JPS5810381Y2 - 回路基板 - Google Patents

回路基板

Info

Publication number
JPS5810381Y2
JPS5810381Y2 JP1979101492U JP10149279U JPS5810381Y2 JP S5810381 Y2 JPS5810381 Y2 JP S5810381Y2 JP 1979101492 U JP1979101492 U JP 1979101492U JP 10149279 U JP10149279 U JP 10149279U JP S5810381 Y2 JPS5810381 Y2 JP S5810381Y2
Authority
JP
Japan
Prior art keywords
pattern
circuit board
adhesive
positioning pattern
positioning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1979101492U
Other languages
English (en)
Japanese (ja)
Other versions
JPS5619076U (cs
Inventor
啓友 平井
Original Assignee
セイコーインスツルメンツ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by セイコーインスツルメンツ株式会社 filed Critical セイコーインスツルメンツ株式会社
Priority to JP1979101492U priority Critical patent/JPS5810381Y2/ja
Publication of JPS5619076U publication Critical patent/JPS5619076U/ja
Application granted granted Critical
Publication of JPS5810381Y2 publication Critical patent/JPS5810381Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/3201—Structure
    • H01L2224/32012—Structure relative to the bonding area, e.g. bond pad
    • H01L2224/32013—Structure relative to the bonding area, e.g. bond pad the layer connector being larger than the bonding area, e.g. bond pad
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Die Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP1979101492U 1979-07-23 1979-07-23 回路基板 Expired JPS5810381Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1979101492U JPS5810381Y2 (ja) 1979-07-23 1979-07-23 回路基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1979101492U JPS5810381Y2 (ja) 1979-07-23 1979-07-23 回路基板

Publications (2)

Publication Number Publication Date
JPS5619076U JPS5619076U (cs) 1981-02-19
JPS5810381Y2 true JPS5810381Y2 (ja) 1983-02-25

Family

ID=29334226

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1979101492U Expired JPS5810381Y2 (ja) 1979-07-23 1979-07-23 回路基板

Country Status (1)

Country Link
JP (1) JPS5810381Y2 (cs)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51158370U (cs) * 1975-06-11 1976-12-16

Also Published As

Publication number Publication date
JPS5619076U (cs) 1981-02-19

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