JPS5789234A - Positioning mechanism for lead frame - Google Patents

Positioning mechanism for lead frame

Info

Publication number
JPS5789234A
JPS5789234A JP16558580A JP16558580A JPS5789234A JP S5789234 A JPS5789234 A JP S5789234A JP 16558580 A JP16558580 A JP 16558580A JP 16558580 A JP16558580 A JP 16558580A JP S5789234 A JPS5789234 A JP S5789234A
Authority
JP
Japan
Prior art keywords
lead frame
magazine
pushing plate
rear end
positioning mechanism
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16558580A
Other languages
English (en)
Japanese (ja)
Other versions
JPS627698B2 (enFirst
Inventor
Hiroshi Ushiki
Hisaaki Kojima
Masao Yamazaki
Masashi Nishizaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Sharp Corp
Original Assignee
Shinkawa Ltd
Sharp Corp
Shinkawa Seisakusho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd, Sharp Corp, Shinkawa Seisakusho Co Ltd filed Critical Shinkawa Ltd
Priority to JP16558580A priority Critical patent/JPS5789234A/ja
Publication of JPS5789234A publication Critical patent/JPS5789234A/ja
Publication of JPS627698B2 publication Critical patent/JPS627698B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
  • Sheets, Magazines, And Separation Thereof (AREA)
JP16558580A 1980-11-25 1980-11-25 Positioning mechanism for lead frame Granted JPS5789234A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16558580A JPS5789234A (en) 1980-11-25 1980-11-25 Positioning mechanism for lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16558580A JPS5789234A (en) 1980-11-25 1980-11-25 Positioning mechanism for lead frame

Publications (2)

Publication Number Publication Date
JPS5789234A true JPS5789234A (en) 1982-06-03
JPS627698B2 JPS627698B2 (enFirst) 1987-02-18

Family

ID=15815145

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16558580A Granted JPS5789234A (en) 1980-11-25 1980-11-25 Positioning mechanism for lead frame

Country Status (1)

Country Link
JP (1) JPS5789234A (enFirst)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5966198A (ja) * 1982-10-08 1984-04-14 株式会社日立製作所 マガジンの連続供給方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5238391A (en) * 1975-09-16 1977-03-24 Sanmei Enjiniyaringu Kk Method of squid angling
JPS5467976A (en) * 1977-11-08 1979-05-31 Toshiba Seiki Kk Apparatus for supplying and receiving article
JPS5599739A (en) * 1979-01-26 1980-07-30 Hitachi Ltd Wafer treating method and its equipment

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5238391A (en) * 1975-09-16 1977-03-24 Sanmei Enjiniyaringu Kk Method of squid angling
JPS5467976A (en) * 1977-11-08 1979-05-31 Toshiba Seiki Kk Apparatus for supplying and receiving article
JPS5599739A (en) * 1979-01-26 1980-07-30 Hitachi Ltd Wafer treating method and its equipment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5966198A (ja) * 1982-10-08 1984-04-14 株式会社日立製作所 マガジンの連続供給方法

Also Published As

Publication number Publication date
JPS627698B2 (enFirst) 1987-02-18

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