JPS5796538A - Processing method for component parts of semiconductor device - Google Patents

Processing method for component parts of semiconductor device

Info

Publication number
JPS5796538A
JPS5796538A JP55172084A JP17208480A JPS5796538A JP S5796538 A JPS5796538 A JP S5796538A JP 55172084 A JP55172084 A JP 55172084A JP 17208480 A JP17208480 A JP 17208480A JP S5796538 A JPS5796538 A JP S5796538A
Authority
JP
Japan
Prior art keywords
lead frame
processing surface
processing
apertures
surface plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP55172084A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0231498B2 (enExample
Inventor
Shigeru Takami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP55172084A priority Critical patent/JPS5796538A/ja
Publication of JPS5796538A publication Critical patent/JPS5796538A/ja
Publication of JPH0231498B2 publication Critical patent/JPH0231498B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W95/00—

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP55172084A 1980-12-08 1980-12-08 Processing method for component parts of semiconductor device Granted JPS5796538A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55172084A JPS5796538A (en) 1980-12-08 1980-12-08 Processing method for component parts of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55172084A JPS5796538A (en) 1980-12-08 1980-12-08 Processing method for component parts of semiconductor device

Publications (2)

Publication Number Publication Date
JPS5796538A true JPS5796538A (en) 1982-06-15
JPH0231498B2 JPH0231498B2 (enExample) 1990-07-13

Family

ID=15935234

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55172084A Granted JPS5796538A (en) 1980-12-08 1980-12-08 Processing method for component parts of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5796538A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009267312A (ja) * 2008-04-30 2009-11-12 Mitsubishi Electric Corp 半導体装置の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5227271A (en) * 1975-08-25 1977-03-01 Nec Corp Dye bonding device
JPS5545214U (enExample) * 1978-09-14 1980-03-25
JPS56132747U (enExample) * 1980-03-05 1981-10-08

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5227271A (en) * 1975-08-25 1977-03-01 Nec Corp Dye bonding device
JPS5545214U (enExample) * 1978-09-14 1980-03-25
JPS56132747U (enExample) * 1980-03-05 1981-10-08

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009267312A (ja) * 2008-04-30 2009-11-12 Mitsubishi Electric Corp 半導体装置の製造方法

Also Published As

Publication number Publication date
JPH0231498B2 (enExample) 1990-07-13

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