JPS5797686A - Light emitting element pellet - Google Patents

Light emitting element pellet

Info

Publication number
JPS5797686A
JPS5797686A JP17421580A JP17421580A JPS5797686A JP S5797686 A JPS5797686 A JP S5797686A JP 17421580 A JP17421580 A JP 17421580A JP 17421580 A JP17421580 A JP 17421580A JP S5797686 A JPS5797686 A JP S5797686A
Authority
JP
Japan
Prior art keywords
wafer
film
light emitting
emitting element
roughing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17421580A
Other languages
Japanese (ja)
Inventor
Kazuo Kiyohashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP17421580A priority Critical patent/JPS5797686A/en
Publication of JPS5797686A publication Critical patent/JPS5797686A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005Processes
    • H01L33/0062Processes for devices with an active region comprising only III-V compounds

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Led Devices (AREA)

Abstract

PURPOSE:To facilitate the pattern recognition of a light emitting element pellet used for an automatic recognition bonder by roughing the main surface of a semiconductor material of the part for disturbing the pattern recognition of a bonding pad to lower the reflectivity. CONSTITUTION:A P-N junction is formed by liquid epitaxial growth on an N type semiconductor substrate on a gallium phosphide wafer 4, a silicon oxidized film is coated on the wafer 4, only circular oxidized film 3 remains by a photoresist method, the wafer 4 is then boiled with hydrochloric acid for 2-3 min to remove the part covered with the film 3, thereby roughing the crystalline surface. Then, the film 3 is removed, zinc is diffused in the wafer 4 to enhance the surface density, aluminum is deposited, is heat treated, and pattern is formed as P type side electrodes 2, 2'. At this time the size of the circular electrode 2 is formed with the same size as the film 3. Then, the back surface of the wafer 4 is surface-treated to form an N type side ohmic contact.
JP17421580A 1980-12-10 1980-12-10 Light emitting element pellet Pending JPS5797686A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17421580A JPS5797686A (en) 1980-12-10 1980-12-10 Light emitting element pellet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17421580A JPS5797686A (en) 1980-12-10 1980-12-10 Light emitting element pellet

Publications (1)

Publication Number Publication Date
JPS5797686A true JPS5797686A (en) 1982-06-17

Family

ID=15974733

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17421580A Pending JPS5797686A (en) 1980-12-10 1980-12-10 Light emitting element pellet

Country Status (1)

Country Link
JP (1) JPS5797686A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6395260U (en) * 1986-12-11 1988-06-20
US5053850A (en) * 1988-03-14 1991-10-01 Motorola, Inc. Bonding pad for semiconductor devices
US5309001A (en) * 1991-11-25 1994-05-03 Sharp Kabushiki Kaisha Light-emitting diode having a surface electrode of a tree-like form
US6872649B2 (en) 1999-04-15 2005-03-29 Sumitomo Electric Industries, Ltd. Method of manufacturing transparent conductor film and compound semiconductor light-emitting device with the film
CN100449805C (en) * 2006-11-08 2009-01-07 吴质朴 AlGaInP compound semiconductor luminant and its making method
CN102214625A (en) * 2010-04-01 2011-10-12 华上光电股份有限公司 Semiconductor wafer electrode structure and manufacturing method thereof

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6395260U (en) * 1986-12-11 1988-06-20
US5053850A (en) * 1988-03-14 1991-10-01 Motorola, Inc. Bonding pad for semiconductor devices
US5309001A (en) * 1991-11-25 1994-05-03 Sharp Kabushiki Kaisha Light-emitting diode having a surface electrode of a tree-like form
US6872649B2 (en) 1999-04-15 2005-03-29 Sumitomo Electric Industries, Ltd. Method of manufacturing transparent conductor film and compound semiconductor light-emitting device with the film
US6876003B1 (en) 1999-04-15 2005-04-05 Sumitomo Electric Industries, Ltd. Semiconductor light-emitting device, method of manufacturing transparent conductor film and method of manufacturing compound semiconductor light-emitting device
CN100449805C (en) * 2006-11-08 2009-01-07 吴质朴 AlGaInP compound semiconductor luminant and its making method
CN102214625A (en) * 2010-04-01 2011-10-12 华上光电股份有限公司 Semiconductor wafer electrode structure and manufacturing method thereof

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