JPS58100479U - High speed switching element module - Google Patents

High speed switching element module

Info

Publication number
JPS58100479U
JPS58100479U JP19530181U JP19530181U JPS58100479U JP S58100479 U JPS58100479 U JP S58100479U JP 19530181 U JP19530181 U JP 19530181U JP 19530181 U JP19530181 U JP 19530181U JP S58100479 U JPS58100479 U JP S58100479U
Authority
JP
Japan
Prior art keywords
switching element
speed switching
printed wiring
wiring board
attached
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP19530181U
Other languages
Japanese (ja)
Other versions
JPS6345833Y2 (en
Inventor
長倉　哲雄
竹友　雅寛
Original Assignee
株式会社明電舎
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社明電舎 filed Critical 株式会社明電舎
Priority to JP19530181U priority Critical patent/JPS58100479U/en
Publication of JPS58100479U publication Critical patent/JPS58100479U/en
Application granted granted Critical
Publication of JPS6345833Y2 publication Critical patent/JPS6345833Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Rectifiers (AREA)
  • Power Conversion In General (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は高速スイッチング素子モジュールの回路−成例
を示す接続図、第２図及び第３図は高速増スイッチング
素子モジュールの従来構造を示す平面図及び側面図、第
４図は本考案に係る高速スイッチング素子モジュールの
一実施例を示す平面図、第５図は同正面図、第６図及び
第７図は同左右の側面図である。 １・・・・・・ＧＴＯ１２・・・・・・スナバダイオー
ド、３・・・・・・スナバコンデンサ、４・・・・・・
ドライブ回路、１１Ａ及びＩＩＢ・・・・・・平板形ヒ
ートパイプ、１５・・・・・・主回路基板、１７・・・
・・・ドライブ回路用印刷配線板、１会Ａ及び１９Ｂ・
曲・冷却フィン、２ｏ・パ・・・主回路コネクタ。Fig. 1 is a connection diagram showing a circuit example of a high-speed switching element module, Figs. 2 and 3 are a plan view and a side view showing the conventional structure of a high-speed switching element module, and Fig. 4 is a diagram according to the present invention. A plan view showing one embodiment of the high-speed switching element module, FIG. 5 is a front view of the same, and FIGS. 6 and 7 are left and right side views of the same. 1...GTO12...Snubber diode, 3...Snubber capacitor, 4...
Drive circuit, 11A and IIB... Flat heat pipe, 15... Main circuit board, 17...
...Printed wiring board for drive circuit, 1st A and 19B・
Bent/cooling fin, 2o/pa...main circuit connector.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 一対の平板形ヒートパイプの間に平形の高速スイッチン
グ素子を押圧挾持するとともに、前記高速スイッチング
素子が挿通される貫通孔を有し、かつ少なくともスナバ
回路と前記ス箔ンチング素子とを結ぶ印刷配線が表裏両
面に平行導体となるように形成された主回路印刷配線板
を前記平板形ヒートパイプの一端が突出するようその一
方の内面側に固定し、この主回路印刷配線板にスナバコ
ンデンサを、前記ヒートパイプにスナバダイオードをそ
れぞれ取付け、また前記主回路印刷配線板にゲートドラ
イブ回路を一体化する一方、前記ヒートパイプの突出部
分に冷却フィンを取付け、この突出部のみ風胴内に位置
させたことを特徴とする高速スイッチング素子モジュー
ル。A flat high-speed switching element is pressed between a pair of flat heat pipes, and has a through hole through which the high-speed switching element is inserted, and has a printed wiring connecting at least a snubber circuit and the foil pinching element. A main circuit printed wiring board formed to have parallel conductors on both the front and back sides is fixed to the inner surface of one of the flat heat pipes so that one end of the flat heat pipe protrudes, and a snubber capacitor is attached to the main circuit printed wiring board. A snubber diode is attached to each of the heat pipes, and a gate drive circuit is integrated into the main circuit printed wiring board, while a cooling fin is attached to a protruding portion of the heat pipe, and only this protruding portion is located within the wind barrel. A high-speed switching element module featuring:
JP19530181U 1981-12-25 1981-12-25 High speed switching element module Granted JPS58100479U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19530181U JPS58100479U (en) 1981-12-25 1981-12-25 High speed switching element module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19530181U JPS58100479U (en) 1981-12-25 1981-12-25 High speed switching element module

Publications (2)

Publication Number Publication Date
JPS58100479U true JPS58100479U (en) 1983-07-08
JPS6345833Y2 JPS6345833Y2 (en) 1988-11-29

Family

ID=30108581

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19530181U Granted JPS58100479U (en) 1981-12-25 1981-12-25 High speed switching element module

Country Status (1)

Country Link
JP (1) JPS58100479U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010278108A (en) * 2009-05-27 2010-12-09 Toyota Motor Corp Cooling structure of semiconductor element

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010278108A (en) * 2009-05-27 2010-12-09 Toyota Motor Corp Cooling structure of semiconductor element

Also Published As

Publication number Publication date
JPS6345833Y2 (en) 1988-11-29

Similar Documents

Publication Publication Date Title
JPS58100479U (en) High speed switching element module
JPS598106U (en) Optical sensor mounting structure
JPS58180692U (en) printed board
JPS6022841U (en) radiator
JPS5825051U (en) lead pin
JPS5877084U (en) circuit board
JPS59135645U (en) Mounting structure of heat sink and power transistor
JPS60111095U (en) Cooling structure for electronic components
JPS58103476U (en) contact
JPS5945955U (en) Printed circuit board bonding device
JPS614491U (en) Heat sink for electronic components
JPS5827866U (en) printed wiring board
JPS6013749U (en) Heat dissipation structure of high frequency studless transistor
JPS59109192U (en) Printed board unit heat dissipation structure
JPS58131653U (en) printed board
JPS60172365U (en) Printed circuit board wiring structure
JPS6061740U (en) Hybrid integrated circuit device
JPS58133938U (en) transistor mounting device
JPS5978660U (en) Printed circuit board connection device
JPS5850776U (en) circuit connection structure
JPS60179068U (en) power converter
JPS6054396U (en) Heat dissipation structure of electronic equipment
JPS606267U (en) connection device
JPS585366U (en) Circuit connection piece for printed wiring board
JPS60149138U (en) semiconductor