JPS58103275A - Solid-state image pickup device - Google Patents

Abstract

PURPOSE:To prevent the occurrence of cracks, by providing holes at both ends of a package and then burying members having a standard hole for positioning of pellet into those holes respectively. CONSTITUTION:A package 7 is made of only ceramics, and holes 8 of 4-5mm. diameter are provided at both ends of the package 7. A copal sleeve 9 having an inner diameter which is used as a reference hole is brazed to the hole 8 by means of a silver solder 4. A pellet 6 is attached on the basis of the inner diameter of the sleeve 9. Thus the high precision is secured for attachmene of the pellet. As a result, the area of adhesion can be minimized between the ceramics and the copal. This can prevent the occurrence of cracks due to a difference of thermal expansion between the ceramics and the copal.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a solid-state imaging device, and particularly relates to a solid-state imaging device that can position a pellet with respect to a package with high precision.

FIG. 1 is an internal structural diagram showing an example of a conventionally proposed solid-state imaging device. In the same figure, ceramic frame 1
and a Kovar plate 3 having a reference hole 2 for pellet positioning are bonded together using silver solder 4,
Pellets 6 are adhesively arranged with reference to the pellet positioning reference hole 2.

However, in the package having the above structure, when the ceramic frame 1 and the Kovar plate 3 are soldered with silver, the difference in thermal expansion coefficients between the two causes wrinkles, which may lead to cracks. Furthermore, even after the product is commercialized, hair cracks may progress due to temperature cycles and thermal shocks caused by the usage environment, resulting in poor airtightness, which poses a major problem in terms of reliability.

Also, as mentioned earlier, warpage and cracks during package manufacturing can reduce the yield of the process. It had the disadvantage of being expensive.

Therefore, an object of the present invention is to solve the above problems and provide a solid-state imaging device that is highly reliable and inexpensive. The advantage of the ceramic frame and Kovar plate is to take this point into consideration and minimize the bonding area.

An embodiment of the present invention will be described below with reference to FIG.

The package T is made of ceramic only, and a hole 8 with a diameter of 4 to 5 mm is provided at both ends. A copal sleeve 9 having an inner diameter serving as a reference hole is soldered to the silver solder 4 in this hole 8. By attaching the pellet 6 based on the inner diameter of the sleeve 9, highly accurate pellet attachment is possible.

With this structure, the adhesive area t between ceramic and Kovar
It can be made as small as possible, and warping and cracking due to the difference in thermal expansion coefficient between the two can be prevented.

FIG. 3 shows another embodiment. In this embodiment, instead of the sleeve, a plate member 11 provided with a reference hole 10 is embedded by brazing steel, and the same effect as described above can be obtained.

As described above, according to the present invention, the reference holes can be easily set, the yield during package manufacturing can be improved, and a highly reliable and inexpensive solid-state imaging device can be provided.

[Brief explanation of the drawing]

FIG. 1 is a sectional view of a conventional example, FIG. 2 is a sectional view of one embodiment of a solid-state imaging device according to the present invention, and FIG. 3 is a sectional view M of another embodiment. 4. Silver solder, 6. Salary/pellet, 7. Package 8. Qe hole, 9. Φ-. Sleeve. Agent Patent Attorney Toshikushi Usuda

Claims (1)

[Claims] 1. A solid-state imaging device, characterized in that a package made of ceramic has holes at both ends, and a member having a reference hole for positioning a pellet is dug into the hole.