JPS5789755A - Stripping agent used for water-soluble photoresist and its use method - Google Patents
Stripping agent used for water-soluble photoresist and its use methodInfo
- Publication number
- JPS5789755A JPS5789755A JP55165264A JP16526480A JPS5789755A JP S5789755 A JPS5789755 A JP S5789755A JP 55165264 A JP55165264 A JP 55165264A JP 16526480 A JP16526480 A JP 16526480A JP S5789755 A JPS5789755 A JP S5789755A
- Authority
- JP
- Japan
- Prior art keywords
- range
- photoresist
- hexamethylphosphoramide
- water
- agent used
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
- G03F7/425—Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
PURPOSE:To strip a water-soluble photoresist, by using hexamethyl-phosphoramide. CONSTITUTION:A photoresist plate with an image formed is immersed in an aqueous solution containing hexamethylphosphoramide represented by the chemical formula (I) and further, when needed, periodate and a surfactant, and treated in 40-90 deg.C temperature range. Hexamethylphosphoramide is contained in 1-10wt% range. The action is smaller below this range, but it is not so much raised above this range. The periodate and the surfactant enhance wettability and diffusibility, shorten the treatment time, and reduce an amount of hexamethylphosphoramide to be used. The photoresist may be removed by coating this solution and rubbing it with a brush, but the immersion method is much easier. This solution does not corrode a metal, and its operation is out of danger.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55165264A JPS5789755A (en) | 1980-11-26 | 1980-11-26 | Stripping agent used for water-soluble photoresist and its use method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55165264A JPS5789755A (en) | 1980-11-26 | 1980-11-26 | Stripping agent used for water-soluble photoresist and its use method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5789755A true JPS5789755A (en) | 1982-06-04 |
JPS6310823B2 JPS6310823B2 (en) | 1988-03-09 |
Family
ID=15809019
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP55165264A Granted JPS5789755A (en) | 1980-11-26 | 1980-11-26 | Stripping agent used for water-soluble photoresist and its use method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5789755A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61124589A (en) * | 1984-11-17 | 1986-06-12 | Daikin Ind Ltd | Composition for etching agent |
-
1980
- 1980-11-26 JP JP55165264A patent/JPS5789755A/en active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61124589A (en) * | 1984-11-17 | 1986-06-12 | Daikin Ind Ltd | Composition for etching agent |
Also Published As
Publication number | Publication date |
---|---|
JPS6310823B2 (en) | 1988-03-09 |
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