JPS58131653U - printed board - Google Patents

printed board

Info

Publication number
JPS58131653U
JPS58131653U JP2815782U JP2815782U JPS58131653U JP S58131653 U JPS58131653 U JP S58131653U JP 2815782 U JP2815782 U JP 2815782U JP 2815782 U JP2815782 U JP 2815782U JP S58131653 U JPS58131653 U JP S58131653U
Authority
JP
Japan
Prior art keywords
printed board
hole diameter
connection holes
back side
ics
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2815782U
Other languages
Japanese (ja)
Inventor
博 阿部
淳 荒井
竹「淵」　秀光
Original Assignee
株式会社明電舎
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社明電舎 filed Critical 株式会社明電舎
Priority to JP2815782U priority Critical patent/JPS58131653U/en
Publication of JPS58131653U publication Critical patent/JPS58131653U/en
Pending legal-status Critical Current

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Landscapes

  • Structure Of Printed Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図、および第２図は従来技術におけるプリント板の
冷却構造の側断面図、第３図はこの考案に係るプリント
板の要部の側断面図、第４図はこの考案に係るプリント
板に電子部品を取付けた状態を示す側断面図、第５図は
この考案の要部のハンダ付は作業状態を示す断面図、第
６図はこの考案に係るプリント板に放熱板を接合した状
態を示す側断面図である。 １・・・電子部品、１ａ・・・リード線、８・・・接続
孔、ｄｌ・・・裏面側の大径部、ｄ２・・・裏面側の小
径部。1 and 2 are side sectional views of a cooling structure for a printed board according to the prior art, FIG. 3 is a side sectional view of the main parts of a printed board according to this invention, and FIG. 4 is a printed board according to this invention. Figure 5 is a cross-sectional view showing the state in which the main parts of this invention are soldered, and Figure 6 is a side sectional view showing the state in which the heat sink is joined to the printed board according to this invention. FIG. DESCRIPTION OF SYMBOLS 1... Electronic component, 1a... Lead wire, 8... Connection hole, dl... Large diameter part on the back side, d2... Small diameter part on the back side.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ＩＣ等の電子部品のリード線を挿通するための複数の接
続孔を有するプリント板において、前記接続孔を、プリ
ント板裏面側の孔径寸法がプリント板表面側の孔径寸法
よりも大径となるように円錐形状に形成して設けたこと
を特徴とするプリント板。In a printed board having a plurality of connection holes for inserting lead wires of electronic components such as ICs, the connection holes are made such that the hole diameter on the back side of the printed board is larger than the hole diameter on the front side of the printed board. A printed board characterized by being formed into a conical shape.
JP2815782U 1982-02-26 1982-02-26 printed board Pending JPS58131653U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2815782U JPS58131653U (en) 1982-02-26 1982-02-26 printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2815782U JPS58131653U (en) 1982-02-26 1982-02-26 printed board

Publications (1)

Publication Number Publication Date
JPS58131653U true JPS58131653U (en) 1983-09-05

Family

ID=30040019

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2815782U Pending JPS58131653U (en) 1982-02-26 1982-02-26 printed board

Country Status (1)

Country Link
JP (1) JPS58131653U (en)

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