JPH0231498B2 - - Google Patents

Info

Publication number
JPH0231498B2
JPH0231498B2 JP55172084A JP17208480A JPH0231498B2 JP H0231498 B2 JPH0231498 B2 JP H0231498B2 JP 55172084 A JP55172084 A JP 55172084A JP 17208480 A JP17208480 A JP 17208480A JP H0231498 B2 JPH0231498 B2 JP H0231498B2
Authority
JP
Japan
Prior art keywords
workpiece
magnetic force
lead frame
package
assembled parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP55172084A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5796538A (en
Inventor
Shigeru Takami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP55172084A priority Critical patent/JPS5796538A/ja
Publication of JPS5796538A publication Critical patent/JPS5796538A/ja
Publication of JPH0231498B2 publication Critical patent/JPH0231498B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W95/00—

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP55172084A 1980-12-08 1980-12-08 Processing method for component parts of semiconductor device Granted JPS5796538A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55172084A JPS5796538A (en) 1980-12-08 1980-12-08 Processing method for component parts of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55172084A JPS5796538A (en) 1980-12-08 1980-12-08 Processing method for component parts of semiconductor device

Publications (2)

Publication Number Publication Date
JPS5796538A JPS5796538A (en) 1982-06-15
JPH0231498B2 true JPH0231498B2 (enExample) 1990-07-13

Family

ID=15935234

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55172084A Granted JPS5796538A (en) 1980-12-08 1980-12-08 Processing method for component parts of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5796538A (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009267312A (ja) * 2008-04-30 2009-11-12 Mitsubishi Electric Corp 半導体装置の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5918861B2 (ja) * 1975-08-25 1984-05-01 日本電気株式会社 ダイボンデイング装置
JPS5749388Y2 (enExample) * 1978-09-14 1982-10-29
JPS6031262Y2 (ja) * 1980-03-05 1985-09-18 富士通株式会社 ヒ−タ−

Also Published As

Publication number Publication date
JPS5796538A (en) 1982-06-15

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