JPS58109260U - 半導体素子取付装置 - Google Patents

半導体素子取付装置

Info

Publication number
JPS58109260U
JPS58109260U JP700382U JP700382U JPS58109260U JP S58109260 U JPS58109260 U JP S58109260U JP 700382 U JP700382 U JP 700382U JP 700382 U JP700382 U JP 700382U JP S58109260 U JPS58109260 U JP S58109260U
Authority
JP
Japan
Prior art keywords
semiconductor element
element mounting
mounting equipment
view
heat dissipation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP700382U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6236291Y2 (enrdf_load_stackoverflow
Inventor
順一 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP700382U priority Critical patent/JPS58109260U/ja
Publication of JPS58109260U publication Critical patent/JPS58109260U/ja
Application granted granted Critical
Publication of JPS6236291Y2 publication Critical patent/JPS6236291Y2/ja
Granted legal-status Critical Current

Links

JP700382U 1982-01-21 1982-01-21 半導体素子取付装置 Granted JPS58109260U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP700382U JPS58109260U (ja) 1982-01-21 1982-01-21 半導体素子取付装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP700382U JPS58109260U (ja) 1982-01-21 1982-01-21 半導体素子取付装置

Publications (2)

Publication Number Publication Date
JPS58109260U true JPS58109260U (ja) 1983-07-25
JPS6236291Y2 JPS6236291Y2 (enrdf_load_stackoverflow) 1987-09-16

Family

ID=30019778

Family Applications (1)

Application Number Title Priority Date Filing Date
JP700382U Granted JPS58109260U (ja) 1982-01-21 1982-01-21 半導体素子取付装置

Country Status (1)

Country Link
JP (1) JPS58109260U (enrdf_load_stackoverflow)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5324264U (enrdf_load_stackoverflow) * 1976-08-09 1978-03-01
JPS55181353U (enrdf_load_stackoverflow) * 1979-06-15 1980-12-26

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5324264U (enrdf_load_stackoverflow) * 1976-08-09 1978-03-01
JPS55181353U (enrdf_load_stackoverflow) * 1979-06-15 1980-12-26

Also Published As

Publication number Publication date
JPS6236291Y2 (enrdf_load_stackoverflow) 1987-09-16

Similar Documents

Publication Publication Date Title
JPS58109260U (ja) 半導体素子取付装置
JPS58175641U (ja) 半導体部品の取付装置
JPS59117194U (ja) 発熱部品の取付装置
JPS5929044U (ja) 半導体部品の取付装置
JPS58158445U (ja) 半導体素子試験用治具
JPS6064272U (ja) 半導体試験治具
JPS58166049U (ja) ハイブリツトｉｃの放熱構造
JPS596851U (ja) 平形半導体装置
JPS58433U (ja) 半導体装置
JPS58138349U (ja) 半導体実装構造
JPS5929047U (ja) スピ−カ・ヨ−クを用いた放熱装置
JPS5929048U (ja) 半導体部品の放熱器取付構造
JPS59132647U (ja) トランジスタ放熱板取付装置
JPS599553U (ja) 半導体装置
JPS59107157U (ja) ＧａＡｓ半導体装置
JPS596846U (ja) 半導体スタツクの冷却体構造
JPS59104541U (ja) 樹脂封止形ペレツトマウント構体
JPS58184848U (ja) トランジスタ構造
JPS5881937U (ja) 半導体装置
JPS5851448U (ja) パワトランジスタの取付構造
JPS5981044U (ja) 半導体装置
JPS6013751U (ja) 発熱素子の放熱構造
JPS5916157U (ja) 平形半導体素子スタツク
JPS58187153U (ja) 電子部品の放熱装置
JPS6122394U (ja) パツケ−ジ内冷却装置