JPS5811701A - 銀パラジウム合金微粉末の製造方法 - Google Patents
銀パラジウム合金微粉末の製造方法Info
- Publication number
- JPS5811701A JPS5811701A JP56108821A JP10882181A JPS5811701A JP S5811701 A JPS5811701 A JP S5811701A JP 56108821 A JP56108821 A JP 56108821A JP 10882181 A JP10882181 A JP 10882181A JP S5811701 A JPS5811701 A JP S5811701A
- Authority
- JP
- Japan
- Prior art keywords
- silver
- palladium
- powder
- ions
- aqueous solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/16—Making metallic powder or suspensions thereof using chemical processes
- B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
- B22F9/20—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from solid metal compounds
- B22F9/22—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from solid metal compounds using gaseous reductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
- Powder Metallurgy (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56108821A JPS5811701A (ja) | 1981-07-14 | 1981-07-14 | 銀パラジウム合金微粉末の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56108821A JPS5811701A (ja) | 1981-07-14 | 1981-07-14 | 銀パラジウム合金微粉末の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5811701A true JPS5811701A (ja) | 1983-01-22 |
| JPS6221045B2 JPS6221045B2 (enExample) | 1987-05-11 |
Family
ID=14494372
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56108821A Granted JPS5811701A (ja) | 1981-07-14 | 1981-07-14 | 銀パラジウム合金微粉末の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5811701A (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6475601A (en) * | 1987-09-18 | 1989-03-22 | Tanaka Precious Metal Ind | Fine composite silver-palladium powder and production thereof |
| JP2006225712A (ja) * | 2005-02-17 | 2006-08-31 | Nippon Paint Co Ltd | 無電解メッキ用触媒及び無電解メッキ方法 |
-
1981
- 1981-07-14 JP JP56108821A patent/JPS5811701A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6475601A (en) * | 1987-09-18 | 1989-03-22 | Tanaka Precious Metal Ind | Fine composite silver-palladium powder and production thereof |
| JP2006225712A (ja) * | 2005-02-17 | 2006-08-31 | Nippon Paint Co Ltd | 無電解メッキ用触媒及び無電解メッキ方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6221045B2 (enExample) | 1987-05-11 |
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