transferred to and from the posture changing mechanism 21a and a position where the wafer W can be transferred between the chucks 28a to 28c of the wafer transfer device 22. It is slidable, and has a structure that does not collide with the chucks 28a to 28c of the wafer transfer device 22 when the wafer W in the substantially vertical state is held under the wafer W and slid to the wafer transfer device 22 side. .

  The adjustment of the arrangement pitch of the wafers W in the wafer transfer device 21 is performed as follows, for example. First, 25 wafers W from the first carrier C are transferred to the posture changing mechanism 21a by the wafer carry-in / out device 19. Next, the posture changing mechanism 21a changes the posture of the wafer W to a substantially vertical state and transfers it to the wafer vertical holding mechanism 21b. At this time, the arrangement pitch of the wafers W transferred to the wafer vertical holding mechanism 21b is the same as the arrangement pitch in the carrier C. Subsequently, 25 wafers W from the second carrier C are transferred to the attitude changing mechanism 21 a by the wafer carry-in / out device 19. Thereafter, the posture changing mechanism 21a changes the posture of the wafer W to a substantially vertical state and transfers it to the wafer vertical holding mechanism 21b. At this time, the position of the wafer vertical holding mechanism 21b is a distance half the arrangement pitch in the arrangement direction of the wafer W. By shifting the wafer W only by a distance, the wafer W can be held by the wafer vertical holding mechanism 21b at an arrangement pitch that is half the arrangement pitch in the carrier C.

  Note that the method of converting the arrangement pitch between the wafers W to half is not limited to the method described above. For example, the posture changing mechanism 21a has a structure capable of holding 50 wafers W that can be stored in two carriers C at an arrangement pitch that is half the arrangement pitch of the carriers C. When the wafer W is transferred from the wafer carry-in / out device 19 to the posture changing mechanism 21a, the height of either the wafer carry-in / out device 19 or the posture changing mechanism 21a is arranged in the carrier C of the wafer W. Shift about half of the pitch as a whole. In this way, it is possible to collectively change the posture of the 50 wafers W held by the posture changing mechanism 21a and transfer it to the wafer vertical holding mechanism 21b.

  Further, for example, after the wafer W for one carrier C is delivered to the posture changing mechanism 21a at the same arrangement pitch as the wafer W in the carrier C, the wafer W is horizontally placed in the posture changing mechanism 21a. The arrangement pitch of the wafers W may be changed at any timing before and after conversion from the state to the vertical state. It is also possible to provide a mechanism for adjusting the arrangement pitch in the wafer vertical holding mechanism 21b.

  Further, the rotation direction of the wafer W in the posture changing mechanism 21a can be rotated by 90 ° in the forward direction and the reverse direction, and the wafer W of the first carrier C is rotated in the forward direction in the posture changing mechanism 21a. After the attitude conversion, the wafer W of the second carrier C is transferred to the wafer vertical holding mechanism 21b after the attitude conversion mechanism 21a performs the attitude conversion by the reverse rotation. In the wafer vertical holding mechanism 21b, the surface (processing surface) of the wafer W on which a resist film or the like is formed in a later step can be made to face each other. When the wafer W of the second carrier C is also transferred to the wafer vertical holding mechanism 21b after being changed in posture by forward rotation in the posture changing mechanism 21a, the surface (processing surface) of the wafer W is transferred to the wafer vertical holding mechanism 21b. ) Are arranged in one direction.

  The wafer transfer device 22 transfers the wafer W in the vertical state to the wafer vertical holding mechanism 21b, carries the unprocessed wafer W into the liquid processing unit 4, and conversely, the wafer W that has been subjected to the liquid processing or the like. Is carried out from the liquid processing unit 4 and transferred to the wafer vertical holding mechanism 21b. In the wafer transfer device 22, the wafer W is held by three chucks 28a to 28c.

  FIG. 3 is a front view showing the positional relationship between the chucks 28 a to 28 c in the wafer transfer device 22. The chucks 28a to 28c are formed with groove portions 41 (shown in detail in FIG. 4 to be described later) for holding the wafers W at the same interval as the arrangement pitch of the wafers W held by the wafer vertical holding mechanism 21b. Of the chucks 28a to 28c, the center chuck 28a is fixed to the base 29 and holds the wafer W at the lowermost end. The remaining two chucks 28b and 28c are connected to the rotary shafts 42b and 42c by connecting members 43b and 43c, respectively, and predetermined around the rotary shafts 42b and 42c so as to draw an arc on the ZX plane by a rotating mechanism (not shown). Rotate the angle. The chucks 28b and 28c are held in an open state (dotted line position) when the wafer W is transferred, and are held in a closed state (solid line position) during transfer.

  When the chucks 28b and 28c are opened (dotted line positions), all the chucks 28a to 28c are arranged in a straight line in the X direction. In this state, the chucks 28a to 28c by the chuck cleaning mechanism 26 described later are used. The cleaning process 28c is performed. Further, the position where the chucks 28b and 28c hold the wafer W is not limited to the position shown in FIG. 3, and may be any position above or below the position shown in FIG. .

  It should be noted that the manner of delivery of the wafer W between the wafer vertical holding mechanism 21b and the wafer transfer device 22 is not limited to the method of moving the wafer vertical holding mechanism 21b in the Y direction with respect to the wafer transfer device 22, and there are various modes. Conceivable. For example, a method of moving the wafer vertical holding mechanism 21b in the Z direction with respect to the wafer transfer device 22 or a method of providing a transfer mechanism (not shown) between the wafer vertical holding mechanism 21b and the wafer transfer device 22 can be mentioned. . Further, the wafer transfer device 21 may change the arrangement pitch between the wafers W without changing the arrangement pitch of the wafers W. That is, the change or adjustment of the arrangement pitch of the wafers W can be performed in any of the wafer W transfer processes in the interface unit 3 as long as the wafers W for two carriers C can be held at a predetermined pitch in the wafer transfer device 22. You can do it in stages.

  The wafer transfer device 22 is moved along the guide rail 23 so that the wafer transfer device 22 can transfer the wafer W to and from the wafer vertical holding mechanism 21b and transfer the wafer W to the liquid processing unit 4. It moves in the X direction and can enter / exit the liquid processing unit 4. Further, in order to confirm whether the wafer W after the liquid processing is not damaged or displaced, the wafer W is transferred between the wafer vertical holding mechanism 21 b and the wafer transfer device 22. A detection sensor 27 for inspecting the arrangement state of the wafers W is provided. The detection sensor 27 is not limited to such a position, and may be at a position where the inspection can be performed before the wafer W is transferred to the wafer carry-in / out device 19 after the liquid processing.

  In the interface unit 3, a parking area 9a is provided next to a place where the wafer W is transferred between the wafer vertical holding mechanism 21b and the wafer transfer device 22, and the parking area 9a includes, for example, It is possible to wait for an unprocessed wafer W. For example, the wafer W to be subjected to the liquid processing or the drying processing is performed on a lot of wafers W, and the wafer W to be subjected to the next liquid processing is used in the parking area 9a using the time when the wafer transfer device 22 is not required to be operated. Carry to. Thereby, for example, compared with the case where the wafer W is transported from the carrier stock unit 6, it is possible to shorten the movement time of the wafer W to the liquid processing unit 7 and to improve the throughput.

  The liquid processing unit 4 includes a liquid processing unit 7, a drying unit 8, and a parking area 9b. From the interface unit 3 side, the drying unit 8, the liquid processing unit 7, and the parking area 9b are arranged in this order. Yes. The wafer transfer device 22 can move in the liquid processing unit 4 along a guide rail 23 extending in the X direction.

  Similar to the parking area 9a, the parking area 9b is a place for waiting for an unprocessed wafer W. The wafer W to be started next is transferred to the parking area 9b using the time when the wafer W of the lot having the liquid processing or the drying processing is performed and it is not necessary to operate the wafer transfer device 22. Is done. Since the parking area 9b is adjacent to the liquid processing unit 7, the movement time of the wafer W can be shortened at the start of the liquid processing, and the throughput can be improved.

  As shown in FIG. 2, the liquid treatment unit 7 includes, from the parking area 9b side, a first chemical tank 31, a first water washing tank 32, a second chemical liquid tank 33, a second water washing tank 34, and a third water washing tank. The chemical tank 35 and the third washing tank 36 are arranged in this order. Further, the first transfer device 37 for transferring the wafer W between the first chemical solution tank 31 and the first water washing tank 32, and the wafer W between the second chemical solution tank 33 and the second water washing tank 34. A second transfer device 38 for transferring the wafer W, and a third transfer device 39 for transferring the wafer W between the third chemical bath 35 and the third washing bath 36.

  For example, in the first chemical tank 31, an SPM liquid (mixed solution of concentrated sulfuric acid and hydrogen peroxide solution) heated to around 130 ° C. is stored in order to remove organic dirt and surface metal impurities. Yes. The second chemical solution tank 33 stores a chemical solution for removing deposits such as particles, for example, SC-1 solution (a mixed solution of ammonia, hydrogen peroxide, and water), and a third chemical solution tank. 35 stores an etchant for etching an oxide film formed on the surface of the wafer W, for example, diluted hydrofluoric acid. As the etchant, a mixture of hydrofluoric acid and ammonium fluoride (buffered hydrofluoric acid (BHF)) can be used in addition to dilute hydrofluoric acid.

  The first to third water rinsing tanks 32, 34, and 36 are for removing the chemical liquid adhering to the wafer W by the liquid processing performed by the first to third chemical liquid tanks 31, 33, and 35, respectively. Various washing methods such as quick dumpling are used.

  The first transfer device 37 has a drive mechanism that can be moved up and down in the Z direction. After the wafer W transferred from the wafer transfer device 22 is lowered and immersed in the first chemical bath 31, a predetermined time has elapsed. Next, the wafer W is moved in parallel in the X direction, so that the wafer W is immersed in the first water rinsing tank 32, held for a predetermined time, and then lifted. The wafer W that has been processed in the first washing tank 32 is once returned to the chucks 28 a to 28 c of the wafer transfer device 22 and then transferred from the wafer transfer device 22 to the second transfer device 38. The second and third transfer devices 38 and 39 have the same structure as the first transfer device 37 and operate in the same manner. It is preferable that the transfer of the wafer W between the wafer transfer device 22 and the first to third transfer devices 37 to 39 is performed on the first to third washing tanks 32, 34, and 36, respectively. This is because when the wafer transfer device 22 is stopped above the first to third chemical tanks 31, 33, and 35, the wafer transfer device 22 is contaminated and damaged by chemical vapor or the like. Is to prevent.

  The drying unit 8 is provided with a water washing tank 24 and a chuck washing mechanism 26 for washing the chucks 28 a to 28 c of the wafer transfer device 22. In the upper part of the water washing tank 24, for example, vapor of isopropyl alcohol (IPA) is provided. A drying chamber (not shown) for supplying and drying the wafer W is provided. Further, a transfer device 25 for transferring the wafer W between the washing tank 24 and the drying chamber is provided, and the wafer W washed in the washing bath 24 is pulled up by the transfer device 25 and is IPA dried in the drying chamber. It is like that. The transfer device 25 is configured in the same manner as the first transfer device 37 and the like described above except that it cannot move in the X direction, and the wafer W can be transferred to and from the wafer transfer device 22.

  4A and 4B are explanatory views showing the structure of the chuck cleaning mechanism 26. FIG. 4A is a plan view of the chuck cleaning mechanism 26, FIG. 4B is a sectional view of the cleaning nozzle 51, and FIG. FIG. 4C shows a sectional view of the drying nozzle 54. The chuck cleaning mechanism 26 has a driving mechanism such as a cleaning nozzle 51, a drying nozzle 54, a nozzle holding part 52, a guide 53 and a driving mechanism such as an air cylinder (not shown) that moves the nozzle holding part 52 along the guide in the Y direction. ing. The cleaning nozzle 51 is provided with irregularities that can cover the upper portions of the chucks 28a to 28c arranged side by side in the X direction. Inside the cleaning nozzle 51, a cleaning liquid supply path 51a and a cleaning liquid discharge port are provided. A cleaning liquid branch supply path 51b is formed to connect 51c, the cleaning liquid supply path 51a, and the cleaning liquid discharge port 51c.

  The cleaning liquid supply path 51a is supplied with a cleaning liquid from a cleaning liquid supply source (not shown), and the cleaning liquid discharge port 51c discharges the cleaning liquid at a predetermined angle toward the groove 41 formed in the chucks 28a to 28c. Can be done. In FIG. 4B, the cleaning liquid discharge port 51c is provided at different angles depending on the chucks 28a to 28c to be cleaned. This takes into account the position of the groove 41 when the chucks 28b and 28c are lowered to the same height as the chuck 28a and the diffusion direction of the cleaning liquid. The arrangement angle of the cleaning liquid discharge port 51c is not limited to the state shown in FIG. 4B, and an appropriate angle is appropriately determined in consideration of the shape of the chucks 28a to 28c and the shape and formation position of the groove 41. Set to

  Similarly to the cleaning nozzle 51, the drying nozzle 54 includes therein a drying gas supply path 54a, a drying gas discharge port 54c, and a drying gas branch supply path 54b that connects the drying gas supply path 54a and the drying gas discharge port 54c. It has a formed structure. The position and number of the dry gas discharge ports 54c are appropriately determined so that the cleaning liquid attached to the chucks 28a to 28c is blown off by the dry gas discharged from the dry gas discharge port 54c, and the whole is dried. It is not limited to the position and number shown in (c). Note that the chucks 28 a to 28 c can be dried by discharging a drying gas from the cleaning nozzle 51 without providing the drying nozzle 54.

  First, the chuck cleaning mechanism 26 is used by moving the cleaning nozzle 51 and the drying nozzle 54 toward the base 29 side at a predetermined speed while discharging the cleaning liquid from the state shown in FIG. When the cleaning process of 28a to 28c is performed and then the cleaning nozzle 51 finishes discharging the cleaning liquid to all the groove portions 41 and reaches a predetermined position on the pedestal 29 side, this time, the nitrogen gas is supplied from the dry gas discharge port 54c. While discharging the dry gas such as, the position of the cleaning nozzle 51 is moved to the tip side of the chucks 28a to 28c at a predetermined speed to dry the chucks 28a to 28c. Thus, the chucks 28a to 28c can be cleaned and dried. By performing the drying process of the chucks 28a to 28c from the pedestal 29 side toward the tip side of the chucks 28a to 28c, it is possible to prevent the cleaning liquid scattered by the dry gas from adhering to the pedestal 29 and the like.

  Next, the processing steps of the liquid processing apparatus 1 configured as described above will be described with reference to the explanatory view showing the liquid processing steps in FIG. First, the number of wafers W to be processed, that is, the number of carriers C is determined (step 1). In the following example, it is assumed that the carrier C in which 25 wafers W are stored in a horizontal state is two lots as one lot and liquid processing is performed for five lots.

  First, two carriers C (referred to as C1 and C2) constituting one lot are placed on the carrier carry-in / out section 5 (step 2). The shutter 14 is opened, and the carrier C1 is carried into the carrier stock unit 6 using the carrier conveying device 12 (step 3). After carrying the carrier C1 into the carrier stock unit 6, it is preferable to close the shutter 14 so that dust or the like does not enter the carrier stock unit 6.

  The carrier C1 carried into the carrier stock unit 6 is placed on the inspection / carrying-in / out stage 15 (step 4), the lid of the carrier C1 is opened by the lid opening / closing mechanism 17, and the window 16 is further opened. The number and storage state of the wafers W stored in C1 are inspected by the wafer inspection device 18 (step 5).

  In the case where no abnormality is detected in the storage state of the wafer W with respect to the carrier C1, the window 16 and the lid of the carrier C1 are closed, and any of the carrier holding members 13 provided in the carrier stock portion 6 is closed. The position is stored in the carrier conveyance device control unit 90 (step 6). Subsequently, the carrier C2 is loaded into the carrier stock unit 6 in accordance with the above-described Step 3 to Step 6, and the storage state of the wafer W in the carrier C2 is inspected. If no abnormality is found, the carrier C2 also holds the carrier. It is placed on one of the members 13 and its position is stored (step 7).

  If an abnormality is found in the storage state of the wafer W of the carrier C1 in the step 5, the carrier C1 is not subjected to the liquid treatment, so that the carrier C1 is returned to the carrier loading / unloading unit 5 and the carriers C1 and C2 are returned Remove from the loading / unloading section 5 (step 8). If an abnormality is found in the storage state of the wafer W in step 5 performed for the carrier C2, the carrier C1 is returned to the carrier loading / unloading unit 5 and then the temporarily stored carrier C1 is loaded / unloaded. Returning to the unit 5, the carriers C1 and C2 are removed from the carrier carry-in / out unit 5 (step 8). The processes from step 2 to step 8 are similarly performed for the remaining carriers C (referred to as C3 to C10) (step 9).

  Since a predetermined time is required for the inspection of the number of wafers W and the storage state of the carrier C1, using this time, the carriers C2 to C10 are sequentially carried into a predetermined position of the carrier stock unit 6. After the inspection of the wafer W for the carrier C1 is completed, the carrier transfer device 12 is operated so that the carrier C2 to be inspected next is moved from the storage position of the carrier stock unit 6 to the inspection / loading / unloading stage 15. You may let them.

  Conventionally, for example, when no abnormality is detected for the wafer W stored in the carrier C1, these wafers W are unloaded from the carrier C1 by the wafer loading / unloading device 19 and transferred to the wafer vertical holding mechanism 21b. A method of waiting for the transfer of the wafer W stored in the carrier C2 has been adopted. However, when such a method is used, when it is necessary to stop the liquid processing because the number of wafers W on the carrier C2 is insufficient, the wafer C is transferred to the wafer vertical holding mechanism 21b or the like. The wafer W needs to be pulled back to the carrier loading / unloading unit 5 and stored in the carrier C1, which may cause a delay in processing time.

  Further, the liquid processing has been completed without any problem for the carriers C1 and C2, but if the number of wafers W stored in the next carrier C3 is insufficient, the processing for the carriers C3 and C4 cannot be performed. Therefore, it is impossible to perform the liquid processing of the wafers W for the 10 carriers C that were initially scheduled. In this case, it becomes necessary to prepare a new wafer or change the processing conditions for processing for eight carriers. The occurrence of such a situation is not preferable in production management.

  In the present invention, in order to start the liquid processing after confirming the state of the stored wafer W with respect to all the carriers C prepared in advance in steps 1 to 9 described above, the wafer W is not pulled back. Disappear. In addition, when there is a shortage of wafers, production management is facilitated by changing processing conditions in advance.

  After the predetermined number of carriers C to be processed are stored in the carrier stock unit 6 through the processes up to step 9, liquid processing of the wafer W is started. Since the position of the carrier C1 is stored in the carrier conveyance device control unit 90, the carrier conveyance device 12 is operated to move the carrier C1 from the storage position to the inspection / carrying-in / out stage 15 (step 10). Then, the lid of the carrier C1 is opened, the window 16 is opened, the unprocessed wafer transfer arm 19a of the wafer carry-in / out device 19 is operated, and the wafer W in the carrier C1 is carried out. (Step 11). Note that when the wafer W is taken out from the carrier C1, the state of the wafer W in the carrier C1 has been confirmed first, so that the inspection by the wafer inspection apparatus 18 may not be performed, but again for reconfirmation. An inspection by the wafer inspection apparatus 18 may be performed.

  After the wafer W is unloaded from the carrier C1, the carrier stock unit 6 closes the window 16 and the cover of the carrier C and operates the carrier transfer device 12 to inspect / load the empty carrier C1. The carrier C2 is returned to the original position stored from 15, and the carrier C2 is moved to the inspection / carry-in / out stage 15. In the interface unit 3, the wafer W held by the arm 19a is transferred to the posture changing mechanism 21a, and the posture is changed by the posture changing mechanism 21a and transferred to the wafer vertical holding mechanism 21b. The arm 19a is again accessible to the carrier C2 placed on the inspection / loading / unloading stage 15, and the wafer W in the carrier C2 is taken out and transferred to the posture changing mechanism 21a. The posture changing mechanism 21a changes the posture of the wafer W and transfers the wafer W to the wafer vertical holding mechanism 21b. In this way, 50 wafers W are arranged in the wafer vertical holding mechanism 21b at a pitch that is half the arrangement pitch stored in the carriers C1 and C2.

  The wafer vertical holding mechanism 21b is slid to the wafer transfer device 22 side, and the wafer W is transferred to the chucks 28a to 28c. After the wafer W is transferred to the wafer transfer device 22, it is possible to transfer the wafer W to be used for liquid processing next to the wafer vertical holding mechanism 21 b, so that the wafer W is transferred from the carriers C 3 and C 4. As described later, it is preferable to prepare for waiting the wafers W of the carriers C3 and C4 in the parking area 9b after the liquid processing of the wafers W of the carriers C1 and C2 is started.

  The wafer transfer device 22 holding the wafer W is moved along the guide rail 23 to the position of the first chemical bath 31 or the first washing bath 32 of the liquid processing unit 7, and the wafer W is moved to the first transfer device 37. And liquid processing of the wafer W is started (step 12). The liquid treatment of the wafer W includes, for example, immersion in the first chemical bath 31 and cleaning by the first water washing bath 32, immersion in the second chemical bath 33 and cleaning by the second water washing bath 34, and third processing. It is performed in the order of immersion in the chemical tank 35 and cleaning by the third water washing tank 36.

  After starting the liquid processing of the wafer W, for example, while the wafer W is immersed in the first chemical tank 31 and then cleaned in the first water washing tank 32, the wafer transfer device 22 is used. Therefore, for example, the wafer W to be processed next is received from the wafer vertical holding mechanism 21b and transferred to the parking area 9b using this time. Then, after the wafer W whose liquid processing has been started is transferred from the first washing tank 32 to the second transfer device 38, the next wafer W waiting in the parking area 9b is transferred to the first transfer. It transfers to the apparatus 37 and the liquid process in the 1st chemical | medical solution tank 31 is started.

  This shortens the tact time and improves the throughput. The transfer of the wafer W to the parking area 9b can be performed in consideration of the timing at which the wafer W that has been subjected to the liquid processing is returned to the carrier stock unit 6 and transferred. Note that the wafer W to be processed next may wait in the parking area 9a. Further, the wafer W to be processed next can be waited in the parking area 9b, and further, the wafer W to be processed next can be waited in the parking area 9a.

  The wafer W that has been processed in the liquid processing unit 7 is once transferred to the wafer transfer device 22 and then transferred to the transfer device 25 of the drying unit 8 to be subjected to a drying process. The wafer W after the drying process is transferred to the wafer transfer device 22 and returned to the interface unit 3, and the state of the wafer W is inspected by the detection sensor 27. Here, if an abnormality is detected in the state of the wafer W, for example, the liquid processing apparatus 1 is stopped and maintenance is performed. In this way, damage to the wafer transfer device 22 and the wafer vertical holding mechanism 21b, damage to the wafer W, and the like due to a delivery mistake to the wafer vertical holding mechanism 21b can be prevented.

  The wafer W returned to the interface unit 3 after the completion of the liquid processing is inspected / in / out stage 15 by a procedure reverse to the procedure of transferring the unprocessed wafer W from the carrier stock unit 6 to the wafer transfer device 22 previously. Can be accommodated in empty carriers C1 and C2 placed on (step 13). The carriers C1 and C2 in which the wafers W that have been subjected to the liquid processing are stored are transported and unloaded to the carrier loading / unloading unit 5 and sent to the next process (step 14). In the processing of steps 10 to 14 described above, the wafer W to be processed is sequentially transferred to the liquid processing unit 4 in consideration of the return transfer timing of the wafer W that has been subjected to the liquid processing. After the liquid processing for all the carriers C1 to C10 is completed, processing of another lot can be started.

  When the wafer C that has been subjected to the liquid processing is stored in the carrier C, if a carrier C different from the carrier C in which the wafer W before the liquid processing is stored is used, the empty space after the wafer W is taken out is used. The carrier C may be carried out to the carrier carry-in / out unit 5 and the carrier C used instead may be carried into the carrier stock unit 6. In addition, after the empty carrier C is temporarily carried into and stored in the carrier stock unit 6, the carrier carrying device 12 is carried out to the carrier carry-in / out unit 5 for a time when the carrier conveying device 12 does not need to be driven, and the liquid treatment is completed. Another carrier C for storing the wafer W may be carried in. Carrying in and storing the carrier C for storing the wafer W that has been subjected to such liquid processing into the carrier stock unit 6 is performed within the time until the wafer W that has been subjected to liquid processing returns to the inspection / carrying-in / out stage 15. Just do it.

  Next, another embodiment of the liquid processing apparatus according to the present invention will be described. FIG. 6 is a plan view showing the structure of the liquid processing apparatus 100. The liquid processing apparatus 100 is different from the liquid processing apparatus 1 described above in the structure of the carrier stock unit 6 and the interface unit 3, and the other part (unit) has the same structure as the liquid processing apparatus 1. Specifically, in the liquid processing apparatus 100, a carrier retracting device 60 is newly installed in the carrier stock unit 6, and the interface unit 3 is provided with a portion of the wafer transfer device 19 and the posture changing mechanism 21 a in the wafer transfer device 21. Instead, it differs from the liquid processing apparatus 1 in that a wafer loading / unloading / posture changing device 70 is provided. Therefore, the carrier retracting device 60 and the wafer loading / unloading / posture changing device 70 will be described below.

  FIG. 7 is an explanatory view showing the structure of the carrier retracting device 60 provided in the carrier stock unit 6. The carrier retracting device 60 is a mechanism for temporarily retracting the carrier C placed on the inspection / loading / unloading stage 15 above the inspection / loading / unloading stage 15. Here, in the following description, the position of the carrier C placed on the inspection / carrying-in / out stage 15 is referred to as “inspection position”, and the carrier C is temporarily lifted above the inspection position by the carrier retracting device 60. The held position is referred to as a “retracted position”. Note that the retracted position is not limited to the upper side of the inspection position, and may be, for example, the lateral direction of the inspection position.

  The carrier retracting device 60 includes a carrier gripping portion 61 that grips the carrier C, a slide arm 62 that slides the carrier gripping portion 61 in the Y direction, and a guide 63 that is attached to the wall surface of the carrier stock portion 6 and extends in the Z direction. And an arm holding portion 64 that holds the slide arm 62 and is slidable in the Z direction along the guide 63. In addition, although the drive mechanism of the slide arm 62 and the arm holding | maintenance part 64 is not shown in figure, an air cylinder, a belt conveyance mechanism, etc. can be used as these drive mechanisms, for example.

  As a premise for using the carrier retracting device 60, in the liquid processing apparatus 100, as shown in FIG. 7, a carrier C ′ having a substantially T-shaped protrusion 81 formed on the upper surface is used as the carrier C. The protrusion 81 includes a column part 81a and an umbrella part 81b.

  The carrier gripping portion 61 has a substantially L-shape, and as shown in FIG. 7A, by operating the slide arm 62, the carrier gripping portion 61 moves to the protrusion 81 on the upper surface of the carrier C ′ at the inspection position. It is accessible from the Y direction and can be inserted between the umbrella portion 81b and the upper surface of the carrier C. Then, as shown in FIG. 7B, the arm holding portion 64 is lifted in the Z direction along the guide 63 with the carrier gripping portion 61 inserted between the umbrella portion 81b and the upper surface of the carrier C ′. Then, the carrier gripping part 61 and the umbrella part 81b come into contact with each other, the carrier C ′ can be raised in the Z direction, and the carrier C ′ can be moved to the retracted position. The carrier gripping portion 61 is not limited to a substantially L shape, and may be a substantially U shape, for example, as long as it can be inserted between the umbrella portion 81b and the upper surface of the carrier C. Absent.

  As shown in FIG. 7C, the arm 12a of the carrier transport apparatus 12 accesses the lower side of the carrier C ′ in the retracted position, and holds the carrier C ′. The carrier holding part 61 is lowered by a minute distance or the arm 12a of the arm 12a of the carrier transport device 12 is raised by a minute distance so that the carrier holding part 61 and the umbrella part of the projecting part 81 are not in contact with each other. Then, when the slide arm 62 is contracted, the carrier gripping portion 61 can be extracted from under the umbrella portion 81b. The carrier C ′ held by the arm 12a of the carrier transfer device 12 is transferred to the carrier holding member 13 at a predetermined position.

  Next, the wafer loading / unloading / posture changing device 70 provided in the interface unit 3 will be described in detail. FIG. 8 is an explanatory view showing the structure and operation mode of the wafer loading / unloading / posture changing device 70. The wafer loading / unloading / posture changing device 70 is movable to a plurality of support plates 71 arranged substantially in parallel at predetermined intervals, a plate holding unit 72 that holds the support plate 71, and the plate holding unit 72 side of the support plate 71. A wafer holding / moving guide 73 provided on the plate, a plate rotating mechanism 74 that collectively rotates the plurality of support plates 71 by a predetermined angle, a plate advance / retreat mechanism 75 that slides the support plate 71 in the X direction, and a plate advance / retreat mechanism 75. And an elevating mechanism 76 that slides in the Z direction.

  The plate holding portion 72 is connected to the plate advance / retreat mechanism 75 by a connecting jig 82. In FIG. 8, reference numeral 77 is a drive actuator for the plate advance / retreat mechanism 75, reference numeral 78 is a drive actuator for the lifting mechanism 76, and reference numeral 79 is a drive actuator for the wafer holding / moving guide 73. The drive actuator 79 drives the two wafer holding / moving guides 73 to simultaneously slide in the X direction.

  FIG. 9 is a cross-sectional view showing the structure of the support plate 71. Support pins 71 a that contact the wafer W are formed at predetermined positions on the front and back main surfaces of the support plate 71, and holding pins 71 b are provided at a substantially tip portion (on the carrier stock unit 6 side) of the support plate 71. ing. The tips of the holding pins 71b are bent toward the plate holding portion 72 side. The wafer holding / moving guide 73 is slidable in the X direction, and a groove 73a for sandwiching the wafer W is formed on the support plate 71 side in accordance with the position and pitch of the wafer W held on the support plate 71. .

  The support plate 71 has a symmetrical structure, and the wafer W is held on the upper surface by the plate rotation mechanism 74 in a normal state. Therefore, for example, the wafer W is used for transporting an unprocessed wafer W with the upper surface side shown in FIG. 9 as the upper surface, and is used for transporting the wafer W after the liquid processing is finished with the lower surface side rotated to be the upper surface. Can be used.

  The plate advancing / retracting mechanism 75 is operated to insert the support plate 71 into the carrier C ′ at the inspection position, and the lifting mechanism 76 is operated and lifted by a minute distance. From this state, the plate advancing / retreating mechanism 75 is operated to support the support plate 71. By pulling out from the carrier C ′, the wafer W is unloaded from the carrier C ′ while being in contact with the support pins 71a. When the wafer holding / moving guide 73 is slid to the front end side of the support plate 71 from this state, the wafer W is held between the holding pins 71b and the groove 73a formed in the wafer holding / moving guide 73, and not only in the horizontal direction but also in the Z direction. Movement is also restricted.

  Even if the support plate 71 holding the wafer W is rotated 90 ° by driving the plate rotation mechanism 74 in this way, the wafer W does not fall off the support plate 71 and fall. Further, since no other member is in contact with the lower end portion of the wafer W held in a substantially vertical state, the wafer W can be easily transferred to the wafer vertical holding mechanism 21b. In this case, the wafers W are held at the same interval as the arrangement pitch of the wafers W in the carrier C ′ in the wafer vertical holding mechanism 21b.

  For example, as shown in FIG. 8B, the wafer W is transferred from the wafer loading / unloading / posture changing device 70 to the wafer vertical holding mechanism 21b by lowering the support plate 71 together with the plate advancing / retracting mechanism 75 by the elevating mechanism 76. Then, the wafer W is placed in a predetermined groove 83 formed in the wafer vertical holding mechanism 21b, the wafer holding movement guide 73 is retracted to release the holding of the wafer W, and then the support plate 71 is raised. it can. Transfer of the liquid-processed wafer W from the wafer vertical holding mechanism 21b to the wafer loading / unloading / posture changing device 70 can be performed by the reverse procedure, but at this time, the front and back main surfaces of the support plate 71 facing the wafer W are used. Care should be taken that the surface is a surface for transporting the liquid-treated wafer W.

  Here, since the wafer vertical holding mechanism 21b is slidable in the Y direction, the wafer W of one carrier C ′ is transferred to the wafer vertical holding mechanism 21b, and then the wafer W of another carrier C ′ is held vertically. When transferring to the mechanism 21b, if the wafer vertical holding mechanism 21b is slid in the Y direction by a distance half the arrangement pitch of the wafers W in the carrier C ′, the wafer vertical holding mechanism 21b has two pieces. Wafers W for the carrier C ′ are held at a pitch that is half the arrangement pitch of the wafers W in the carrier C ′. Transfer of the wafer W between the wafer vertical holding mechanism 21b and the wafer transfer device 22 is performed in the same manner as in the liquid processing apparatus 1.

  When the wafer loading / unloading / posture changing device 70 is used, the footprint can be reduced because the arrangement area of the device is reduced as compared with the case of using the wafer loading / unloading device 19 and the posture changing mechanism 21a. It becomes. In addition, since the number of times of transferring the wafer W is reduced, it is possible to prevent damage to the wafer W and apparatus due to a transfer error.

  Next, with reference to FIG. 10, the carrier C ′ transport mode in the carrier stock unit 6 when the carrier retracting device 60 is used will be described. Here, four or more carriers C ′ have already been carried into the carrier stock section 6 by the carrier conveying device 12 and placed on the carrier holding member 13 at a predetermined position, and the liquid treatment is performed on the predetermined carrier C ′. In this state, since the liquid processing of the wafer W has not yet started, two carriers C ′ (hereinafter referred to as carriers C1 ′ and C2 ′) in which the wafer W is stored are already A transport mode of two carriers C ′ (hereinafter referred to as carriers C3 ′ and C4 ′) whose interior is empty because the liquid treatment has been started will be described.

  For the carriers C1 ′ and C2 ′, it is assumed that the wafer W already stored at the time of loading into the carrier stock unit 6 has been inspected and it has been confirmed that there is no abnormality. In FIG. 10, for convenience of explanation, the carriers C <b> 1 ′ to C <b> 4 ′ are shown close to each other, and the storage positions of the carriers C <b> 1 ′ to C <b> 4 ′ are shown close to the inspection / carry-in / out stage 15. However, these do not indicate the actual storage positions of the carriers C1 ′ to C4 ′, and indicate that all of the storage positions of the carriers C1 ′ to C4 ′ are close to the inspection / carry-in / out stage 15. Not a thing. That is, the carriers C1 ′ to C4 ′ are stored in an arbitrary carrier holding member 13 of the carrier stock unit 6.

  FIG. 10A shows an initial state. From this state, first, in order to carry the wafer W stored in the carrier C1 ′ to the interface unit 3, the carrier C1 ′ is moved to the inspection / carrying-in / out stage 15 by the carrier carrying device 12, and the lid of the carrier C1 ′. Then, the window 16 is opened, and re-inspection of the wafer W by the wafer inspection apparatus 18 is started (FIG. 10B). Since this inspection requires a predetermined time, using this inspection time, the carrier transport device 12 holds the carrier C2 ′, moves it to the vicinity of the inspection position, and stands by (FIG. 10B).

  When the inspection of the carrier C1 ′ is completed and it is confirmed that there is no abnormality, the wafer loading / unloading / posture changing device 70 unloads the wafer W from the carrier C1 ′, and closes the lid and the window 16 of the carrier C1 ′. Then, the carrier C1 ′ is raised to the retracted position by the carrier retracting device 60 (FIG. 10C). The wafer loading / unloading / posture changing device 70 can transfer the wafer W unloaded from the carrier C1 ′ to the wafer vertical holding mechanism 21b and then access the carrier C2 ′ mounted on the inspection / loading / unloading stage 15. Leave it in a state.

  By moving the carrier C1 ′ to the retracted position, the inspection position, that is, the inspection / carrying-in / out stage 15 becomes empty, so that the carrier C2 ′ held by the carrier transport device 12 is inspected / carrying-in / out stage 15 To be placed. In this way, the lid of the carrier C2 ′ and the window 16 are opened, and the wafer inspection apparatus 18 starts reinspecting the wafer W, and the carrier transport apparatus 12 receives the empty carrier C1 ′ in the retracted position from the carrier retracting apparatus 60. Return to the original storage position, hold the carrier C3 ', move it from the storage position to the vicinity of the inspection position, and wait (FIG. 10 (d)).

  When the inspection of the carrier C2 ′ is completed and it is confirmed that there is no abnormality, the wafer W is unloaded from the carrier C2 ′ by the wafer loading / unloading / posture changing device 70, and the cover and the window 16 of the carrier C2 ′ are closed. Then, the carrier C2 ′ is raised to the retracted position by the carrier retracting device 60 (FIG. 10E). In the interface unit 3, the wafer loading / unloading / posture changing device 70 transfers the wafer W unloaded from the carrier C2 ′ to the wafer vertical holding mechanism 21b, and further receives the wafer W from the wafer vertical holding mechanism 21b to the wafer transfer device 22. hand over. The wafer transfer device 22 transfers the wafer W to the first transfer device 37 or the parking areas 9a and 9b of the liquid processing unit 4, and then transfers the wafer W after the liquid processing and the drying process to the transfer device 25 or the parking area 9a. 9b is transferred to the wafer vertical holding mechanism 21b. Thus, the wafer W can be transferred from the wafer vertical holding mechanism 21b to the wafer loading / unloading / posture changing device 70.

  In the carrier stock unit 6, since the inspection position is vacated by moving the carrier C2 ′ to the retracted position, the carrier transport device 12 places the carrier C3 ′ held on the inspection / carrying-in / out stage 15. Put. For the carrier C3 ′, the lid and the window 16 of the carrier C3 ′ are opened, and the wafer W that has been subjected to the liquid processing from the wafer loading / unloading / posture changing device 70 is loaded into the carrier C3 ′. The storage state of W is inspected. As for the carrier transporting device 12, the carrier C2 'at the retracted position is received from the carrier retracting device 60 and returned to the original storage position, and the carrier C4' is held and moved from the storage position to the vicinity of the inspection position. And wait (FIG. 10 (f)).

  After the inspection on the carrier C3 ′ is completed, the lid of the carrier C3 ′ and the window 16 are closed, and the carrier C3 ′ is moved to the retracted position by the carrier retracting device 60 (FIG. 10G). Next, the carrier transport device 12 places the held carrier C4 ′ on the inspection / loading / unloading stage 15, and then receives the carrier C3 ′ at the retracted position from the carrier retracting device 60 and returns it to the original storage position ( FIG. 10 (h)). At the inspection position, the lid and the window 16 of the carrier C4 ′ are opened, and the wafer W that has been subjected to the liquid processing is loaded into the carrier C4 ′ from the wafer loading / unloading / posture changing device 70. Check the storage state of the.

  When the inspection of the carrier C4 ′ is completed, the lid and the window 16 of the carrier C4 ′ are closed, and the carrier transport device 12 returns the carrier C4 ′ from the inspection position to the original storage position (FIG. 10 (i)). Thus, the predetermined processing is completed for the carriers C1 ′ to C4 ′.

  By disposing the carrier retracting device 60 like the liquid processing apparatus 100, the carrier transporting device 12 can be operated while the wafer inspection device 18 is inspecting a certain carrier C. The carrier C transport time in the carrier stock unit 6 is shortened, and the throughput is improved.

  As mentioned above, although embodiment of this invention was described, in any case of liquid processing apparatus 1 * 100, carrier C * C 'is carried in to the carrier stock part 6, and is moved by the carrier stock part 6 The form is not limited to the above embodiment.

  For example, in the case of the liquid processing apparatus 1, when processing two carriers (first carrier, second carrier) C as one lot, the combination of carriers C is determined, but for any number of lots When it is not determined whether to process, the following two methods can be used.

  In the first method, first, the number and state of the wafers W stored in the first carrier C are inspected, and if there is no problem, the first carrier C is stored in a predetermined position of the carrier stock unit 6. On the other hand, when the number of wafers is insufficient in the inspection of the first carrier C, the first carrier C is returned to the carrier loading / unloading unit 5 and the second carrier C in the set is not inspected. The next lot inspection is started.

  When there is no problem with the first carrier C, the number and state of the wafers W stored with respect to the second carrier C are inspected. If there is no problem as a result, the wafer is carried in from the second carrier C on the spot. The unloading device 19 unloads the wafer W to the interface unit 3 and transports the wafer W to the wafer vertical holding mechanism 21b. After the empty second carrier C from which the wafer W has been unloaded in this way is placed on one of the carrier holding members 13 arranged in the carrier stock section 6, the first carrier C that has been previously inspected / injected. The wafer W is moved to the exit stage 15 and the number and state of the wafers W are inspected again as necessary, and then the wafers W are unloaded to the interface unit 3 and transferred to the wafer vertical holding mechanism 21b.

  Thus, the 50 wafers W of the first and second carriers C held by the wafer vertical holding mechanism 21b are transferred to the wafer transfer device 22, and liquid processing is started. While this liquid processing is being performed, the carrier C constituting the lot to be processed next can be inspected in the same manner, and those that have been inspected are sequentially stored in the carrier stock unit 6. Alternatively, the wafer W can be transferred toward the parking areas 9a and 9b.

  In the second method, first, the first carrier C and the second carrier C are stored in a predetermined position of the carrier stock unit 6. Then, the first carrier C is moved to the inspection / carrying-in / out stage 15 to inspect the number and state of the wafers W accommodated therein. If there is no problem, the first carrier C is again inserted into the carrier stock unit 6. After returning to the original storage location, the second carrier C is then moved to the inspection / carrying-in / out stage 15 to inspect the number and state of the wafers W stored therein. To the original storage location in the carrier stock section 6.

  When the number of wafers is insufficient in the inspection of the first carrier C, the first carrier C is unloaded to the carrier loading / unloading unit 5 and the second carrier C is unloaded to the carrier loading / unloading unit 5. Then, the next lot inspection is started.

  If there is no problem in both the first and second carriers C, the first carrier C is first moved to the inspection / loading / unloading stage 15, and the number of wafers W stored again as necessary, When the state is inspected and there is no problem as a result, the wafer carry-in / out device 19 carries out the wafer W from the first carrier C and carries the wafer W to the wafer vertical holding mechanism 21b. After returning the empty first carrier C from which the wafer W has been unloaded to the original storage position of the carrier stock unit 6, the second carrier C is moved to the inspection / loading / unloading stage 15 and stored again as necessary. The number and state of the wafers W that are present are inspected, and if there is no problem as a result, the wafer carry-in / out device 19 carries the wafer W out of the second carrier C and carries the wafer W to the wafer vertical holding mechanism 21b.

  In this way, 50 wafers W of the first and second carriers C held by the wafer vertical holding mechanism 21b are transferred to the wafer transfer device 22, and liquid processing is started. While this liquid treatment is being performed, the carrier C constituting the lot to be processed next can be inspected in the same manner, and the inspection completed can be stored in the carrier stock section 6 or The wafer W can be transferred toward the parking areas 9a and 9b.

  In addition to this, there are a plurality of carriers C in which the wafers W to be processed are accommodated. However, if a set of two lots is not assembled in advance, the lots are assembled in the liquid processing apparatus 1 and the information is obtained. The method of recording can also be used. In this case, for example, when there is no problem such as a shortage of the number of wafers W for the first carrier C, the wafers W are unloaded on the spot, and the wafers W are transferred to the wafer vertical holding mechanism 21b. The empty first carrier C is stored at a predetermined position in the carrier stock unit 6, and when the second inspected carrier C is found to have an insufficient number of wafers W, the second carrier C is loaded into the carrier. After being returned to the exit unit 5 or temporarily stored in the carrier stock unit 6, the wafer W accommodated therein is returned to the carrier carry-in / out unit 5 at a predetermined timing without performing liquid processing.

  When it is confirmed that the third carrier C can start the liquid processing of the wafer W without any problem, such as a shortage of the number of wafers W, the wafer W is unloaded and the wafer vertical holding mechanism 21b. It is conveyed to. In this way, lots are formed for the first and third carriers C, and this is recorded. Such sequential processing can also be performed using the liquid processing apparatuses 1 and 100.

  In the above embodiment, the case where the present invention is applied to a semiconductor wafer has been described. However, the present invention is not limited to this and can be applied to processing of other substrates such as a liquid crystal display (LCD) substrate.

  As described above, according to the present invention, the liquid processing can be started after confirming the number and / or storage state of the substrates stored in a plurality of carriers constituting a lot. After taking out and transporting to the back of the liquid processing apparatus, processing cannot be performed because the number of substrates in the next carrier is insufficient, and the substrate is pulled back from the back of the liquid processing apparatus into the carrier. Thus, there is no time loss required for the processing, and an excellent effect is obtained that the throughput can be improved.

  In addition, by providing a carrier retracting device in the carrier stock unit, it is possible to use the carrier transporting device efficiently, thereby obtaining the effect of improving the throughput.

  Furthermore, when using a device that integrates a device that unloads a substrate from a carrier and a device that changes the posture of the unloaded substrate, the footprint of the liquid processing device can be reduced, and space can be saved. By reducing the number of times the substrate is transferred, an effect of preventing damage to the substrate and the apparatus can be obtained.

  Furthermore, by providing a parking area in the liquid processing apparatus in the vicinity of the liquid processing tank or in the interface unit for temporarily placing the substrate before liquid processing held in the vertical state in the liquid processing apparatus, In addition, it is possible to shorten the transfer time in the process, and it is possible to immediately perform the next liquid treatment in a predetermined treatment tank, thereby improving the throughput.

The perspective view which shows one Embodiment of the liquid processing apparatus of this invention. The top view which shows one Embodiment of the liquid processing apparatus of this invention. The front view and top view which showed the structure of the chuck | zipper part in the wafer conveyance apparatus used for the liquid processing apparatus of this invention. The top view and sectional drawing which show the structure of a chuck | zipper washing | cleaning mechanism. Explanatory drawing which shows one Embodiment of the liquid processing method of this invention. The top view which shows another embodiment of the liquid processing apparatus of this invention. Explanatory drawing which shows the structure of a carrier evacuation apparatus. Explanatory drawing which shows the structure and operation | movement form of a wafer carrying in / out attitude | position conversion apparatus. Sectional drawing which shows the structure of the support plate with which the wafer carrying in / out attitude | position apparatus of FIG. 8 comprises. Explanatory drawing which shows the conveyance form of the carrier in the carrier stock part in the liquid processing apparatus of FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 * 100; Liquid processing apparatus, 2; Carrying in / out part, 3; Interface part, 4; Liquid processing part, 5: Carrier carrying in / out part, 6: Carrier stock part, 7: Liquid processing unit, 8: Drying unit, 9a 9b; Parking area, 12; Carrier transfer device, 13; Carrier holding member, 15; Inspection / loading / unloading stage, 18; Wafer inspection device, 19; Wafer loading / unloading device, 21; Wafer transfer device, 21a; Wafer vertical holding mechanism, 22; Wafer transfer device, 60; Carrier retracting device, 70; Wafer loading / unloading / posture changing device, 90; Carrier transfer device controller, W; Semiconductor wafer (substrate), C / C ´; Career.

Claims (18)

A processing unit for performing predetermined liquid processing on a plurality of substrates of a plurality of carriers at once;
A carrier loading / unloading section for loading / unloading a carrier storing the plurality of substrates;
A carrier stock section capable of storing a plurality of the carriers; and
Carrying the carrier in and out of the carrier carry-in / out unit, and carrying the carrier in the carrier stock unit; and
An inspection / carry-in / out stage provided in the carrier stock unit;
A substrate transport unit that transports the substrate to and from the processing unit by loading and unloading the substrate with respect to the carrier transported to the inspection / loading / unloading stage;
A substrate inspection apparatus for inspecting the number and / or storage state of the substrates in the carrier conveyed to the inspection / carrying-in / out stage;
Among the plurality of carriers to be collectively processed, one carrier is transported to the substrate inspection apparatus, and if the result of the inspection is liquid processing is possible, the one carrier is returned to the carrier stock unit, Of the plurality of carriers to be processed, another carrier is transported to the substrate inspection apparatus, and if the result of the inspection is that liquid processing is possible, the one carrier and the plurality of substrates in the other carrier are inspected / carried in. Control to unload from the exit stage ,
When another carrier to be processed in combination with a carrier that is determined to stop the liquid processing of the stored substrate is already stored in the carrier stock unit, the other carrier is loaded into the carrier. A control unit for controlling the carrier conveying device to return to the exit unit ;
A liquid processing apparatus comprising: A processing unit for performing predetermined liquid processing on a plurality of substrates of a plurality of carriers at once;
A carrier loading / unloading section for loading / unloading a carrier storing the plurality of substrates;
A carrier stock section capable of storing a plurality of the carriers; and
Carrying the carrier in and out of the carrier carry-in / out unit, and carrying the carrier in the carrier stock unit; and
An inspection / carry-in / out stage provided in the carrier stock unit;
A substrate transport unit that transports the substrate to and from the processing unit by loading and unloading the substrate with respect to the carrier transported to the inspection / loading / unloading stage;
A substrate inspection apparatus for inspecting the number and / or storage state of the substrates in the carrier conveyed to the inspection / carrying-in / out stage;
Among the plurality of carriers processed in batch, one carrier is transported to the substrate inspection apparatus, and if liquid processing is impossible as a result of the inspection, the substrate in the plurality of carriers processed in batch is processed. If the processing is stopped and liquid processing is possible, the one carrier is returned to the carrier stock unit, and among the plurality of carriers to be collectively processed, another carrier is transported to the substrate inspection apparatus, As a result, if the liquid processing is impossible, the processing for the substrates in the plurality of carriers to be collectively processed is stopped including the one carrier returned to the carrier stock portion, and if the liquid processing is possible, Controlling a plurality of substrates in one carrier and the other carrier to be unloaded from the inspection / loading-in / out stage ;
When another carrier to be processed in combination with a carrier that is determined to stop the liquid processing of the stored substrate is already stored in the carrier stock unit, the other carrier is loaded into the carrier. A control unit for controlling the carrier conveying device to return to the exit unit ;
A liquid processing apparatus comprising: The substrate transport unit is
A substrate loading / unloading device for loading / unloading the substrate with respect to the carrier;
A substrate transfer device for carrying the substrate in and out of the processing unit;
A substrate transfer device that delivers the substrate in a substantially horizontal state with the substrate carry-in / out device, and delivers the substrate in a substantially vertical state with the substrate transfer device;
The liquid processing apparatus according to claim 1, wherein the liquid processing apparatus comprises: The substrate transfer device includes:
A posture changing mechanism for transferring the substrate to and from the substrate carry-in / out device in a substantially horizontal state, and changing the posture of the substrate between a substantially horizontal state and a substantially vertical state;
A substrate vertical holding mechanism that transfers the substrate to and from the posture changing mechanism in a substantially vertical state, and transfers the substrate to and from the substrate transfer device in a substantially vertical state. The liquid processing apparatus according to claim 3. The substrate transport unit is
A substrate transfer device for carrying the substrate in and out of the processing unit;
A substrate loading / unloading / posture changing device that carries the substrate in and out of the carrier, changes the posture of the held substrate between a substantially horizontal state and a substantially vertical state, and delivers the substrate to and from the substrate transfer device; ,
The liquid processing apparatus according to claim 1, wherein the liquid processing apparatus comprises: The substrate loading / unloading / posture changing device comprises:
Protrusions that contact the substrate are formed at predetermined positions on the front and back main surfaces, and a plurality of support plates that are arranged substantially in parallel at predetermined intervals;
A plate holding portion for holding the plurality of support plates;
In each of the plurality of support plates, a substrate holding pin fixedly provided at a substantially tip portion on the opposite side of the plate holding portion,
A substrate holding movement guide movably provided on a plate holding portion side of the plurality of support plates;
A plate advancing / retreating mechanism coupled to the plate holding unit and configured to collectively enter / withdraw the plurality of support plates with respect to the carrier in the carrier stock unit;
A rotation mechanism that collectively rotates the plurality of support plates by a predetermined angle;
An elevating mechanism for elevating the plate holding portion by a predetermined distance in a direction perpendicular to the front and back main surfaces of the support plate;
Have
The substrate can be held on either side of the front and back main surfaces of the support plate by sandwiching the substrate between the substrate holding pin and the substrate holding movement guide. Liquid processing equipment. The carrier has a loading / unloading port for loading / unloading a substrate and a lid for opening / closing the loading / unloading port,
2. A lid opening / closing mechanism that opens and closes the lid during inspection of a substrate in a carrier by the substrate inspection apparatus and delivery of a substrate between the carrier and the substrate transport unit. The liquid processing apparatus as described in any one of thru | or 6 thru | or. The carrier stock carrier stored on portion after a predetermined number, the liquid processing apparatus according to any one of claims 1 to claim 7, characterized in that the liquid processing of the substrate is started. In the vicinity of the processing unit, according to claim 1 or any one of claims 8, characterized in that a parking area for temporarily placing a substrate in which a predetermined number of pre-solution treatment are arranged is provided The liquid processing apparatus as described in. The liquid processing apparatus according to claim 1 or any one of claims 9, characterized in that another substrate inspection apparatus for inspecting the number and / or arrangement of the substrate after the liquid processing is provided. A liquid processing method for performing predetermined liquid processing on a substrate in two carriers of a first carrier and a second carrier containing a plurality of substrates,
A first step of inspecting the number and / or storage state of the substrates in the first carrier;
When it is determined that the liquid treatment is possible in the inspection of the first step, the first carrier is stored in the carrier stock section, while it is determined that the liquid treatment should be stopped in the inspection of the first step. A second step of stopping the liquid treatment of the substrates in the two carriers,
A third step of inspecting the number and / or storage state of the substrates in the second carrier when the first carrier is stored in the carrier stock unit;
When it is determined in the inspection in the third step that liquid processing is possible, the substrate in the second carrier is transferred to the liquid processing unit, and then the substrate in the first carrier is transferred to the liquid processing unit. Or a fourth step of performing either one of the step of stopping the liquid processing of the substrate in the two carriers when it is determined that the liquid processing should be stopped in the inspection in the third step ,
When another carrier to be processed in combination with a carrier that is determined to stop the liquid processing of the stored substrate is already stored in the carrier stock unit, the other carrier is loaded into the carrier. A fifth step of returning to the exit;
The liquid processing method characterized by having. A liquid processing method for performing predetermined liquid processing on a substrate,
A first step of inspecting the number and / or storage state of substrates in a carrier in which a plurality of substrates are stored;
In the inspection in the first step, the carrier that is determined to be capable of liquid processing is stored in the carrier stock section, and the second step that stops liquid processing for the carrier that is determined to stop the liquid processing;
A third step of performing the first step and the second step on a predetermined number of carriers;
When another carrier to be processed in combination with a carrier determined to stop the liquid processing in the inspection in the first step is already stored in the carrier stock section, the other carrier is used as the carrier. A fourth step of unloading from the stock unit;
A fifth step of starting the liquid treatment of the substrate for the carrier after the carrier stored in the carrier stock part reaches a predetermined number;
When another carrier to be processed in combination with a carrier that is determined to stop the liquid processing of the stored substrate is already stored in the carrier stock unit, the other carrier is loaded into the carrier. A sixth step of returning to the exit;
The liquid processing method characterized by having. The liquid processing method according to claim 12 , wherein in the fifth step, at least two substrates in the carrier are collectively processed. In the fifth step, while the liquid treatment of one set of substrates is being performed, another set of substrates to be subjected to the next liquid treatment is kept waiting in the vicinity of the processing unit that performs the liquid treatment. The liquid processing method of Claim 12 or Claim 13 characterized by these. Liquid processing method as claimed in any one claims 11 to 14 characterized by having a step of inspecting the arrangement of the substrate after the liquid processing. A carrier retracting device for moving the carrier between a retracted position at a position away from an inspection position for performing the inspection by the substrate inspection device;
When it is determined that the liquid processing of the substrate in the carrier is possible based on the inspection result by the substrate inspection apparatus, the control unit conveys the plurality of substrates accommodated in the carrier to the substrate conveyance unit, The liquid processing apparatus according to claim 1, wherein the plurality of substrates are transported and controlled so that the empty carrier is retracted to the retracted position. The carrier transport device holds another carrier to be inspected next by the substrate inspection device while the inspection by the substrate inspection device is being performed on the carrier placed at the inspection position, and the inspection position Waiting in the vicinity, after the inspection of the carrier at the inspection position is completed and the carrier retracting mechanism moves the inspected carrier to the retracted position, the other carrier that has been held is placed at the inspection position. The liquid processing apparatus according to claim 16 , wherein the liquid processing apparatus is controlled to receive the carrier after inspection from the carrier retracting mechanism and store the carrier in a predetermined position. The retracted position, the liquid processing apparatus according to claim 16 or claim 17, characterized in that above the inspection position.

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