JPS5785977A - Etching device - Google Patents

Etching device

Info

Publication number
JPS5785977A
JPS5785977A JP16141880A JP16141880A JPS5785977A JP S5785977 A JPS5785977 A JP S5785977A JP 16141880 A JP16141880 A JP 16141880A JP 16141880 A JP16141880 A JP 16141880A JP S5785977 A JPS5785977 A JP S5785977A
Authority
JP
Japan
Prior art keywords
etching
nozzle
sprayed
chamber
defectives
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16141880A
Other languages
Japanese (ja)
Inventor
Masatoshi Oota
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ricoh Co Ltd
Original Assignee
Ricoh Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ricoh Co Ltd filed Critical Ricoh Co Ltd
Priority to JP16141880A priority Critical patent/JPS5785977A/en
Publication of JPS5785977A publication Critical patent/JPS5785977A/en
Pending legal-status Critical Current

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  • ing And Chemical Polishing (AREA)

Abstract

PURPOSE: To improve the yield of products and eliminate the waste of working defectives down to the final process by feeding substrates to be etched to the 2nd working chamber through etching and rinsing chambers and inspecting chambers by means of a belt conveyor.
CONSTITUTION: Substrates 5 are fed to the 1st etching chamber 1 by a belt conveyor 4, and are etched by the etching soln. sprayed from a spray nozzle 6. Thence, they are washed by the water sprayed from a spray nozzle 7. These substrates enter an inspecting chamber 2, where they are dried by gaseous N2 or the like from a nozzle 8, after which they are inspected by microscopes or ITV devices 9, 10. When a defective place is discovered, the etching soln. is sprayed from the nozzle 6 in the 2nd etching chamber 3 by button operation or the like whereby additional etching is applied. Thence, the resist is removed from the substrate by a release agent sprayed from a nozzle 11. The non-defectives are stripped of the resist as they are and are fed to the next stage. The defectives having disconnections or over-etching are recovered after the removal of the resist.
COPYRIGHT: (C)1982,JPO&Japio
JP16141880A 1980-11-18 1980-11-18 Etching device Pending JPS5785977A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16141880A JPS5785977A (en) 1980-11-18 1980-11-18 Etching device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16141880A JPS5785977A (en) 1980-11-18 1980-11-18 Etching device

Publications (1)

Publication Number Publication Date
JPS5785977A true JPS5785977A (en) 1982-05-28

Family

ID=15734715

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16141880A Pending JPS5785977A (en) 1980-11-18 1980-11-18 Etching device

Country Status (1)

Country Link
JP (1) JPS5785977A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0836370A1 (en) * 1996-10-08 1998-04-15 Takanori Tsubaki Method and system for etching substrates for printed circuit boards

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0836370A1 (en) * 1996-10-08 1998-04-15 Takanori Tsubaki Method and system for etching substrates for printed circuit boards

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