JPS578234A - Heat-sealable resin composition - Google Patents

Heat-sealable resin composition

Info

Publication number
JPS578234A
JPS578234A JP8091380A JP8091380A JPS578234A JP S578234 A JPS578234 A JP S578234A JP 8091380 A JP8091380 A JP 8091380A JP 8091380 A JP8091380 A JP 8091380A JP S578234 A JPS578234 A JP S578234A
Authority
JP
Japan
Prior art keywords
ethylene
copolymer
resin
heat
polyethylene
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8091380A
Other languages
Japanese (ja)
Other versions
JPS631982B2 (en
Inventor
Mikio Katagiri
Yoshinari Hironaka
Nobutake Yamada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Polychemicals Co Ltd
Dow Mitsui Polychemicals Co Ltd
Original Assignee
Du Pont Mitsui Polychemicals Co Ltd
Mitsui Polychemicals Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Du Pont Mitsui Polychemicals Co Ltd, Mitsui Polychemicals Co Ltd filed Critical Du Pont Mitsui Polychemicals Co Ltd
Priority to JP8091380A priority Critical patent/JPS578234A/en
Publication of JPS578234A publication Critical patent/JPS578234A/en
Publication of JPS631982B2 publication Critical patent/JPS631982B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

PURPOSE: To provide a heat-sealable resin compsn. which can assure sealing strength and protection of its contents as well as easy openability and the good appearance of the opening part, by blending a specified ethylene copolymer, a tackifying resin and a specified additive together.
CONSTITUTION: 15W80wt% Ethylene-α,β-unsaturated carboxylic acid copolymer or neutralized metal salt thereof (A), 10W80wt% at least one resin (B) selected from polyethylene, an ethylene-α-olefin copolymer, an ethylene-vinyl ester copolymer and an ethylene-α,β-unsaturated carboxylic acid ester copolymer, 3W 30wt% tackifying resin (C), and 300ppmW10wt% at least one additive (D) selected from a fatty acid amide, a fatty acid bisamide, polyethylene glycol, hydrogenated castor oil, polyethylene wax and silica, are melt-mixed together to produce a resin compsn. having a melt index of 1W400g/10min.
COPYRIGHT: (C)1982,JPO&Japio
JP8091380A 1980-06-17 1980-06-17 Heat-sealable resin composition Granted JPS578234A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8091380A JPS578234A (en) 1980-06-17 1980-06-17 Heat-sealable resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8091380A JPS578234A (en) 1980-06-17 1980-06-17 Heat-sealable resin composition

Publications (2)

Publication Number Publication Date
JPS578234A true JPS578234A (en) 1982-01-16
JPS631982B2 JPS631982B2 (en) 1988-01-14

Family

ID=13731622

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8091380A Granted JPS578234A (en) 1980-06-17 1980-06-17 Heat-sealable resin composition

Country Status (1)

Country Link
JP (1) JPS578234A (en)

Cited By (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6051768A (en) * 1983-08-31 1985-03-23 Du Pont Mitsui Polychem Co Ltd Hot-melt adhesive composition
JPS6071653A (en) * 1983-08-22 1985-04-23 イ−・アイ・デユポン・デ・ニモアス・アンド・カンパニ− Blend of ionomer and propylene copolymer
JPS60239238A (en) * 1984-05-11 1985-11-28 呉羽化学工業株式会社 Multilayer packaging material
JPS61183371A (en) * 1985-02-12 1986-08-16 Toyo Soda Mfg Co Ltd Heat-sealable resin composition
JPS6264879A (en) * 1985-09-18 1987-03-23 Toppan Printing Co Ltd Heat-sealable coating agent
EP0256467A2 (en) * 1986-08-18 1988-02-24 Henkel Kommanditgesellschaft auf Aktien Low molecular weight polycondensates and their use in aqueous adhesive dispersions
US4751262A (en) * 1985-09-03 1988-06-14 The Dow Chemical Company Ethylene-acrylic acid type interpolymer compositions and films having increased slip and reduced block
US4897437A (en) * 1985-09-03 1990-01-30 The Dow Chemical Company Ethylene-acrylic acid type interpolymer compositions and films having increased slip and reduced block
JPH06157840A (en) * 1992-11-30 1994-06-07 Showa Denko Kk Heat-sealable resin composition
US5382615A (en) * 1993-10-01 1995-01-17 Eastman Chemical Company Modified polyethylene based hot-melt adhesives for use in packaging
JPH07500627A (en) * 1992-03-13 1995-01-19 アライド−シグナル・インコーポレーテッド Improved hot melt adhesive compositions containing low molecular weight ethylene copolymers
JP2001131532A (en) * 1999-11-05 2001-05-15 Mitsubishi Chemicals Corp Sealant composition having easy peeling off property and easy seal-openable container
JP2001214009A (en) * 2000-02-01 2001-08-07 Du Pont Mitsui Polychem Co Ltd Polymer composition and readily unsealable sealing material using the same
JP2002097321A (en) * 2000-09-22 2002-04-02 Du Pont Mitsui Polychem Co Ltd Polyethylene-based resin composition
JP2002226642A (en) * 2001-02-01 2002-08-14 Tohcello Co Ltd Thermoplastic resin composition and sealing material using the same
JP2002317080A (en) * 2002-04-01 2002-10-31 Showa Denko Kk Resin composition having heat-sealing property
JP2005036067A (en) * 2003-07-17 2005-02-10 Tosoh Corp Hot-melt adhesive
JP2005187744A (en) * 2003-12-26 2005-07-14 Du Pont Mitsui Polychem Co Ltd Resin composition and laminate
JP2006131882A (en) * 2004-10-06 2006-05-25 Unitika Ltd Aqueous dispersion, coated film and laminated product
JP2007084691A (en) * 2005-09-22 2007-04-05 Du Pont Mitsui Polychem Co Ltd Resin composition and laminate
JP2007514852A (en) * 2003-12-16 2007-06-07 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー Heat seal modifier for linear polyethylene
JP2008063539A (en) * 2006-09-11 2008-03-21 Du Pont Mitsui Polychem Co Ltd Thermoplastic resin composition and use thereof
JP2008095044A (en) * 2006-10-16 2008-04-24 Du Pont Mitsui Polychem Co Ltd Resin composition for sealing material
JP2008208349A (en) * 2007-01-29 2008-09-11 Kuraray Co Ltd Polymer composition and molded article obtained therefrom
JP2008208361A (en) * 2007-02-01 2008-09-11 Kuraray Co Ltd Polymer composition and molded article obtained therefrom
JP2009138196A (en) * 2007-12-04 2009-06-25 Sika Technology Ag Hot melt adhesive with good adhesion to polyolefin
JP2009209202A (en) * 2008-02-29 2009-09-17 Du Pont Mitsui Polychem Co Ltd Sealant for polylactic acid resin, laminate having the sealant layer, cover and polylactic acid resin container sealed with the sealant
WO2011152324A1 (en) * 2010-06-02 2011-12-08 三井・デュポンポリケミカル株式会社 Resin composition, heat-sealable film, and laminated film
JP2012136225A (en) * 2010-12-24 2012-07-19 Showa Denko Packaging Co Ltd Content adhesion preventing cover member
JP2012153430A (en) * 2011-01-28 2012-08-16 Showa Denko Packaging Co Ltd Content sticking preventive lid material
JP2012171668A (en) * 2011-02-23 2012-09-10 Showa Denko Packaging Co Ltd Heat seal container for packaging
JP5049122B2 (en) * 2005-05-31 2012-10-17 三井・デュポンポリケミカル株式会社 Resin composition, film or sheet or laminate comprising resin composition
JP2012206731A (en) * 2011-03-29 2012-10-25 Showa Denko Packaging Co Ltd Lid material for preventing content adhesion
JP2012250776A (en) * 2012-09-27 2012-12-20 Showa Denko Packaging Co Ltd Content sticking preventive lid material

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02256985A (en) * 1989-03-29 1990-10-17 Sanwa Tekki Corp Leaf spring hanger
JP5705657B2 (en) * 2011-06-01 2015-04-22 昭和電工パッケージング株式会社 Content adhesion prevention lid

Cited By (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6071653A (en) * 1983-08-22 1985-04-23 イ−・アイ・デユポン・デ・ニモアス・アンド・カンパニ− Blend of ionomer and propylene copolymer
JPH0149382B2 (en) * 1983-08-22 1989-10-24 Ii Ai Deyuhon De Nimoasu Ando Co
JPS6051768A (en) * 1983-08-31 1985-03-23 Du Pont Mitsui Polychem Co Ltd Hot-melt adhesive composition
JPH0144222B2 (en) * 1983-08-31 1989-09-26 Mitsui Du Pont Polychemical
JPH049142B2 (en) * 1984-05-11 1992-02-19
JPS60239238A (en) * 1984-05-11 1985-11-28 呉羽化学工業株式会社 Multilayer packaging material
JPS61183371A (en) * 1985-02-12 1986-08-16 Toyo Soda Mfg Co Ltd Heat-sealable resin composition
US4751262A (en) * 1985-09-03 1988-06-14 The Dow Chemical Company Ethylene-acrylic acid type interpolymer compositions and films having increased slip and reduced block
US4897437A (en) * 1985-09-03 1990-01-30 The Dow Chemical Company Ethylene-acrylic acid type interpolymer compositions and films having increased slip and reduced block
JPS6264879A (en) * 1985-09-18 1987-03-23 Toppan Printing Co Ltd Heat-sealable coating agent
EP0256467A2 (en) * 1986-08-18 1988-02-24 Henkel Kommanditgesellschaft auf Aktien Low molecular weight polycondensates and their use in aqueous adhesive dispersions
JPH07500627A (en) * 1992-03-13 1995-01-19 アライド−シグナル・インコーポレーテッド Improved hot melt adhesive compositions containing low molecular weight ethylene copolymers
JPH06157840A (en) * 1992-11-30 1994-06-07 Showa Denko Kk Heat-sealable resin composition
US5382615A (en) * 1993-10-01 1995-01-17 Eastman Chemical Company Modified polyethylene based hot-melt adhesives for use in packaging
JP2001131532A (en) * 1999-11-05 2001-05-15 Mitsubishi Chemicals Corp Sealant composition having easy peeling off property and easy seal-openable container
JP2001214009A (en) * 2000-02-01 2001-08-07 Du Pont Mitsui Polychem Co Ltd Polymer composition and readily unsealable sealing material using the same
JP4526633B2 (en) * 2000-02-01 2010-08-18 三井・デュポンポリケミカル株式会社 Polymer composition and easy-open sealing material using the same
JP2002097321A (en) * 2000-09-22 2002-04-02 Du Pont Mitsui Polychem Co Ltd Polyethylene-based resin composition
JP2002226642A (en) * 2001-02-01 2002-08-14 Tohcello Co Ltd Thermoplastic resin composition and sealing material using the same
JP2002317080A (en) * 2002-04-01 2002-10-31 Showa Denko Kk Resin composition having heat-sealing property
JP2005036067A (en) * 2003-07-17 2005-02-10 Tosoh Corp Hot-melt adhesive
US7635736B2 (en) 2003-12-16 2009-12-22 E. I. Du Pont De Nemours And Company Heat seal modifiers for linear polyethylenes
AU2004298628B2 (en) * 2003-12-16 2010-05-13 E.I. Dupont De Nemours And Company Heat seal modifiers for linear polyethylenes
JP2007514852A (en) * 2003-12-16 2007-06-07 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー Heat seal modifier for linear polyethylene
JP2005187744A (en) * 2003-12-26 2005-07-14 Du Pont Mitsui Polychem Co Ltd Resin composition and laminate
JP2006131882A (en) * 2004-10-06 2006-05-25 Unitika Ltd Aqueous dispersion, coated film and laminated product
JP5049122B2 (en) * 2005-05-31 2012-10-17 三井・デュポンポリケミカル株式会社 Resin composition, film or sheet or laminate comprising resin composition
JP2007084691A (en) * 2005-09-22 2007-04-05 Du Pont Mitsui Polychem Co Ltd Resin composition and laminate
JP2008063539A (en) * 2006-09-11 2008-03-21 Du Pont Mitsui Polychem Co Ltd Thermoplastic resin composition and use thereof
JP2008095044A (en) * 2006-10-16 2008-04-24 Du Pont Mitsui Polychem Co Ltd Resin composition for sealing material
JP2008208349A (en) * 2007-01-29 2008-09-11 Kuraray Co Ltd Polymer composition and molded article obtained therefrom
JP2008208361A (en) * 2007-02-01 2008-09-11 Kuraray Co Ltd Polymer composition and molded article obtained therefrom
JP2009138196A (en) * 2007-12-04 2009-06-25 Sika Technology Ag Hot melt adhesive with good adhesion to polyolefin
JP2009209202A (en) * 2008-02-29 2009-09-17 Du Pont Mitsui Polychem Co Ltd Sealant for polylactic acid resin, laminate having the sealant layer, cover and polylactic acid resin container sealed with the sealant
WO2011152324A1 (en) * 2010-06-02 2011-12-08 三井・デュポンポリケミカル株式会社 Resin composition, heat-sealable film, and laminated film
JP4942858B2 (en) * 2010-06-02 2012-05-30 三井・デュポンポリケミカル株式会社 Resin composition, heat seal film, and laminated film
US8716405B2 (en) 2010-06-02 2014-05-06 Du Pont-Mitsui Polychemicals Co. Ltd. Resin composition, heat seal film and layered film
JP2012136225A (en) * 2010-12-24 2012-07-19 Showa Denko Packaging Co Ltd Content adhesion preventing cover member
JP2012153430A (en) * 2011-01-28 2012-08-16 Showa Denko Packaging Co Ltd Content sticking preventive lid material
JP2012171668A (en) * 2011-02-23 2012-09-10 Showa Denko Packaging Co Ltd Heat seal container for packaging
JP2012206731A (en) * 2011-03-29 2012-10-25 Showa Denko Packaging Co Ltd Lid material for preventing content adhesion
JP2012250776A (en) * 2012-09-27 2012-12-20 Showa Denko Packaging Co Ltd Content sticking preventive lid material

Also Published As

Publication number Publication date
JPS631982B2 (en) 1988-01-14

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