JPS55133543A - Multiple type mechanical chuck - Google Patents

Multiple type mechanical chuck

Info

Publication number
JPS55133543A
JPS55133543A JP4014079A JP4014079A JPS55133543A JP S55133543 A JPS55133543 A JP S55133543A JP 4014079 A JP4014079 A JP 4014079A JP 4014079 A JP4014079 A JP 4014079A JP S55133543 A JPS55133543 A JP S55133543A
Authority
JP
Japan
Prior art keywords
chuck
pushing rod
working substance
substrate
chuck plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4014079A
Other languages
Japanese (ja)
Other versions
JPS6122463B2 (en
Inventor
Yasuhiro Honda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Watch Co Ltd
Original Assignee
Citizen Watch Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Citizen Watch Co Ltd filed Critical Citizen Watch Co Ltd
Priority to JP4014079A priority Critical patent/JPS55133543A/en
Publication of JPS55133543A publication Critical patent/JPS55133543A/en
Publication of JPS6122463B2 publication Critical patent/JPS6122463B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Automatic Assembly (AREA)
  • Manipulator (AREA)

Abstract

PURPOSE:To have a reliable retention, sliding and adhesion of a part by adopting a chuck consisted of a pair of spring plates and a mechanical structure consisted of a working substance with a pushing rod used as a chuck mechanism which supplies an electronic part such as an IC or the like upon a substrate. CONSTITUTION:A chuck unit 5 is fixed to the required position of the frame body 4 having a penetrated hole of matrix form, from upside of which a working substance 6 with a pushing rod 13 is installed so as to allow an up-and-down movement. A tapered section 14 is provided with a pushing rod 13, and a chuck plate 10 is pushed open when the working substance 6 is lowered. When sliding the part 2, first the chuck plate 10 is pushed open and whole the device is lowered to the position of the part 2. Then the working substance 6 is lifted, the chuck plate 10 is closed and the part 2 is retained. After the part 2 is moved to the desired position on the substrate, the above-mentioned operation is performed in the wrong order, and the part 2 placed on the substrate is pushed down by the pushing rod and the bonding is completed.
JP4014079A 1979-04-03 1979-04-03 Multiple type mechanical chuck Granted JPS55133543A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4014079A JPS55133543A (en) 1979-04-03 1979-04-03 Multiple type mechanical chuck

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4014079A JPS55133543A (en) 1979-04-03 1979-04-03 Multiple type mechanical chuck

Publications (2)

Publication Number Publication Date
JPS55133543A true JPS55133543A (en) 1980-10-17
JPS6122463B2 JPS6122463B2 (en) 1986-05-31

Family

ID=12572467

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4014079A Granted JPS55133543A (en) 1979-04-03 1979-04-03 Multiple type mechanical chuck

Country Status (1)

Country Link
JP (1) JPS55133543A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61154627U (en) * 1985-03-14 1986-09-25
JPS6374223U (en) * 1986-10-31 1988-05-18
DE10036081A1 (en) * 2000-06-09 2001-12-20 Georg Rudolf Sillner Device for centering of components, such as small electrical components and for the manufacture of SMDs, has component to be centered brought against one centering surface
CN102371588A (en) * 2010-08-25 2012-03-14 鸿富锦精密工业（深圳）有限公司 Clamping mechanism

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61154627U (en) * 1985-03-14 1986-09-25
JPS6374223U (en) * 1986-10-31 1988-05-18
DE10036081A1 (en) * 2000-06-09 2001-12-20 Georg Rudolf Sillner Device for centering of components, such as small electrical components and for the manufacture of SMDs, has component to be centered brought against one centering surface
DE10036081B4 (en) * 2000-06-09 2005-03-10 Georg Rudolf Sillner Device for centering components and their use in a production line or machine, for example back-end line machine
CN102371588A (en) * 2010-08-25 2012-03-14 鸿富锦精密工业（深圳）有限公司 Clamping mechanism

Also Published As

Publication number Publication date
JPS6122463B2 (en) 1986-05-31

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