JPS58114169A - ボンディング装置 - Google Patents

ボンディング装置

Info

Publication number
JPS58114169A
JPS58114169A JP56210558A JP21055881A JPS58114169A JP S58114169 A JPS58114169 A JP S58114169A JP 56210558 A JP56210558 A JP 56210558A JP 21055881 A JP21055881 A JP 21055881A JP S58114169 A JPS58114169 A JP S58114169A
Authority
JP
Japan
Prior art keywords
pattern
recognized
bonding
imaging device
optical path
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56210558A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0145664B2 (cg-RX-API-DMAC7.html
Inventor
Masahito Nakajima
雅人 中島
Tetsuo Hizuka
哲男 肥塚
Hiroyuki Tsukahara
博之 塚原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP56210558A priority Critical patent/JPS58114169A/ja
Publication of JPS58114169A publication Critical patent/JPS58114169A/ja
Publication of JPH0145664B2 publication Critical patent/JPH0145664B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Image Input (AREA)
  • Image Processing (AREA)
  • Image Analysis (AREA)
JP56210558A 1981-12-26 1981-12-26 ボンディング装置 Granted JPS58114169A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56210558A JPS58114169A (ja) 1981-12-26 1981-12-26 ボンディング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56210558A JPS58114169A (ja) 1981-12-26 1981-12-26 ボンディング装置

Publications (2)

Publication Number Publication Date
JPS58114169A true JPS58114169A (ja) 1983-07-07
JPH0145664B2 JPH0145664B2 (cg-RX-API-DMAC7.html) 1989-10-04

Family

ID=16591304

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56210558A Granted JPS58114169A (ja) 1981-12-26 1981-12-26 ボンディング装置

Country Status (1)

Country Link
JP (1) JPS58114169A (cg-RX-API-DMAC7.html)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5018053A (cg-RX-API-DMAC7.html) * 1973-06-07 1975-02-26
JPS5379008U (cg-RX-API-DMAC7.html) * 1976-12-01 1978-07-01

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5018053A (cg-RX-API-DMAC7.html) * 1973-06-07 1975-02-26
JPS5379008U (cg-RX-API-DMAC7.html) * 1976-12-01 1978-07-01

Also Published As

Publication number Publication date
JPH0145664B2 (cg-RX-API-DMAC7.html) 1989-10-04

Similar Documents

Publication Publication Date Title
JP2981941B2 (ja) ボンデイングワイヤ検査装置
US5347362A (en) Bonding wire inspection method
US5396334A (en) Bonding wire inspection apparatus
JP2969402B2 (ja) ボンデイングワイヤ検査装置
JPH07115300A (ja) 電子部品位置決め装置
JPH0634345A (ja) 光学検査装置
JPS58114169A (ja) ボンディング装置
US20180307027A1 (en) Optical observation device
JP2990550B2 (ja) ボンデイングワイヤ検査装置
JP2000275594A (ja) 基板検査装置
JPH0357241A (ja) 自動外観検査装置
TWI353032B (cg-RX-API-DMAC7.html)
JP3275742B2 (ja) チップのボンディング方法
JP2010262034A (ja) カップ取付け装置
JP2007033372A (ja) 外観検査装置
JPH04199525A (ja) フリップチップボンダー装置及び該装置の位置合わせ方法
JPH05332739A (ja) 外観検査装置
JP2006292647A (ja) ボンディングワイヤ検査装置
JP2548769Y2 (ja) 非接触測定機
JPH0786797A (ja) 装着部品の検出装置
JP2000031199A (ja) ワイヤボンディング装置
JP2695337B2 (ja) 硬度測定方法
JPH10300441A (ja) 半導体検査装置
JPS61198739A (ja) 電子部品接続用高精度位置決め機構
JPH03110454A (ja) ウエハ異物検査装置における被検物の動画像記録方式