JPS5810840A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS5810840A
JPS5810840A JP56107770A JP10777081A JPS5810840A JP S5810840 A JPS5810840 A JP S5810840A JP 56107770 A JP56107770 A JP 56107770A JP 10777081 A JP10777081 A JP 10777081A JP S5810840 A JPS5810840 A JP S5810840A
Authority
JP
Japan
Prior art keywords
semiconductor element
base body
radiator
ceramic
cover
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56107770A
Other languages
English (en)
Japanese (ja)
Other versions
JPS64812B2 (enExample
Inventor
Yutaka Hirano
裕 平野
Hiromoto Yamawaki
山脇 汪元
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP56107770A priority Critical patent/JPS5810840A/ja
Publication of JPS5810840A publication Critical patent/JPS5810840A/ja
Publication of JPS64812B2 publication Critical patent/JPS64812B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/692
    • H10W72/5363
    • H10W72/884
    • H10W90/734
    • H10W90/754

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP56107770A 1981-07-10 1981-07-10 半導体装置 Granted JPS5810840A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56107770A JPS5810840A (ja) 1981-07-10 1981-07-10 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56107770A JPS5810840A (ja) 1981-07-10 1981-07-10 半導体装置

Publications (2)

Publication Number Publication Date
JPS5810840A true JPS5810840A (ja) 1983-01-21
JPS64812B2 JPS64812B2 (enExample) 1989-01-09

Family

ID=14467563

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56107770A Granted JPS5810840A (ja) 1981-07-10 1981-07-10 半導体装置

Country Status (1)

Country Link
JP (1) JPS5810840A (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6059756A (ja) * 1983-09-12 1985-04-06 Ibiden Co Ltd プラグインパッケ−ジとその製造方法
JPS6095944A (ja) * 1983-10-31 1985-05-29 Ibiden Co Ltd プラグインパツケ−ジとその製造方法
JPS6095943A (ja) * 1983-10-31 1985-05-29 Ibiden Co Ltd プラグインパツケ−ジとその製造方法
JPH03130960U (enExample) * 1990-04-17 1991-12-27
US5173766A (en) * 1990-06-25 1992-12-22 Lsi Logic Corporation Semiconductor device package and method of making such a package

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6059756A (ja) * 1983-09-12 1985-04-06 Ibiden Co Ltd プラグインパッケ−ジとその製造方法
JPS6095944A (ja) * 1983-10-31 1985-05-29 Ibiden Co Ltd プラグインパツケ−ジとその製造方法
JPS6095943A (ja) * 1983-10-31 1985-05-29 Ibiden Co Ltd プラグインパツケ−ジとその製造方法
JPH03130960U (enExample) * 1990-04-17 1991-12-27
US5173766A (en) * 1990-06-25 1992-12-22 Lsi Logic Corporation Semiconductor device package and method of making such a package

Also Published As

Publication number Publication date
JPS64812B2 (enExample) 1989-01-09

Similar Documents

Publication Publication Date Title
KR100902766B1 (ko) 절연성 세라믹 히트 싱크를 갖는 디스크리트 패키지
KR20090056594A (ko) 온도 감지소자가 장착된 반도체 파워 모듈 패키지 및 그제조방법
US3469017A (en) Encapsulated semiconductor device having internal shielding
JP2591499B2 (ja) 半導体装置
JPS6128219B2 (enExample)
JPS6146061B2 (enExample)
US5317194A (en) Resin-sealed semiconductor device having intermediate silicon thermal dissipation means and embedded heat sink
JPS5810840A (ja) 半導体装置
JPH07176664A (ja) 半導体装置およびその製造方法
JPH05206320A (ja) マルチチップモジュール
JPS59117250A (ja) 半導体装置
JPS639664B2 (enExample)
JP3048707B2 (ja) 混成集積回路
JP3522975B2 (ja) 半導体装置
JPH08222652A (ja) 半導体装置及びその製造方法
JPH0241865Y2 (enExample)
JP2580779B2 (ja) 半導体装置
JP2570428B2 (ja) 半導体装置
JP3011502B2 (ja) 混成集積回路
JPH03116859A (ja) 混成集積回路装置
JPH0719167Y2 (ja) 半導体装置
JPH04207060A (ja) 半導体装置
JPH0797616B2 (ja) 半導体装置の製造方法
JPS5946051A (ja) 絶縁型半導体装置
JPS6120768Y2 (enExample)