JPS5789234A - Positioning mechanism for lead frame - Google Patents
Positioning mechanism for lead frameInfo
- Publication number
- JPS5789234A JPS5789234A JP16558580A JP16558580A JPS5789234A JP S5789234 A JPS5789234 A JP S5789234A JP 16558580 A JP16558580 A JP 16558580A JP 16558580 A JP16558580 A JP 16558580A JP S5789234 A JPS5789234 A JP S5789234A
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- magazine
- pushing plate
- rear end
- positioning mechanism
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Sheets, Magazines, And Separation Thereof (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16558580A JPS5789234A (en) | 1980-11-25 | 1980-11-25 | Positioning mechanism for lead frame |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16558580A JPS5789234A (en) | 1980-11-25 | 1980-11-25 | Positioning mechanism for lead frame |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5789234A true JPS5789234A (en) | 1982-06-03 |
JPS627698B2 JPS627698B2 (ja) | 1987-02-18 |
Family
ID=15815145
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16558580A Granted JPS5789234A (en) | 1980-11-25 | 1980-11-25 | Positioning mechanism for lead frame |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5789234A (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5966198A (ja) * | 1982-10-08 | 1984-04-14 | 株式会社日立製作所 | マガジンの連続供給方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5238391A (en) * | 1975-09-16 | 1977-03-24 | Sanmei Enjiniyaringu Kk | Method of squid angling |
JPS5467976A (en) * | 1977-11-08 | 1979-05-31 | Toshiba Seiki Kk | Apparatus for supplying and receiving article |
JPS5599739A (en) * | 1979-01-26 | 1980-07-30 | Hitachi Ltd | Wafer treating method and its equipment |
-
1980
- 1980-11-25 JP JP16558580A patent/JPS5789234A/ja active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5238391A (en) * | 1975-09-16 | 1977-03-24 | Sanmei Enjiniyaringu Kk | Method of squid angling |
JPS5467976A (en) * | 1977-11-08 | 1979-05-31 | Toshiba Seiki Kk | Apparatus for supplying and receiving article |
JPS5599739A (en) * | 1979-01-26 | 1980-07-30 | Hitachi Ltd | Wafer treating method and its equipment |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5966198A (ja) * | 1982-10-08 | 1984-04-14 | 株式会社日立製作所 | マガジンの連続供給方法 |
Also Published As
Publication number | Publication date |
---|---|
JPS627698B2 (ja) | 1987-02-18 |
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